WO2016148175A1 - エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 - Google Patents
エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 Download PDFInfo
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- WO2016148175A1 WO2016148175A1 PCT/JP2016/058271 JP2016058271W WO2016148175A1 WO 2016148175 A1 WO2016148175 A1 WO 2016148175A1 JP 2016058271 W JP2016058271 W JP 2016058271W WO 2016148175 A1 WO2016148175 A1 WO 2016148175A1
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- 0 *c1c(*)c(*)c(*c2c(*)c(*)c(*)c(*)c2*)c(*)c1* Chemical compound *c1c(*)c(*)c(*c2c(*)c(*)c(*)c(*)c2*)c(*)c1* 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3227—Compounds containing acyclic nitrogen atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
- C08G73/026—Wholly aromatic polyamines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/20—Polysulfones
- C08G75/23—Polyethersulfones
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/046—Carbon nanorods, nanowires, nanoplatelets or nanofibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Definitions
- the present invention relates to a carbon fiber reinforced composite material and an epoxy resin composition suitably used therefor. More specifically, the present invention relates to an epoxy resin composition that provides a carbon fiber reinforced composite material having excellent mechanical properties such as tensile strength and compressive strength.
- carbon fiber reinforced composite materials (hereinafter sometimes abbreviated as composite materials) take advantage of their high specific strength and specific elastic modulus, and can be used in a wide variety of applications such as aircraft, automobiles, sports equipment, fishing equipment, wind power generation blades, and PC housings. Use is expanding to a wide range of applications.
- the shape of these structures is often a complex shape, and is often used by laminating carbon fiber reinforced fiber woven prepregs that can be made sheet-like and can be made thin while being thin.
- thermosetting resin excellent in mechanical properties, heat resistance, and processability, especially an epoxy resin composition is widely used.
- mechanical properties required for weight reduction have further increased, and further enhancement of tensile strength and compression strength, which are important properties, has been demanded.
- it is also effective to lower the crosslink density of the cured product of the epoxy resin composition (hereinafter abbreviated as cured product). is there.
- cured product crosslink density of the cured product of the epoxy resin composition
- a high elastic modulus of the cured product is effective for improving the compressive strength of the composite material.
- it is effective to increase the crosslinking density in order to improve the elastic modulus of the cured product. Therefore, coexistence of the tensile strength of the composite material and the compressive strength of the composite material has been a very difficult task.
- Patent Document 1 diaminodiphenyl sulfone, especially 3,3′-diaminodiphenyl sulfone is used as a curing agent for an epoxy resin, thereby improving the elastic modulus of the cured product.
- Patent Document 2 describes the improvement of the compressive strength of a composite material by using 3,3′-diaminodiphenylsulfone or 3,4′-diaminodiphenylsulfone to improve the elastic modulus of the cured product. There is no mention of improving the tensile strength.
- Patent Document 4 discloses an epoxy resin having a t-butylhydroquinone structure
- Patent Document 5 discloses an epoxy resin composition having a resorcinol structure.
- Patent Document 6 exemplifies a composition using a t-butylcatechol type epoxy resin as a coating resin.
- a resin composition for a composite material sufficient mechanical properties could not be obtained.
- an object of the present invention is to provide an epoxy resin composition that provides a carbon fiber reinforced composite material having excellent tensile strength and compressive strength.
- the inventors of the present invention have made extensive studies on the above-mentioned problems and clarified that such problems can be solved by mixing a specific plurality of epoxy resin components in a specific range, and have achieved the present invention.
- the epoxy resin composition of the present invention contains at least the following constituent elements [A] to [D], and the constituent element [A] is 5 to 50% by mass with respect to 100% by mass of the total amount of epoxy resin.
- B] is contained in an amount of 20 to 95% by mass.
- R 1 to R 5 and at least one of R 6 to R 10 are glycidyl ether groups, and other R 1 to R 10 are hydrogen atoms, It represents either a halogen atom or an aliphatic hydrocarbon group having 4 or less carbon atoms.
- the prepreg of the present invention is the above A carbon fiber is impregnated with an epoxy resin composition.
- the carbon fiber reinforced composite material of the present invention contains the above epoxy resin composition and carbon fiber.
- an epoxy resin composition that provides a carbon fiber reinforced composite material having excellent high tensile strength and compressive strength.
- the present invention is an epoxy resin composition containing at least the following constituent elements [A] to [D], wherein the constituent element [A] is 5 to 50% by mass and the constituent element [B ] Is an epoxy resin composition containing 20 to 95% by mass.
- epoxy resin [A] 1,2-bis (glycidyloxy) benzene, 1,3-bis (glycidyloxy) benzene, 1,4-bis (glycidyloxy) benzene, derivatives thereof, represented by the above general formula [1]
- At least one epoxy resin [B] selected from the group consisting of epoxy resins having the structure: Glycidylamine type epoxy resin [C] having three or more glycidyl groups in the molecule: heat soluble in the epoxy resin
- Plastic resin [D] Epoxy resin curing agent
- the epoxy resin [A] used in the present invention is a 1,2-bis (glycidyloxy) benzene having two or more glycidyl ether groups bonded to a benzene ring, 1, 3-bis (glycidyloxy) benzene, 1,4-bis (glycidyloxy) benzene, derivatives thereof, and the structure represented by the above general formula [1]
- 1,3-bis (glycidyloxy) benzene is a resorcinol type in which two glycidyl ether groups are in a meta-positional relationship.
- 1,4-bis (glycidyloxy) benzene is a hydroquinone type in which two glycidyl ether groups are in a para-position.
- a catechol type or a resorcinol type having a large molecular flexibility More preferably, it is a catechol type.
- a tertiary butyl (t-butyl) group or the like is preferably introduced as a substituent.
- the epoxy resin represented by the above general formula [1] has 1,2-bis (glycidyloxy) benzene, 1,3-bis (glycidyl) in which two or more glycidyl ether groups are bonded to the benzene ring.
- a catechol type having a glycidyl ether group at the ortho position of R 1 and R 6 in the ortho position relative to the oxygen atoms at both ends of the aliphatic chain connecting the two units, and glycidyl at the meta position of R 2 and R 7 examples include resorcinol-type isomers having an ether group and hydroquinone-type isomers having a glycidyl ether group at the para positions of R 3 and R 8 .
- Even a dimer is preferably a catechol type or a resorcinol type, more preferably a catechol type, from the viewpoint of the effect of improving the elastic modulus by reducing the free volume of a cured product utilizing the flexibility of molecular chains.
- the dimer since the dimer has a hydroxyl group at the inter-unit connecting portion, the interaction between the molecular chains is strong, which is more preferable for improving the elastic modulus of the cured product.
- a halogen, hydrogen, or may have an aliphatic hydrocarbon group any substituent, but when aliphatic hydrocarbon group, the other In order to maintain compatibility with the components and obtain high mechanical properties, it is preferable that the number of carbon atoms is 4 or less.
- the epoxy resin [A] can be obtained by the following manufacturing method, for example. First, epichlorohydrin and isopropyl alcohol are dissolved in dihydroxybenzenes, heated, and an aqueous sodium hydroxide solution is added dropwise. Next, the saline is separated and removed, and excess epichlorohydrin, isopropyl alcohol, and water are recovered by distillation to obtain a crude resin. Further, this is dissolved in toluene, a basic aqueous solution is added, and the mixture is heated and stirred. Thereafter, the salt and alkali produced by washing with water can be removed by oil-water separation, and toluene can be recovered by distillation through dehydration and filtration.
- epoxy resins [A] include “Epiclon (registered trademark)” HP-820 (manufactured by DIC Corporation), “Denacol (registered trademark)” Ex-201, and “Denacol (registered trademark)” Ex-203. (Nagase ChemteX Co., Ltd.), YDC-1312 (Nippon Steel & Sumikin Chemical Co., Ltd.) and the like.
- the epoxy resin [A] When the epoxy resin [A] is contained in an amount of 5 to 50% by mass, preferably 5 to 40% by mass, based on the total amount of the epoxy resin, high mechanical properties and glass transition temperature (hereinafter sometimes abbreviated as Tg) can be obtained.
- the content of the epoxy resin [A] here is 1,2-bis (glycidyloxy) benzene, 1,3-bis (glycidyloxy) benzene, 1,4-bis (glycidyloxy) benzene,
- the total content of the derivative and the epoxy resin having the structure represented by the above general formula [1] is meant.
- the epoxy resin [B] used in the present invention is a glycidylamine type epoxy resin having 3 or more glycidyl groups in the molecule. It is preferable that the number of glycidyl groups in the molecule is 3 or 4 because the mechanical properties and heat resistance of the composite material can be balanced.
- diaminodiphenylmethane, diaminodiphenylsulfone, diaminodiphenylether, xylenediamine, aminophenol, structural isomers thereof, derivatives having halogen or an alkyl substituent having 3 or less carbon atoms, and glycidylation were used as precursors. Those are preferably used.
- tetraglycidyldiaminodiphenylmethane a glycidyl compound of xylenediamine, triglycidylaminophenol, tetraglycidyldiaminodiphenylsulfone, tetraglycidyldiaminodiphenylether and the like can be mentioned.
- Examples of commercially available epoxy resin [B] include the following.
- tetraglycidyldiaminodiphenylmethane examples include “Sumiepoxy (registered trademark)” ELM434 (manufactured by Sumitomo Chemical Co., Ltd.), “ARALDITE (registered trademark)” MY720, “ARALDITE (registered trademark)” MY721, and “ALALDITE (registered). Trademarks) “MY9512”, “ARARDITE (registered trademark)” MY9612, “ARALDITE (registered trademark)” MY9634, “ARALDITE (registered trademark)” MY9663 (manufactured by Huntsman Advanced Materials).
- Examples of commercially available glycidyl compounds of xylenediamine include TETRAD-X (manufactured by Mitsubishi Gas Chemical Co., Inc.).
- ARALDITE registered trademark
- ARALDITE registered trademark
- MY0510 above, manufactured by Huntsman Advanced Materials
- jER registered trademark
- ARARDITE registered trademark
- MY0600 having" m-aminophenol "as a precursor
- ARARDITE registered trademark
- MY0610 manufactured by Huntsman Advanced Materials
- the compounding amount of the epoxy resin [B] is 20 to 95% by mass, preferably 40 to 90% by mass with respect to the total amount of the epoxy resin in order to balance the mechanical properties at a high level.
- thermoplastic resin [C] used in the present invention is a thermoplastic resin soluble in an epoxy resin, and from the viewpoint of imparting high heat resistance, Tg is preferably 200 ° C. or higher, and an aromatic ring is present in the molecule. It is preferable to have. Specifically, polyethersulfone, polyetherethersulfone, polyetherimide, polyphenylene oxide, and polysulfone are preferably used. From the viewpoint of uniform solubility during curing, polyethersulfone, polyetherimide, and polysulfone are more preferable.
- thermoplastic resin [C] As a commercially available product of the thermoplastic resin [C], as polyethersulfone, “SUMICA EXCEL (registered trademark)” PES5003P (manufactured by Sumitomo Chemical Co., Ltd.) having a hydroxyl group at the terminal or “Virantage (registered trademark)” VW10700 (Solvay) is used.
- the blending amount of the thermoplastic resin [C] is preferably 1 to 20 parts by mass with respect to 100% by mass of the total amount of the epoxy resin composition. Within this range, the tackiness and drapeability are excellent and the viscosity adjustment of the epoxy resin composition can be adjusted to an appropriate range.
- the viscosity of the epoxy resin composition is preferably 0.01 to 200 Pa ⁇ s at 80 ° C. because the impregnation property to the fiber base material is good and the formation of voids can be suppressed in the prepreg process of the composite material.
- the viscosity of the epoxy resin composition was measured using a dynamic viscoelastic device ARES-G2 (manufactured by TA Instruments). A flat parallel plate having a diameter of 40 mm was used, and after setting the epoxy resin composition so that the distance between the upper and lower plates was 1 mm, it was confirmed that the measured temperature was reached, and then the torsion mode (angular frequency: 3.14 rad / s).
- the epoxy resin curing agent [D] used in the present invention may be a compound having an active group capable of reacting with an epoxy resin.
- the active group capable of reacting with the epoxy resin include those having an amino group or an acid anhydride group.
- the epoxy resin composition is preferably as the storage stability is high, but the liquid curing agent is preferably solid at room temperature because of high reactivity.
- the epoxy resin curing agent [D] is preferably an aromatic amine, and preferably has 1 to 4 phenyl groups in the molecule from the viewpoint of heat resistance and mechanical properties. Furthermore, since the elasticity of the resin can be improved by imparting the flexibility of the molecular skeleton, and the mechanical properties can be improved, at least one phenyl group contained in the skeleton of the epoxy resin curing agent is an amino group at the ortho or meta position. More preferably, it is an aromatic polyamine compound which is a phenyl group having a hydrogen atom.
- aromatic polyamines include metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, metaxylylenediamine, diphenyl-p-dianiline, isomers with different amino group positions such as alkyl derivatives thereof, and the like. Examples include the body. These curing agents can be used alone or in combination of two or more. Of these, diaminodiphenylmethane and diaminodiphenylsulfone are preferable from the viewpoint of imparting heat resistance to the composition.
- aromatic polyamine curing agents include Seika Cure S (manufactured by Wakayama Seika Kogyo Co., Ltd.), MDA-220 (manufactured by Mitsui Chemicals), “jER Cure (registered trademark)” (Mitsubishi Chemical Corporation) 3,3'-DAS (Mitsui Chemicals Fine Co., Ltd.), "Lonzacure (registered trademark)” M-DEA (manufactured by Lonza), “Lonzacure (registered trademark)” M-DIPA (Lonza) "Lonzacure (registered trademark)” M-MIPA (manufactured by Lonza), “Lonzacure (registered trademark)” DETDA 80 (manufactured by Lonza), and the like.
- the addition amount of the epoxy resin curing agent [D] varies depending on the combination with the epoxy resin.
- the ratio of the active hydrogen amount of the epoxy resin curing agent [D] to the epoxy group of the epoxy resin is 0.5 to 1.4, curing is sufficiently advanced and adverse effects on mechanical properties due to excess curing agent are reduced. Therefore, it is preferably 0.6 to 1.4.
- a bifunctional epoxy resin of the constituent element [E] may be used.
- the component [E] may be a bifunctional epoxy resin, preferably a bisphenol type epoxy resin, an epoxy resin having a biphenyl skeleton, an epoxy resin having a naphthalene skeleton, an epoxy resin having a binaphthalene skeleton, or a novolac type epoxy resin. Illustrated.
- the component [E] when the component [E] is included, it mix
- the compounding amount of the epoxy resin [E] is preferably 0.5 to 40% by mass with respect to the total amount of the epoxy resin because a composite material having high mechanical properties can be obtained.
- the preparation of the epoxy resin composition of the present invention is not particularly limited as long as it is generally used for the preparation of an epoxy resin, but for the purpose of dissolving or dispersing a solid component in a liquid component, A method of applying a shearing force is preferably used. Specifically, a kneader, a planetary mixer, a three roll mill, a self-revolving mixer, etc. are preferably used.
- a kneader, a planetary mixer, a three roll mill, a self-revolving mixer, etc. are preferably used.
- the constituent element [C] is dissolved in the constituent element [A], the constituent element [B] or a mixture thereof, the dissolved constituent is obtained by kneading while applying a shearing force with the above apparatus at a temperature of 70 to 200 ° C. It is preferable that the element [C] is diffused uniformly, so that uneven viscosity of the epoxy resin composition is less likely to occur.
- the dissolution means
- the epoxy resin composition of the present invention may contain particles mainly composed of a thermoplastic resin.
- the particles mainly composed of a thermoplastic resin are blended in order to add the impact resistance of the fiber reinforced composite material obtained in the present invention.
- a fiber reinforced composite material has a laminated structure. When an impact is applied to the fiber reinforced composite material, high stress is generated between the layers, and peeling damage occurs. Therefore, in the case of improving the impact resistance against external impact, a resin layer formed between layers of reinforcing fibers of the fiber reinforced composite material (hereinafter also referred to as “interlayer resin layer”) What is necessary is just to improve the toughness of.
- component [C] is blended, and this is because the interlayer resin layer of the fiber-reinforced composite material obtained in the present invention is selectively made tough.
- the thermoplastic resin which is the main component of the particles may be the same as or different from the thermoplastic resin used for the component [C].
- thermoplastic resin which is a component of such particles
- polyamide or polyimide can be preferably used, and among them, polyamide which can greatly improve impact resistance due to excellent toughness is most preferable.
- polyamide polyamide 12, polyamide 11, polyamide 6, polyamide 66, polyamide 6/12 copolymer, epoxy compound described in Example 1 of JP-A-1-104624, and semi-IPN (polymer interpenetrating network structure) are used.
- Polyamide (semi-IPN polyamide) or the like can be suitably used.
- thermoplastic resin particles may be spherical particles, non-spherical particles, or porous particles, but the spherical shape is superior in viscoelasticity because it does not deteriorate the flow characteristics of the resin, and there is no origin of stress concentration. This is a preferred embodiment in terms of giving high impact resistance.
- polyamide particles include SP-500, SP-10, TR-1, TR-2, 842P-48, 842P-80 (above, manufactured by Toray Industries, Inc.), and “Orgasol (registered trademark)” 1002D. , 2001UD, 2001EXD, 2002D, 3202D, 3501D, 3502D (above, manufactured by Arkema Co., Ltd.), “Grillamide (registered trademark)” TR90, TR55 (above, manufactured by Ms Chemi), “TROGAMID (registered trademark)” CX7323, CX9701, CX9704, (Degussa Co., Ltd.) etc. can be used. These polyamide particles may be used alone or in combination.
- the interlayer resin layer of the fiber reinforced composite material obtained in the present invention it is desirable to keep particles mainly composed of a thermoplastic resin in the interlayer resin layer.
- a method for retaining the particles in the interlayer resin layer a method of laminating a prepreg in which particles are arranged on the fiber surface or in the epoxy resin composition is suitably used.
- the number average particle diameter of the particles mainly composed of the thermoplastic resin is preferably in the range of 5 to 50 ⁇ m, preferably in the range of 7 to 40 ⁇ m, more preferably in the range of 10 to 30 ⁇ m.
- the particles can stay on the carbon fiber surface of the fiber reinforced composite material obtained without entering the bundle of reinforcing fibers or in the epoxy resin composition.
- the diameter By setting the diameter to 50 ⁇ m or less, the thickness of the matrix resin layer on the surface of the prepreg can be optimized, and in the fiber-reinforced composite material obtained, the fiber mass content can be optimized.
- the epoxy resin composition of the present invention can be used as a composite material in combination with carbon fibers.
- the carbon fiber any carbon fiber can be used as long as it is a known carbon fiber, and those having a strand strength of 3000 MPa to 7500 MPa and an elastic modulus of 200 GPa to 450 GPa in the strand tensile test are preferable.
- the strand tensile test refers to a test carried out based on JIS R7601 (1986) after impregnating a bundle of carbon fibers with a matrix resin having the following composition and curing it at a temperature of 130 ° C. for 35 minutes.
- the number of carbon fiber filaments is preferably 1000 to 100,000, more preferably 3000 to 50,000. If the number of carbon fiber filaments is less than 1000, the operation for forming a prepreg becomes complicated. If the number of carbon fiber filaments is more than 100,000, it becomes difficult to impregnate the resin between the filaments, and impregnation failure may occur.
- the carbon fiber is preferably used by arranging continuous fibers having a length of 10 mm or more in one direction, or in the form of a woven fabric such as plain weave, satin weave, twill weave, and the carbon fiber forms a layer. It is preferable that
- a fiber base material is impregnated with a resin in advance to form an A stage or B stage prepreg, which is molded and used by the method described below. Also good.
- the prepreg of the present invention includes a continuous carbon fiber arranged in one direction in a sheet shape, a carbon fiber fabric or other base material made of carbon fiber impregnated with an epoxy resin composition, or a carbon fiber base material.
- a resin layer made of an epoxy resin composition is disposed on at least one surface, or a part of the epoxy resin composition is impregnated and the remaining portion is disposed on at least one surface. It is preferable that the epoxy resin composition at the time of impregnation or placement has fluidity because workability is improved when it is molded into a predetermined shape.
- the prepreg can be produced by a wet method, a hot melt method, or the like described below.
- the wet method is a method in which a reinforcing fiber substrate is immersed in a solution composed of an epoxy resin composition and a solvent, then lifted, and the solvent is evaporated using an oven or the like.
- the hot melt method reduces the viscosity by heating.
- the hot melt method is preferable because substantially no solvent remains in the prepreg.
- the carbon fiber mass per unit area of the prepreg is preferably 70 to 1000 g / m 2 .
- the carbon fiber content in the prepreg is preferably 30 to 90% by mass, more preferably 35 to 85% by mass, and further preferably 40 to 80% by mass. If the carbon fiber content is 30% by mass or more, the high specific strength and specific elastic modulus, which are the characteristics of the carbon fiber reinforced composite material, can be effectively utilized. Therefore, it is preferable.
- the gap portion generated in the entangled portion of the warp and weft of the carbon fiber woven fabric is 5% or less when the prepreg is manufactured. From the back side of the fabric prepreg, photograph the surface of the fabric prepreg with an actual microscope while shining light. The woven yarn portion is black, the gap portion is white, and the transmitted light pattern of the fabric is photographed. When the total area S1 and the area S2 of the white portion (gap portion) are obtained by image processing, the ratio of the gap portion can be measured by S2 / S1.
- the composite material according to the present invention is produced by a method of heat-curing the resin while applying pressure to the laminate.
- the method for applying heat and pressure include a press molding method, an autoclave molding method, a bagging molding method, a wrapping tape method, and an internal pressure molding method.
- the wrapping tape method is a method of forming a tubular body made of a composite material by winding a prepreg on a mandrel or the like, and is a suitable method for producing a rod-shaped body such as a golf shaft or a fishing rod.
- the prepreg is wound around a mandrel, and a wrapping tape made of a thermoplastic resin film is wound around the outside of the prepreg to fix and apply pressure to the prepreg.
- This is a method of extracting a gold to obtain a tubular body.
- the internal pressure molding method is to set a preform in which a prepreg is wound on an internal pressure applying body such as a tube made of a thermoplastic resin in a mold, and then introduce a high pressure gas into the internal pressure applying body to apply pressure. At the same time, the mold is heated and molded.
- This method is preferably used when molding a complicated shape such as a golf shaft, a bad, a racket such as tennis or badminton.
- the curing temperature and time when the composite material of the present invention is molded in an autoclave or an oven vary depending on the type and amount of the selected curing agent and curing catalyst, but the heat resistance of 130 ° C. or more is different. For required applications, it is preferable to cure at a temperature of 120 to 220 ° C. for 0.5 to 8 hours.
- a temperature rising rate of 0.1 to 10 ° C./min is preferably used. When the rate of temperature increase is less than 0.1 ° C./min, the time required to reach the target curing temperature becomes very long and workability may be reduced. On the other hand, if the rate of temperature rise exceeds 10 ° C./min, a temperature difference occurs at various portions of the reinforcing fiber due to the influence of airflow and internal heat generation, and a uniform cured product may not be obtained.
- pressure increase / decrease is not essential, but pressure increase / decrease may be performed as necessary.
- effects such as improvement in surface quality, suppression of internal voids, and improvement in adhesion to metal, plastic, and composite parts to be bonded during curing may be obtained.
- the composite material of the present invention is preferably used for aircraft structural members, windmill blades, automobile outer plates, computer trays such as IC trays and notebook PC housings, and sports applications such as golf shafts and tennis rackets.
- Component [A] The following commercial item was used for component [A]. “Epiclon (registered trademark)” HP-820 (t-butylcatechol type epoxy, manufactured by DIC Corporation, epoxy equivalent: 216). “Epiclon” HP-820 contains a dimer according to the description of JP2013-49781A.
- TBC Tetrachloro-type epoxy resin
- a 2-liter separable flask equipped with a thermometer, a suitable funnel, a condenser, a stirrer, and a baffle at the bottom and equipped with a separatory cock at the bottom is charged with 200 g of 4-t-tilcatechol, 560 g of epichlorohydrin, and 150 g of isopropyl alcohol. Stir, dissolve, and heat to 40 ° C. Thereafter, 530 g of a 20% aqueous sodium hydroxide solution was appropriately reduced over 3 hours from a suitable funnel.
- JER (registered trademark) 807 (bisphenol F type epoxy, manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: 170)
- JER (registered trademark) 825 (bisphenol A type epoxy, manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: 175).
- Thermoplastic resin particles “Grillamide (registered trademark)” TR55 manufactured by Ms Chemi were pulverized and classified by an impact pulverizer to obtain fine particles having a number average particle diameter of 20 ⁇ m.
- a plain weave fabric made of “Torayca (registered trademark)” T400H-3K (3000 fibers, tensile strength 4410 MPa, tensile elastic modulus 250 MPa, tensile elongation 1.8%) was used.
- Tg of cured product The glass transition temperature of the cured product obtained in the above (2) was determined by using a differential scanning calorimeter (DSC) and the midpoint temperature determined based on JIS-K7121 (1987) was Tg.
- DSC differential scanning calorimeter
- Viscosity measurement of resin composition The viscosity of the epoxy resin composition was measured using a dynamic viscoelastic device ARES-G2 (manufactured by TA Instruments). A flat parallel plate having a diameter of 40 mm was used, and after setting the epoxy resin composition so that the distance between the upper and lower plates was 1 mm, it was confirmed that the measured temperature was reached, and then the torsion mode (angular frequency: 3.14 rad / s).
- the cured product had an elastic modulus of 4.1 GPa or more, the cured product had a Tg of 150 ° C. or more, a warp tensile strength of 750 MPa or more, and a warp compression strength of 860 MPa or more.
- the viscosity adjustment range is within 0.01 to 200 Pa ⁇ s at 80 ° C., and the impregnation property of the epoxy resin composition at the time of preparing the prepreg is good.
- the obtained prepreg was confirmed to have good adhesion between prepregs and adhesion to a metal plate (tackiness).
- Examples 1 to 12, 17, 18, 25 to 29> In Examples 1 to 12, 17, 18, 25 to 29, each component [A], [B], [C], [D] is changed from each component to each component as shown in Tables 1 to 3, 5. Were selected and blended so as to satisfy the range of each component to prepare an epoxy resin composition. The obtained cured product and fiber reinforced composite material were tested, and excellent elastic modulus, Tg, warp tensile strength and warp compressive strength were obtained for each physical property.
- Examples 13 to 16, 23, 24> In the same manner as in Examples 1 to 12, except that the constituent element [E] was further added to the constituent elements [A], [B], [C], and [D], blended as shown in Tables 2 to 3, An epoxy resin composition was prepared. The obtained cured product and fiber reinforced composite material were tested, and excellent physical properties were obtained even when the constituent element [E] was blended within 40% by mass.
- Examples 1, 19 to 21> The compounding ratio of the constituent elements [A], [B], [C] and [D] is fixed, and the constituent element [A] is HP-820 (catechol type), EX-201 (resorcinol type), Ex-203 ( Hydroquinone type) and YDC-1312 (hydroquinone type) were blended and the obtained cured products and fiber reinforced composite materials were tested to obtain target elastic modulus, Tg, warp tensile strength and warp compressive strength. It was. Among them, the catechol type having the ortho-position structure had the highest warp tensile strength and warp compression strength, followed by the meta-resorcinol type and then the para-position hydroquinone type.
- Example 17 and 22 The composition [D] of Example 17 was mixed in the same manner except that Seika Cure S was changed, and the obtained cured product and fiber reinforced composite material were tested. The target elastic modulus, Tg, warp tensile strength, and warp Compressive strength was obtained. In Example 17 using 3,3′-diaminodiphenylsulfone, higher resin elastic modulus and warp compression strength were obtained compared to Example 22 using 4,4′-diaminodiphenylsulfone.
- Example 17 and 30 Except that thermoplastic resin particles were added during the preparation of the epoxy resin composition, a woven fabric prepreg was prepared in the same manner as in Example 17, an interlayer resin layer of the fiber reinforced composite material was formed, and the impact resistance of the fiber reinforced composite material was increased. Compared to the case of Example 17. In Example 30 to which the thermoplastic resin particles were added, it was confirmed that the impact resistance was improved as compared with Example 17.
- the epoxy resin composition of the present invention is an epoxy resin composition that gives a tensile strength and a compressive strength that could not be achieved before when a carbon fiber reinforced composite material is used. It is preferably used and useful as a structural member for aircraft, automobiles and the like that have been difficult to apply.
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Abstract
Description
[A]:1,2-ビス(グリシジルオキシ)ベンゼン、1,3-ビス(グリシジルオキシ)ベンゼン、1,4-ビス(グリシジルオキシ)ベンゼン、それらの誘導体、一般式[1]で表される構造を有するエポキシ樹脂、からなる群から選ばれる少なくとも一つのエポキシ樹脂
[B]:分子内に3個以上のグリシジル基を有するグリシジルアミン型エポキシ樹脂
[C]:エポキシ樹脂に可溶な熱可塑性樹脂
[D]:エポキシ樹脂硬化剤
また、本発明のプリプレグは、上記エポキシ樹脂組成物を炭素繊維に含浸させてなるものである。
[A]:1,2-ビス(グリシジルオキシ)ベンゼン、1,3-ビス(グリシジルオキシ)ベンゼン、1,4-ビス(グリシジルオキシ)ベンゼン、それらの誘導体、上述の一般式[1]で表される構造を有するエポキシ樹脂、からなる群から選ばれる少なくとも一つのエポキシ樹脂
[B]:分子内に3個以上のグリシジル基を有するグリシジルアミン型エポキシ樹脂
[C]:エポキシ樹脂に可溶な熱可塑性樹脂
[D]:エポキシ樹脂硬化剤
本発明に用いるエポキシ樹脂[A]は、ベンゼン環に2つ以上のグリシジルエーテル基が結合している、1,2-ビス(グリシジルオキシ)ベンゼン、1,3-ビス(グリシジルオキシ)ベンゼン、1,4-ビス(グリシジルオキシ)ベンゼン、それらの誘導体、上述の一般式[1]で表される構造を有するエポキシ樹脂、からなる群から選ばれる少なくとも一つのエポキシ樹脂である。1,2-ビス(グリシジルオキシ)ベンゼンは2つのグリシジルエーテル基がオルト位の位置関係であり、カテコール型である。1,3-ビス(グリシジルオキシ)ベンゼンは2つのグリシジルエーテル基がメタ位の位置関係であり、レゾルシノール型である。1,4-ビス(グリシジルオキシ)ベンゼンは2つのグリシジルエーテル基がパラ位の位置関係であり、ヒドロキノン型である。分子の屈曲構造を利用し分子鎖間の隙間である自由体積を埋めることで硬化物の弾性率向上をはかる観点からは、分子の屈曲性の大きな、カテコール型、レゾルシノール型を用いることが好ましく、より好ましくはカテコール型である。さらに、上記、自由体積を埋める観点から、嵩高い置換基を有する事も有効であり、例えば3級ブチル(t-ブチル)基等を置換基として導入する事が好ましい。
・3フッ化ホウ素モノエチルアミン(例えば、ステラケミファ株式会社製):3質量部
・アセトン(例えば、和光純薬工業株式会社製):4質量部。
構成要素[A]は以下の市販品を用いた。
“エピクロン(登録商標)”HP-820(t-ブチルカテコール型エポキシ、DIC(株)製、エポキシ当量:216)。なお、“エピクロン”HP-820は、特開2013-49781号公報記載によると、二量体を含んでいる。
“デナコール(登録商標)”Ex-201(レゾルシノール型エポキシ、ナガセケムテックス(株)製、エポキシ当量:117)
“デナコール(登録商標)”Ex-203(ヒドロキノン型エポキシ、ナガセケムテックス(株)製、エポキシ当量:115)
YDC-1312(2,5-t-ブチルヒドロキノン型エポキシ、新日鉄住金化学(株)製、エポキシ当量:177)。
・“t-ブチルカテコール型エポキシ樹脂(以下TBCと略す)”
温度計、適下ロート、冷却管、撹拌機、邪魔板を備えた、下部に分液コック付きの2リットルのセパラブルフラスコに、4-t-チルカテコール200g、エピクロルヒドリン560g、イソプロピルアルコール150gを仕込み、撹拌、溶解し、40℃に加熱した。その後適下ロートより、20%水酸化ナトリウム水溶液の 530gを3時間かけて適下した。適下終了後30分間撹拌を続け、反応を完結させた。その後撹拌を停止し静置し、下層の食塩水を分液し除いた。次に、過剰のエピクロルヒドリン、イソプロピルアルコール、水を蒸留回収した。得られた粗樹脂をトルエン335gで溶解させ、5%水酸化ナトリウム水溶液を50g加え、80℃、3時間撹拌した。その後水洗により生成した塩、及びアルカリを油水分離させて、除去し、脱水、濾過を経てトルエンを蒸留回収しTBCを得た。エポキシ樹脂当量は216であった。
・“ARALDITE(登録商標)”MY721(テトラグリシジルジアミノジフェニルメタン、ハンツマンアトバンスドマテリアル社製、エポキシ当量:112)
・TGDDS(テトラグリシジルジミノジフェニルスルホン、小西化学(株)製、エポキシ当量:112)
・“ARALDITE(登録商標)”(登録商標)MY0510(トリグリシジル-p-アミノフェノール、ハンツマンアドバンストマテリアル社製、エポキシ当量:100)
・“ARALDITE(登録商標)”登録商標)MY0600(トリグリシジル-m-アミノフェノール、ハンツマンアドバンストマテリアル社製、エポキシ当量:105)。
・“スミカエクセル(登録商標)”PES5003P(水酸基末端ポリエーテルスルホン、住友化学(株)製、Tg=225℃)
・“Virantage(登録商標)”VW-10700RP(水酸基末端ポリエーテルスルホン、Solvay Advanced Polymers(株)製、Tg=220℃)
・“スミカエクセル(登録商標)”PES7600P(塩素末端ポリエーテルスルホン、住友化学(株)製、Tg=225℃)
・“Virantage(登録商標)”VW-30500RP(ポリスルホン、Solvay Advanced Polymers(株)製、Tg=205℃)
・“ULTEM(登録商標)”1010(ポリエーテルイミド、Sabic Innovative Platics(株)製、Tg=215℃)。
・3,3’-DAS(3,3’-ジアミノジフェニルスルホン、三井化学ファイン(株)製、活性水素当量:62、室温で固形)
・セイカキュアS(4,4’-ジアミノジフェニルスルホン、和歌山精化工業(株)製、活性水素当量:62、室温で固形)
・“Lonzacure(登録商標)”MIPA(4,4’-メチレンビス(2-メチル-6-イソプロピル)ベンゼンアミン、Lonza(株)製、活性水素当量:78、室温で固体)。
・“jER(登録商標)”807(ビスフェノールF型エポキシ、三菱化学(株)製、エポキシ当量:170)
・“jER(登録商標)”825(ビスフェノールA型エポキシ、三菱化学(株)製、エポキシ当量:175)。
“グリルアミド(登録商標)”TR55(エムスケミ社製)を衝撃式粉砕機により粉砕分級することにより数平均粒径20μmの粒径の微粒子とした。
ニーダー中に、構成要素[A]のエポキシ樹脂、構成要素[B]のエポキシ樹脂、構成要素[C]の熱可塑樹脂、構成要素[E]のエポキシ樹脂を混練しつつ、150℃まで昇温し、150℃、混練することで透明な粘調液を得た。構成要素[D]の硬化剤を添加し、混練し、エポキシ樹脂組成物を得た。各実施例、比較例の成分配合比は表1~6に示すとおりであった。
上記(1)で調製したエポキシ樹脂組成物を離型紙上にコーティングし、所定の樹脂目付の樹脂フィルムを作製した。この樹脂フィルムをプリプレグ作製機にセットし、強化繊維織物の両面から重ね、加熱加圧して熱硬化性樹脂組成物を含浸させ、繊維目付193g/m2、樹脂含有率が38質量%の織物プリプレグを作製した。なお、強化繊維織物は“トレカ(登録商標)”T400H-3K(繊維数3000本、引張強度4410MPa、引張弾性率250MPa、引張伸度1.8%)からなる平織織物を用いた。
未硬化の樹脂組成物を真空中で脱泡した後、2mm厚の“テフロン(登録商標)”製のスペーサーを用い、厚み2mmになるよう設定したモールド中で、180℃の温度で2時間硬化させた。得られた厚み2mmの硬化物を幅10±0.1mm、長さ60±1mmでカットし、試験片を得た。インストロン万能試験機(インストロン社製)を用いJIS-K7171(1994)に従い、スパン間32mmの3点曲げを実施し、弾性率を測定した。測定数はN=6とし、その平均値を求めた。
上記(2)で得られた硬化物のガラス転移温度は示差走査熱量計(DSC)を用いて、JIS-K7121(1987)に基づいてもとめた中間点温度をTgとした。
エポキシ樹脂組成物の粘度測定は動的粘弾性装置ARES-G2(ティー・エイ・インスツルメント社製)を用いて測定した。直径40mmの平板のパラレルプレートを用い、上部と下部のプレート間距離が1mmとなるように該エポキシ樹脂組成物をセット後、測定温度に到達を確認後、ねじりモード(角周波数:3.14rad/s)で測定した。
織物プリプレグの経糸方向を揃え枚積層してオートクレーブ中で温度180℃、圧力6.10kgf/cm2Paで2時間加熱加圧して硬化し、複合材料を作製した。得た複合材料から、幅25±0.5mm、長さ250±1.0mm、タブ間スパン130±1.0mmの試験片を作製し、EN2597Bに従い、経糸引張強度を測定した。
織物プリプレグの経糸方向を揃え9枚積層して、上記(6)の成形条件で成形した複合材料から、幅12.5±0.2mm、長さ75~80mm、タブ間スパン5.25±0.25mmの試験片を作製し、EN2850Bに従い、経糸圧縮強度を測定した。
織物プリプレグ24枚を経糸方向を0°として[45°/0°/-45°/90°]3s(記号sは、鏡面対称を示す)で疑似等方的に積層し、上記(6)の成形条件で成形した複合材料から、幅100±0.2mm、長さ150±0.2mmの試験片を作製した。この中央に落下高さ468mmで5.4kgの落錘衝撃を与えた後SACMA SRM 2R-94が示す圧縮治具用治具を用い、クロスヘッドスピード0.5mm/minで圧縮し、圧縮強度を求めた。測定数はN=6とし、その平均値を求めた。
実施例1~12、17、18、25~29では、各構成要素[A]、[B]、[C]、[D]を表1~3、5に示すとおり、各構成要素から各成分を選択し、各成分の範囲を満たすよう配合し、エポキシ樹脂組成物を調製した。得られた硬化物および繊維強化複合材料の試験を行い、各物性とも優れた弾性率、Tg、経糸引張強度および経糸圧縮強度が得られた。
構成要素[A]、[B]、[C]、[D]に、さらに構成要素[E]を加えた以外は実施例1~12と同様にして、表2~3に示すとおり配合し、エポキシ樹脂組成物を調製した。得られた硬化物および繊維強化複合材料の試験を行い、構成要素[E]を40質量%以内で配合した場合も優れた物性が得られた。
構成要素[A]、[B]、[C]、[D]の配合比を固定し、構成要素[A]をHP-820(カテコール型)、EX-201(レゾルシノール型)、Ex-203(ヒドロキノン型)、YDC-1312(ヒドロキノン型)に変えて配合し、得られた硬化物および繊維強化複合材料の試験を行い、目標とする弾性率、Tg、経糸引張強度および経糸圧縮強度が得られた。中でもオルト位の構造を有するカテコール型が最も経糸引張強度および経糸圧縮強度が高く、次いでメタ位のレゾルシノール型、次いでパラ位のヒドロキノン型の序列となった。
実施例17の構成要素[D]をセイカキュアSに変えた以外は同様に配合し、得られた硬化物および繊維強化複合材料の試験を行い、目標とする弾性率、Tg、経糸引張強度および経糸圧縮強度が得られた。3,3’-ジアミノジフェニルスルホンを用いた実施例17のほうが、4,4’-ジアミノジフェニルスルホンを用いた実施例22に比べ、高い樹脂弾性率および経糸圧縮強度が得られた。
表4に示すとおり、比較例1のように構成要素[A]を含まない場合、硬化物の弾性率および経糸圧縮強度が低下した。比較例2のように構成要素[B]を含まない場合、硬化物の弾性率、Tgおよび経糸圧縮強度が低下した。比較例3のように構成要素[A]および[C]を含まない場合、経糸引張強度が低下した。比較例4~6のように構成要素[B]および[C]を含まない場合、硬化物のTgが低下し、比較例6ではさらに弾性率および経糸圧縮強度が低下した。
エポキシ樹脂組成物の調製時に熱可塑性樹脂粒子を入れた以外は、実施例17と同様に織物プリプレグを作製し、繊維強化複合材料の層間樹脂層を形成し、繊維強化複合材料の耐衝撃性を実施例17の場合と比較した。熱可塑性樹脂粒子を付与した実施例30では、実施例17に比べ、耐衝撃性が向上している事が確認できた。
Claims (14)
- 少なくとも次の構成要素[A]~[D]を含むエポキシ樹脂組成物であって、エポキシ樹脂総量100質量%に対して構成要素[A]を5~50質量%と構成要素[B]を20~95質量%含むエポキシ樹脂組成物。
[A]:1,2-ビス(グリシジルオキシ)ベンゼン、1,3-ビス(グリシジルオキシ)ベンゼン、1,4-ビス(グリシジルオキシ)ベンゼン、それらの誘導体、一般式[1]で表される構造を有するエポキシ樹脂、からなる群から選ばれる少なくとも一つのエポキシ樹脂
(ただし一般式[1]中、R1~R5のうちの少なくとも1つ、R6~R10のうちの少なくとも1つがグリシジルエーテル基であり、それ以外のR1~R10は水素原子、ハロゲン原子、炭素数4以下の脂肪族炭化水素基のいずれかを表す。)
[B]:分子内に3個以上のグリシジル基を有するグリシジルアミン型エポキシ樹脂
[C]:エポキシ樹脂に可溶な熱可塑性樹脂
[D]:エポキシ樹脂硬化剤 - エポキシ樹脂[A]がカテコール型である請求項1記載のエポキシ樹脂組成物。
- 構成要素[C]のTgが、200℃以上である請求項1または2に記載のエポキシ樹脂組成物。
- 構成要素[C]が、ポリエーテルスルホン、ポリエーテルエーテルスルホン、ポリエーテルイミド、ポリフェニレンオキシド、ポリスルホンからなる群から選ばれる少なくとも1つである、請求項1~3のいずれかに記載のエポキシ樹脂組成物。
- エポキシ樹脂組成物の総量100質量%に対して、構成要素[C]の配合量が1~20質量%である請求項1~4のいずれかに記載のエポキシ樹脂組成物。
- 構成要素[D]が、室温で固形である請求項1~5のいずれかに記載のエポキシ樹脂組成物。
- 構成要素[D]が、芳香族アミンである請求項1~6のいずれかに記載のエポキシ樹脂組成物。
- 構成要素[D]が、分子内に1~4個のフェニル基を有し、そのうち少なくとも1個のフェニル基がオルト位またはメタ位にアミノ基を有する芳香族ポリアミンである請求項1~7のいずれかに記載のエポキシ樹脂組成物。
- さらに構成要素[E]:2官能エポキシ樹脂を含む請求項1~8のいずれかに記載のエポキシ樹脂組成物。
- 構成要素[E]がビスフェノールA型エポキシ樹脂またはビスフェノールF型エポキシ樹脂である請求項9に記載のエポキシ樹脂組成物。
- エポキシ樹脂組成物中のエポキシ樹脂総量100質量%に対して、構成要素[E]を40質量%以下含む請求項9または10に記載のエポキシ樹脂組成物。
- 請求項1~11のいずれかに記載のエポキシ樹脂組成物を炭素繊維に含浸させてなるプリプレグ。
- 炭素繊維表面上またはエポキシ樹脂組成物中に数平均粒径が5~50μmの熱可塑性樹脂粒子が配置されてなる請求項12記載のプリプレグ。
- 請求項1~11のいずれかに記載のエポキシ樹脂組成物および炭素繊維を含む炭素繊維強化複合材料。
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| US15/558,087 US10280251B2 (en) | 2015-03-17 | 2016-03-16 | Epoxy resin composition, prepreg, and carbon fiber-reinforced composite material |
| CN201680010091.4A CN107250200B (zh) | 2015-03-17 | 2016-03-16 | 环氧树脂组合物、预浸料坯及碳纤维增强复合材料 |
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| JP7315304B2 (ja) | 2018-03-16 | 2023-07-26 | 帝人株式会社 | エポキシ樹脂組成物、プリプレグ、及び繊維強化複合材料 |
| JP7224800B2 (ja) | 2018-03-16 | 2023-02-20 | 帝人株式会社 | エポキシ樹脂組成物、プリプレグ、繊維強化複合材料、及びそれらの製造方法 |
| JP2019163438A (ja) * | 2018-03-16 | 2019-09-26 | 帝人株式会社 | エポキシ樹脂組成物、プリプレグ、繊維強化複合材料、及びそれらの製造方法 |
| JP7190258B2 (ja) | 2018-03-16 | 2022-12-15 | 帝人株式会社 | エポキシ樹脂組成物、プリプレグ、及び繊維強化複合材料 |
| JP2019157096A (ja) * | 2018-03-16 | 2019-09-19 | 帝人株式会社 | エポキシ樹脂組成物、プリプレグ、及び繊維強化複合材料 |
| JP7172180B2 (ja) | 2018-06-28 | 2022-11-16 | Dic株式会社 | エポキシ樹脂組成物、硬化性樹脂組成物、硬化物、繊維強化複合材料、繊維強化樹脂成形品、及び繊維強化樹脂成形品の製造方法 |
| JP2020002260A (ja) * | 2018-06-28 | 2020-01-09 | Dic株式会社 | エポキシ樹脂組成物、硬化性樹脂組成物、硬化物、繊維強化複合材料、繊維強化樹脂成形品、及び繊維強化樹脂成形品の製造方法 |
| JP2020117613A (ja) * | 2019-01-23 | 2020-08-06 | Dic株式会社 | 酸基含有(メタ)アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材 |
| JP7192521B2 (ja) | 2019-01-23 | 2022-12-20 | Dic株式会社 | 酸基含有(メタ)アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材 |
| JP7192520B2 (ja) | 2019-01-23 | 2022-12-20 | Dic株式会社 | エポキシ(メタ)アクリレート樹脂、硬化性樹脂組成物、硬化物及び物品 |
| JP2020117612A (ja) * | 2019-01-23 | 2020-08-06 | Dic株式会社 | エポキシ(メタ)アクリレート樹脂、硬化性樹脂組成物、硬化物及び物品 |
| WO2020250957A1 (ja) | 2019-06-14 | 2020-12-17 | Dic株式会社 | エポキシ樹脂組成物、硬化物、繊維強化複合材料、プリプレグ及びトウプリプレグ |
| US11767424B2 (en) | 2019-10-25 | 2023-09-26 | Dic Corporation | Polyfunctional phenolic resin, polyfunctional epoxy resin, curable resin composition containing these, and cured product thereof |
| JPWO2021177089A1 (ja) * | 2020-03-06 | 2021-09-10 | ||
| WO2021177089A1 (ja) * | 2020-03-06 | 2021-09-10 | 東レ株式会社 | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
| JP7775710B2 (ja) | 2020-03-06 | 2025-11-26 | 東レ株式会社 | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3272781A1 (en) | 2018-01-24 |
| CN107250200B (zh) | 2019-06-28 |
| JPWO2016148175A1 (ja) | 2017-12-28 |
| CN107250200A (zh) | 2017-10-13 |
| EP3272781A4 (en) | 2018-10-24 |
| US20180051125A1 (en) | 2018-02-22 |
| JP6708121B2 (ja) | 2020-06-10 |
| KR20170129098A (ko) | 2017-11-24 |
| US10280251B2 (en) | 2019-05-07 |
| EP3272781B1 (en) | 2019-08-21 |
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