WO2016002974A3 - Feuille de protection de surface - Google Patents
Feuille de protection de surface Download PDFInfo
- Publication number
- WO2016002974A3 WO2016002974A3 PCT/JP2015/075045 JP2015075045W WO2016002974A3 WO 2016002974 A3 WO2016002974 A3 WO 2016002974A3 JP 2015075045 W JP2015075045 W JP 2015075045W WO 2016002974 A3 WO2016002974 A3 WO 2016002974A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- protective film
- surface protective
- carboxyl
- mass
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Film de protection de surface lié à des éléments optiques ou électroniques, et utilisé pour protéger les surfaces desdits éléments. Ce film de protection de surface est pourvu d'un matériau de base et d'une couche adhésive disposée sur une surface du matériau de base. La couche adhésive comprend une composition d'adhésif durcissable sous l'effet d'un rayonnement énergétique, contenant un copolymère acrylique (A), ce dernier étant formé par copolymérisation de composants monomères comprenant 5 à 50 % en poids d'alkyl(méth)acrylate comportant un groupe alkyle C1-2, et soit comprenant moins de 5 % en poids de monomères contenant du carboxyle soit ne comprenant aucun monomère contenant du carboxyle.
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-137994 | 2014-07-03 | ||
| JP2014137994A JP6092161B2 (ja) | 2014-07-03 | 2014-07-03 | 表面保護フィルム |
| JP2014191337 | 2014-09-19 | ||
| JP2014-191337 | 2014-09-19 | ||
| JP2015072975 | 2015-03-31 | ||
| JP2015-072975 | 2015-03-31 | ||
| JP2015098349 | 2015-05-13 | ||
| JP2015-098349 | 2015-05-13 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| WO2016002974A2 WO2016002974A2 (fr) | 2016-01-07 |
| WO2016002974A3 true WO2016002974A3 (fr) | 2016-02-25 |
| WO2016002974A8 WO2016002974A8 (fr) | 2016-04-14 |
Family
ID=55020058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2015/075045 Ceased WO2016002974A2 (fr) | 2014-07-03 | 2015-09-03 | Feuille de protection de surface |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2016002974A2 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108475142B (zh) * | 2016-01-19 | 2021-05-11 | 富士胶片株式会社 | 导电膜层叠体 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008201899A (ja) * | 2007-02-20 | 2008-09-04 | Nitto Denko Corp | 固体撮像デバイス用表面保護粘着テープ及び固体撮像デバイスの実装方法 |
| WO2013136897A1 (fr) * | 2012-03-12 | 2013-09-19 | リンテック株式会社 | Substrat de feuille de rectification du dos et feuille adhésive, procédé de production de substrat et de feuille, et procédé de production de pièce à usiner |
| JP2013221065A (ja) * | 2012-04-16 | 2013-10-28 | Nippon Synthetic Chem Ind Co Ltd:The | アクリル系樹脂組成物、アクリル系粘着剤、粘着シート、両面粘着シート、透明電極用粘着剤、タッチパネル及び画像表示装置、並びに粘着剤層含有積層体の製造方法 |
| JP2014025073A (ja) * | 2013-10-08 | 2014-02-06 | Mitsubishi Plastics Inc | 粘着シート |
| JP2014043546A (ja) * | 2012-07-31 | 2014-03-13 | Nitto Denko Corp | 放射線硬化型粘着剤層及び放射線硬化型粘着シート |
| WO2014061774A1 (fr) * | 2012-10-19 | 2014-04-24 | リンテック株式会社 | Feuille adhésive destinée au traitement de composants électroniques et procédé de fabrication de dispositif à semi-conducteur |
| WO2014091863A1 (fr) * | 2012-12-10 | 2014-06-19 | 日東電工株式会社 | Film optique ayant un adhésif des deux côtés et procédé de fabrication d'un dispositif d'affichage d'images utilisant celui-ci |
| JP2014120624A (ja) * | 2012-12-17 | 2014-06-30 | Lintec Corp | ダイシングシート |
| JP2014123728A (ja) * | 2013-12-12 | 2014-07-03 | Lintec Corp | 粘着シートおよび半導体装置の製造方法 |
-
2015
- 2015-09-03 WO PCT/JP2015/075045 patent/WO2016002974A2/fr not_active Ceased
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008201899A (ja) * | 2007-02-20 | 2008-09-04 | Nitto Denko Corp | 固体撮像デバイス用表面保護粘着テープ及び固体撮像デバイスの実装方法 |
| WO2013136897A1 (fr) * | 2012-03-12 | 2013-09-19 | リンテック株式会社 | Substrat de feuille de rectification du dos et feuille adhésive, procédé de production de substrat et de feuille, et procédé de production de pièce à usiner |
| JP2013221065A (ja) * | 2012-04-16 | 2013-10-28 | Nippon Synthetic Chem Ind Co Ltd:The | アクリル系樹脂組成物、アクリル系粘着剤、粘着シート、両面粘着シート、透明電極用粘着剤、タッチパネル及び画像表示装置、並びに粘着剤層含有積層体の製造方法 |
| JP2014043546A (ja) * | 2012-07-31 | 2014-03-13 | Nitto Denko Corp | 放射線硬化型粘着剤層及び放射線硬化型粘着シート |
| WO2014061774A1 (fr) * | 2012-10-19 | 2014-04-24 | リンテック株式会社 | Feuille adhésive destinée au traitement de composants électroniques et procédé de fabrication de dispositif à semi-conducteur |
| WO2014091863A1 (fr) * | 2012-12-10 | 2014-06-19 | 日東電工株式会社 | Film optique ayant un adhésif des deux côtés et procédé de fabrication d'un dispositif d'affichage d'images utilisant celui-ci |
| JP2014120624A (ja) * | 2012-12-17 | 2014-06-30 | Lintec Corp | ダイシングシート |
| JP2014025073A (ja) * | 2013-10-08 | 2014-02-06 | Mitsubishi Plastics Inc | 粘着シート |
| JP2014123728A (ja) * | 2013-12-12 | 2014-07-03 | Lintec Corp | 粘着シートおよび半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016002974A8 (fr) | 2016-04-14 |
| WO2016002974A2 (fr) | 2016-01-07 |
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| Date | Code | Title | Description |
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