WO2016002974A3 - Surface protective film - Google Patents
Surface protective film Download PDFInfo
- Publication number
- WO2016002974A3 WO2016002974A3 PCT/JP2015/075045 JP2015075045W WO2016002974A3 WO 2016002974 A3 WO2016002974 A3 WO 2016002974A3 JP 2015075045 W JP2015075045 W JP 2015075045W WO 2016002974 A3 WO2016002974 A3 WO 2016002974A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- protective film
- surface protective
- carboxyl
- mass
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
This surface protective film is bonded to optical or electronic members, and is used to protect the surfaces of said members. The surface protective film is provided with a base material and an adhesive layer provided to one surface of the base material. The adhesive layer comprises an energy ray curable adhesive composition containing an acrylic copolymer (A), said acrylic copolymer (A) being formed by copolymerizing monomer components including 5 to 50 mass% of alkyl(meth)acrylate having a C1-2 alkyl group, and either including less than 5 mass% of carboxyl-containing monomers or not including any carboxyl-containing monomers.
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-137994 | 2014-07-03 | ||
| JP2014137994A JP6092161B2 (en) | 2014-07-03 | 2014-07-03 | Surface protection film |
| JP2014191337 | 2014-09-19 | ||
| JP2014-191337 | 2014-09-19 | ||
| JP2015072975 | 2015-03-31 | ||
| JP2015-072975 | 2015-03-31 | ||
| JP2015098349 | 2015-05-13 | ||
| JP2015-098349 | 2015-05-13 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| WO2016002974A2 WO2016002974A2 (en) | 2016-01-07 |
| WO2016002974A3 true WO2016002974A3 (en) | 2016-02-25 |
| WO2016002974A8 WO2016002974A8 (en) | 2016-04-14 |
Family
ID=55020058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2015/075045 Ceased WO2016002974A2 (en) | 2014-07-03 | 2015-09-03 | Surface protective film |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2016002974A2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108475142B (en) * | 2016-01-19 | 2021-05-11 | 富士胶片株式会社 | Conductive film laminate |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008201899A (en) * | 2007-02-20 | 2008-09-04 | Nitto Denko Corp | Surface protective adhesive tape for solid-state imaging device and mounting method of solid-state imaging device |
| WO2013136897A1 (en) * | 2012-03-12 | 2013-09-19 | リンテック株式会社 | Back-grind-sheet substrate and adhesive sheet, method for producing substrate and sheet, and method for producing workpiece |
| JP2013221065A (en) * | 2012-04-16 | 2013-10-28 | Nippon Synthetic Chem Ind Co Ltd:The | Acrylic resin composition, acrylic adhesive, adhesive sheet, double-sided adhesive sheet, adhesive for transparent electrode, touch panel, image display device, and method for manufacturing laminate including adhesive layer |
| JP2014025073A (en) * | 2013-10-08 | 2014-02-06 | Mitsubishi Plastics Inc | Pressure-sensitive adhesive sheet |
| JP2014043546A (en) * | 2012-07-31 | 2014-03-13 | Nitto Denko Corp | Radiation-curable pressure-sensitive adhesive layer and radiation-curable pressure-sensitive adhesive sheet |
| WO2014061774A1 (en) * | 2012-10-19 | 2014-04-24 | リンテック株式会社 | Adhesive sheet for processing electronic component and method for manufacturing semiconductor device |
| WO2014091863A1 (en) * | 2012-12-10 | 2014-06-19 | 日東電工株式会社 | Optical film with adhesive on both sides and method for fabrication of image display device employing same |
| JP2014120624A (en) * | 2012-12-17 | 2014-06-30 | Lintec Corp | Dicing sheet |
| JP2014123728A (en) * | 2013-12-12 | 2014-07-03 | Lintec Corp | Adhesive sheet and method for manufacturing semiconductor device |
-
2015
- 2015-09-03 WO PCT/JP2015/075045 patent/WO2016002974A2/en not_active Ceased
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008201899A (en) * | 2007-02-20 | 2008-09-04 | Nitto Denko Corp | Surface protective adhesive tape for solid-state imaging device and mounting method of solid-state imaging device |
| WO2013136897A1 (en) * | 2012-03-12 | 2013-09-19 | リンテック株式会社 | Back-grind-sheet substrate and adhesive sheet, method for producing substrate and sheet, and method for producing workpiece |
| JP2013221065A (en) * | 2012-04-16 | 2013-10-28 | Nippon Synthetic Chem Ind Co Ltd:The | Acrylic resin composition, acrylic adhesive, adhesive sheet, double-sided adhesive sheet, adhesive for transparent electrode, touch panel, image display device, and method for manufacturing laminate including adhesive layer |
| JP2014043546A (en) * | 2012-07-31 | 2014-03-13 | Nitto Denko Corp | Radiation-curable pressure-sensitive adhesive layer and radiation-curable pressure-sensitive adhesive sheet |
| WO2014061774A1 (en) * | 2012-10-19 | 2014-04-24 | リンテック株式会社 | Adhesive sheet for processing electronic component and method for manufacturing semiconductor device |
| WO2014091863A1 (en) * | 2012-12-10 | 2014-06-19 | 日東電工株式会社 | Optical film with adhesive on both sides and method for fabrication of image display device employing same |
| JP2014120624A (en) * | 2012-12-17 | 2014-06-30 | Lintec Corp | Dicing sheet |
| JP2014025073A (en) * | 2013-10-08 | 2014-02-06 | Mitsubishi Plastics Inc | Pressure-sensitive adhesive sheet |
| JP2014123728A (en) * | 2013-12-12 | 2014-07-03 | Lintec Corp | Adhesive sheet and method for manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016002974A8 (en) | 2016-04-14 |
| WO2016002974A2 (en) | 2016-01-07 |
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