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WO2016002974A3 - Surface protective film - Google Patents

Surface protective film Download PDF

Info

Publication number
WO2016002974A3
WO2016002974A3 PCT/JP2015/075045 JP2015075045W WO2016002974A3 WO 2016002974 A3 WO2016002974 A3 WO 2016002974A3 JP 2015075045 W JP2015075045 W JP 2015075045W WO 2016002974 A3 WO2016002974 A3 WO 2016002974A3
Authority
WO
WIPO (PCT)
Prior art keywords
protective film
surface protective
carboxyl
mass
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/075045
Other languages
French (fr)
Japanese (ja)
Other versions
WO2016002974A8 (en
WO2016002974A2 (en
Inventor
克彦 堀米
知親 富永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014137994A external-priority patent/JP6092161B2/en
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of WO2016002974A2 publication Critical patent/WO2016002974A2/en
Publication of WO2016002974A3 publication Critical patent/WO2016002974A3/en
Publication of WO2016002974A8 publication Critical patent/WO2016002974A8/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

This surface protective film is bonded to optical or electronic members, and is used to protect the surfaces of said members. The surface protective film is provided with a base material and an adhesive layer provided to one surface of the base material. The adhesive layer comprises an energy ray curable adhesive composition containing an acrylic copolymer (A), said acrylic copolymer (A) being formed by copolymerizing monomer components including 5 to 50 mass% of alkyl(meth)acrylate having a C1-2 alkyl group, and either including less than 5 mass% of carboxyl-containing monomers or not including any carboxyl-containing monomers.
PCT/JP2015/075045 2014-07-03 2015-09-03 Surface protective film Ceased WO2016002974A2 (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2014-137994 2014-07-03
JP2014137994A JP6092161B2 (en) 2014-07-03 2014-07-03 Surface protection film
JP2014191337 2014-09-19
JP2014-191337 2014-09-19
JP2015072975 2015-03-31
JP2015-072975 2015-03-31
JP2015098349 2015-05-13
JP2015-098349 2015-05-13

Publications (3)

Publication Number Publication Date
WO2016002974A2 WO2016002974A2 (en) 2016-01-07
WO2016002974A3 true WO2016002974A3 (en) 2016-02-25
WO2016002974A8 WO2016002974A8 (en) 2016-04-14

Family

ID=55020058

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/075045 Ceased WO2016002974A2 (en) 2014-07-03 2015-09-03 Surface protective film

Country Status (1)

Country Link
WO (1) WO2016002974A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108475142B (en) * 2016-01-19 2021-05-11 富士胶片株式会社 Conductive film laminate

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008201899A (en) * 2007-02-20 2008-09-04 Nitto Denko Corp Surface protective adhesive tape for solid-state imaging device and mounting method of solid-state imaging device
WO2013136897A1 (en) * 2012-03-12 2013-09-19 リンテック株式会社 Back-grind-sheet substrate and adhesive sheet, method for producing substrate and sheet, and method for producing workpiece
JP2013221065A (en) * 2012-04-16 2013-10-28 Nippon Synthetic Chem Ind Co Ltd:The Acrylic resin composition, acrylic adhesive, adhesive sheet, double-sided adhesive sheet, adhesive for transparent electrode, touch panel, image display device, and method for manufacturing laminate including adhesive layer
JP2014025073A (en) * 2013-10-08 2014-02-06 Mitsubishi Plastics Inc Pressure-sensitive adhesive sheet
JP2014043546A (en) * 2012-07-31 2014-03-13 Nitto Denko Corp Radiation-curable pressure-sensitive adhesive layer and radiation-curable pressure-sensitive adhesive sheet
WO2014061774A1 (en) * 2012-10-19 2014-04-24 リンテック株式会社 Adhesive sheet for processing electronic component and method for manufacturing semiconductor device
WO2014091863A1 (en) * 2012-12-10 2014-06-19 日東電工株式会社 Optical film with adhesive on both sides and method for fabrication of image display device employing same
JP2014120624A (en) * 2012-12-17 2014-06-30 Lintec Corp Dicing sheet
JP2014123728A (en) * 2013-12-12 2014-07-03 Lintec Corp Adhesive sheet and method for manufacturing semiconductor device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008201899A (en) * 2007-02-20 2008-09-04 Nitto Denko Corp Surface protective adhesive tape for solid-state imaging device and mounting method of solid-state imaging device
WO2013136897A1 (en) * 2012-03-12 2013-09-19 リンテック株式会社 Back-grind-sheet substrate and adhesive sheet, method for producing substrate and sheet, and method for producing workpiece
JP2013221065A (en) * 2012-04-16 2013-10-28 Nippon Synthetic Chem Ind Co Ltd:The Acrylic resin composition, acrylic adhesive, adhesive sheet, double-sided adhesive sheet, adhesive for transparent electrode, touch panel, image display device, and method for manufacturing laminate including adhesive layer
JP2014043546A (en) * 2012-07-31 2014-03-13 Nitto Denko Corp Radiation-curable pressure-sensitive adhesive layer and radiation-curable pressure-sensitive adhesive sheet
WO2014061774A1 (en) * 2012-10-19 2014-04-24 リンテック株式会社 Adhesive sheet for processing electronic component and method for manufacturing semiconductor device
WO2014091863A1 (en) * 2012-12-10 2014-06-19 日東電工株式会社 Optical film with adhesive on both sides and method for fabrication of image display device employing same
JP2014120624A (en) * 2012-12-17 2014-06-30 Lintec Corp Dicing sheet
JP2014025073A (en) * 2013-10-08 2014-02-06 Mitsubishi Plastics Inc Pressure-sensitive adhesive sheet
JP2014123728A (en) * 2013-12-12 2014-07-03 Lintec Corp Adhesive sheet and method for manufacturing semiconductor device

Also Published As

Publication number Publication date
WO2016002974A8 (en) 2016-04-14
WO2016002974A2 (en) 2016-01-07

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