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WO2014137002A1 - Structure d'articulation par brasage d'une carte de circuits imprimés présentant une excellente caractéristique de décharge de brasage - Google Patents

Structure d'articulation par brasage d'une carte de circuits imprimés présentant une excellente caractéristique de décharge de brasage Download PDF

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Publication number
WO2014137002A1
WO2014137002A1 PCT/KR2013/001831 KR2013001831W WO2014137002A1 WO 2014137002 A1 WO2014137002 A1 WO 2014137002A1 KR 2013001831 W KR2013001831 W KR 2013001831W WO 2014137002 A1 WO2014137002 A1 WO 2014137002A1
Authority
WO
WIPO (PCT)
Prior art keywords
external connection
connection terminal
fpcb
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2013/001831
Other languages
English (en)
Korean (ko)
Inventor
김영호
오병헌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DREAMTECH Co Ltd
Original Assignee
DREAMTECH Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DREAMTECH Co Ltd filed Critical DREAMTECH Co Ltd
Publication of WO2014137002A1 publication Critical patent/WO2014137002A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes

Definitions

  • the present invention relates to a solder joint structure of a printed circuit board, and more particularly, to extend the solder discharge hole to an optimal size, and to arrange the external connection terminals in a zigzag form to discharge the solder while utilizing a minimum space.
  • the present invention relates to a soldering joint structure of a printed circuit board capable of improving efficiency.
  • components of various functions are mounted on a substrate in a SMD (Surface Mounted Device) method to realize various functions while the size is continuously reduced.
  • SMD Surface Mounted Device
  • a main board of a mobile phone corresponding to a hard area and a board for a universal serial bus (USB) connector corresponding to a flexible area are manufactured as an integrated type by using a connection connector such as a socket.
  • a connection connector such as a socket.
  • the distance between the USB connector and the connector of the main board of the mobile phone is long, and the manufacturing time is relatively increased as well as the hard area and the flexible area are composed of one printed circuit board (PCB).
  • PCB printed circuit board
  • An object of the present invention is to remove the bonding structure between the PCB by soldering each external connection terminal of a hard printed circuit board (PCB) and a flexible printed circuit board (FPCB) separated from each other by fastening with a connection connector.
  • the solder discharge hole can be expanded to an optimal size and the external connection terminals are arranged in a zigzag pattern, so that soldering of the printed circuit board can be achieved while utilizing the minimum space and ensuring excellent solder discharge. It is to provide a bonded structure.
  • Soldering bonding structure of a printed circuit board for achieving the above object is a hard PCB having a hard PCB body, and a first external connection terminal disposed on one end of the hard PCB body;
  • An FPCB body having an FPCB body disposed to face the hard PCB body, a second external connection terminal disposed to overlap the first external connection terminal, and a solder discharge hole passing through the second external connection terminal;
  • the soldering bonding structure of the printed circuit board according to the present invention is a soldering bonding method of the hard PCB and the FPCB which are separated from each other without using a connecting connector such as a socket, the first external connection terminal of the hard PCB and the second external connection terminal of the FPCB.
  • a connecting connector such as a socket
  • the joining structure can be simplified to reduce the manufacturing cost and to improve the production yield by shortening the manufacturing time.
  • solder joint structure of the printed circuit board according to the present invention while extending the solder discharge hole to the optimum size, by aligning the external connection terminals in a zigzag form, the solder discharge efficiency is excellent while utilizing a minimum space Solder bonding can be improved.
  • soldering joint structure of the printed circuit board according to the present invention can be used to design a circuit between the inner layer and the outer layer in a different form by using three or more layers of multilayer substrate as FPCB, inner layer and outer layer circuits
  • FPCB multilayer substrate
  • inner layer and outer layer circuits There is an advantage that the rearrangement of the liver can be freely used to more effectively utilize the area of the junction between the hard PCB and the FPCB.
  • FIG. 1 is a view for explaining a soldering bonded structure of a printed circuit board according to an embodiment of the present invention.
  • FIG. 2 is an enlarged plan view illustrating a portion of the first external connection terminal of FIG. 1.
  • FIG. 3 is an enlarged plan view illustrating a portion of the second external connection terminal of FIG. 1.
  • FIG. 4 is a cross-sectional view taken along line IV-IV 'of FIG. 3.
  • FIG. 5 is an enlarged plan view illustrating a portion A of FIG. 3.
  • Fig. 6 is a plan view showing a two-layer circuit terminal portion of an FPCB made of a multilayer substrate having a triple layer structure.
  • Fig. 7 is a plan view showing a three-layer circuit terminal portion of an FPCB made of a multilayer substrate having a triple layer structure.
  • FIG. 8 is a cross-sectional view taken along the line VIII-VIII ′ of FIG. 6.
  • FIG. 1 is a view illustrating a soldering joint structure of a printed circuit board according to an exemplary embodiment of the present invention
  • FIGS. 2 and 3 are plan views showing enlarged first and second external connection terminal portions of FIG. 1, respectively.
  • 4 is a cross-sectional view taken along the line IV-IV 'of FIG. 3.
  • the soldering bonding structure 100 of the printed circuit board according to the embodiment of the present invention shown is a hard printed circuit board (PCB) 120, a flexible printed circuit board (FPCB) 140, and And solder 160.
  • PCB hard printed circuit board
  • FPCB flexible printed circuit board
  • And solder 160 the soldering bonding structure 100 of the printed circuit board according to the embodiment of the present invention is electrically connected to the hard PCB 120 and the FPCB 140 by the solder 160 is separated from each other.
  • the hard PCB 120 includes a hard PCB body 122 and a first external connection terminal 125 disposed at one end of the hard PCB body 122.
  • the hard PCB body 122 has a first surface 120a and a second surface 120b opposite to the first surface 120a.
  • the first external connection terminal 125 is disposed at one end of the first surface 120a of the hard PCB body 122.
  • the hard PCB 120 may be, for example, a main board for a mobile phone, but is not necessarily limited thereto, and may be a substrate of various electronic devices. In this case, various components such as a driving element, a transistor, and a resistor may be mounted on the first surface 120a of the hard PCB body 122.
  • the FPCB 140 includes an FPCB body 142 disposed to face the hard PCB body 122, a second external connection terminal 145 disposed to overlap with the first external connection terminal 125, and a second external connection.
  • the solder discharge hole SH penetrates through the connection terminal 145.
  • the FPCB body 142 has a third surface 140a facing the first surface 120a of the hard PCB body 122 and a fourth surface 140b opposite to the third surface 140a.
  • the second external connection terminal 145 is disposed at one end of the third surface 140a of the FPCB body 142 and overlaps the first external connection terminal 125.
  • the solder discharge hole SH is formed to penetrate the second external connection terminal 145.
  • the FPCB 140 may be, for example, a substrate for a universal serial bus (USB) connector, but is not necessarily limited thereto.
  • USB universal serial bus
  • the FPCB 140 may be a rigid flexible printed circuit board.
  • Rigid flexible printed circuit boards have low contact resistance and short wiring lengths, which is advantageous for high-speed response.
  • the rigid flexible printed circuit board can be designed three-dimensional circuit to reduce the size of the product.
  • the solder 160 is interposed in the space between the first external connection terminal 125 of the hard PCB 120 and the second external connection terminal 145 of the FPCB 140 to connect the first external connection of the hard PCB 120. It serves to directly connect the terminal 125 and the second external connection terminal 145 of the FPCB 140.
  • Soldering bonding structure 100 of the printed circuit board according to the embodiment of the present invention described above is a hard PCB (hard PCB 120 and FPCB 140) to be separated from each other without using a connection connector such as a socket by a hard PCB ( By directly bonding the first external connection terminal 125 of the 120 and the second external connection terminal 145 of the FPCB 140 to be electrically connected selectively, the connection structure is simplified to reduce manufacturing costs. The production yield can be improved by shortening the manufacturing time.
  • each of the first and second external connection terminals 125 and 145 has an array structure of one or more rows in plan view, and is arranged in the same column in a zigzag form. Arranged to have a symmetrical structure.
  • Each of the first and second external connection terminals 125 and 145 is preferably designed to be 10 to 30. 2 and 3 illustrate an example in which each of the first and second external connection terminals 125 and 145 has an array structure of two columns.
  • first external connection terminals 125 are spaced apart from each other at a first interval d1, and a plurality of second external connection terminals 145 are equal to the first interval d1. Spaced apart from each other at a second interval d2.
  • the first external connection terminal 125 and the second external connection terminal 145 are designed to be symmetrical with each other, and are connected to correspond to each other during the bonding process.
  • each of the first interval d1 and the second interval d2 is preferably designed to 50 ⁇ 200 ⁇ m.
  • the separation distance between the plurality of first external connection terminals 125 and the plurality of second external connection terminals 145 are different from each other. Too narrow a relationship may cause a problem of shorting between adjacent terminals in the soldering process.
  • the plurality of first external connection terminals 125 and the plurality of second external connection terminals 145 are mutually different. Due to the fact that the liver is designed at more than necessary intervals, it is impossible to design a microcircuit, which may cause difficulty in implementing the integration.
  • the vertical gap between the hard PCB 120 and the FPCB 140 is preferably designed to be 100 ⁇ m or less.
  • FIG. 5 is an enlarged plan view illustrating a portion A of FIG. 3 and will be described with reference to FIG. 4.
  • the second external connection terminal 145 has a body portion 145a having a first width and a branch portion having a second width extending from the body portion 145a and narrower than the first width. 145b.
  • the solder discharge hole SH may be formed to penetrate the center of the second external connection terminal body 145a to be arranged in a zigzag form that is alternately arranged to correspond to the top and bottom of the second external connection terminal 145. Can be.
  • solder discharge hole As in the present invention, when forming a solder discharge hole (SH) penetrating through the FPCB body 142 disposed at a position corresponding to the second external connection terminal 145 and the second external connection terminal 145, soldering During the process, the solder 160 interposed between the first external connection terminal 125 and the second external connection terminal 145 is smoothly discharged to the outside of the FPCB body 142 through the inside of the solder discharge hole SH. There is an advantage that the source can be prevented from occurring badly.
  • SH solder discharge hole
  • solder discharge hole (SH) may be designed in any one shape selected from a circle, an ellipse, a polygon, etc. Among these, elliptical is most advantageous in terms of design processing or solder discharge efficiency.
  • the size of the solder discharge hole SH is adjusted according to the thickness of the FPCB 140, and is interposed between the first and second external connection terminals 125 and 145 according to the size of the solder discharge hole SH. The amount of solder 160 is determined.
  • the solder discharge hole 160 is designed to be expanded to an optimal size, so that the soldering process can be performed in a state in which the space between the hard PCB 120 and the FPCB 140 is minimized. have.
  • the solder discharge hole (SH) is preferably designed to have a width (W) of 0.3 ⁇ 0.5mm and a length (L) of 0.7 ⁇ 0.9mm, which is the case of the FPCB 140 having a thickness of 0.25mm or more, This is because it is possible to secure excellent solder discharge during the soldering process while minimizing the space at the junction between the first external connection terminal 125 and the second external connection terminal 145 to a minimum.
  • the width W of the solder discharge hole SH is less than 0.3 mm or the length L is less than 0.7 mm, the solder interposed between the first and second external connection terminals 125 and 145 ( It is difficult to secure a sufficient area for the 160 to be discharged, which may cause a problem in which the solder 160 invades adjacent terminals and causes a short failure.
  • the width W of the solder discharge hole SH exceeds 0.5 mm or the length L exceeds 0.9 mm, the area of the solder discharge hole SH is excessively designed, which is limited. Since the area of the second external connection terminal 145 designed in the space becomes inevitably narrow, it may cause a problem that the reliability of the electrical conductivity of the second external connection terminal 145 is deteriorated.
  • FIG. 6 is a plan view showing a two-layer circuit terminal portion of an FPCB made of a multilayer substrate having a triple layer structure
  • FIG. 7 is a plan view showing a three-layer circuit terminal portion of an FPCB made of a multilayer substrate having a triple layer structure
  • 8 is a cross-sectional view taken along the line VIII-VIII ′ of FIG. 6.
  • the FPCB 140 according to the present invention may be formed of a multilayer substrate having three or more layers.
  • the FPCB 140 including three or more multilayer substrates may further include an internal electrode pad 146, a through via 147, and a rearranged wiring 148.
  • the inner electrode pad 146 is formed inside the FPCB body 142.
  • the internal electrode pads 146 may be formed on two and three layers of the multilayer substrate, respectively.
  • the internal electrode pads 146 are disposed at the same positions as the second external connection terminals 145 and receive the same signal.
  • the through via 147 is formed to penetrate the second external connection terminal 145, the FPCB body 142, and the internal electrode pad 146, respectively, to pass through the second external connection terminal 145 and the internal electrode pad 146. It is an electrical connection.
  • the through via 147 carries the role of the solder discharge hole SH.
  • the rearrangement wiring 148 is branched from the internal electrode pad 146 and the second external connection terminal 145, respectively, and serves to rearrange the electrical connections therebetween.
  • the rearranged wiring 148 may be rearranged in a desired shape in a space between the internal electrode pads 146 and the second external connection terminals 145 in plan view.
  • the FPCB 140 made of a multi-layered substrate having three or more layers may be able to design circuits between the inner layer and the outer layer in a different form through the rearrangement wiring 148, thereby freeing the position movement between the inner layer and the outer layer circuits.
  • the area of the junction between the hard PCB 120 and the FPCB 140 may be more effectively utilized.
  • the soldering joint structure of the printed circuit board according to the exemplary embodiment of the present invention is a first external connection terminal of the hard PCB by soldering a hard PCB and a FPCB separated from each other without using a connection connector such as a socket.
  • soldering joint structure of the printed circuit board according to the present invention while extending the solder discharge hole to the optimum size, by arranging the external connection terminals in a zigzag form to ensure excellent solder discharge properties while utilizing a minimum space There is an advantage to this.
  • soldering joint structure of the printed circuit board according to the present invention can be used to design a circuit between the inner layer and the outer layer in a different form by using three or more layers of multilayer substrate as FPCB, inner layer and outer layer circuits Free rearrangement of the liver allows more effective utilization of the area of the junction between the hard PCB and the FPCB.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne une structure d'articulation par brasage d'une carte de circuits imprimés comprenant : une carte de circuits imprimés dure étant constituée d'un corps de carte de circuits imprimés dure et une première borne de connexion externe placée à une partie d'extrémité latérale du corps de la carte de circuits imprimés dure ; une carte de circuits imprimés dure souple étant constituée d'un corps de carte de circuits imprimés dure souple agencé de sorte à faire face à la carte de circuits imprimés dure et une seconde borne de connexion externe placée de façon à chevaucher la première borne de connexion externe, et un trou de décharge de brasage pénétrant la seconde borne de connexion externe ; et un brasage pour connecter électriquement la première borne de connexion externe de la carte de circuits imprimés dure avec la seconde borne de connexion externe de la carte de circuits imprimés dure souple, caractérisé en ce que le trou de décharge de brasage présente une largeur de 0,3-0,5 mm et une longueur de 0,7-0,9 mm.
PCT/KR2013/001831 2013-03-05 2013-03-07 Structure d'articulation par brasage d'une carte de circuits imprimés présentant une excellente caractéristique de décharge de brasage Ceased WO2014137002A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0023525 2013-03-05
KR1020130023525A KR101313684B1 (ko) 2013-03-05 2013-03-05 솔더 배출성이 우수한 인쇄회로기판의 솔더링 접합 구조

Publications (1)

Publication Number Publication Date
WO2014137002A1 true WO2014137002A1 (fr) 2014-09-12

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Application Number Title Priority Date Filing Date
PCT/KR2013/001831 Ceased WO2014137002A1 (fr) 2013-03-05 2013-03-07 Structure d'articulation par brasage d'une carte de circuits imprimés présentant une excellente caractéristique de décharge de brasage

Country Status (2)

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KR (1) KR101313684B1 (fr)
WO (1) WO2014137002A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230020700A (ko) 2021-08-04 2023-02-13 동우 화인켐 주식회사 패키지 기판, 안테나 패키지 및 이를 포함하는 화상 표시 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06326439A (ja) * 1993-05-17 1994-11-25 Ricoh Co Ltd 印刷配線板の端子構造および接続方法
KR19990014011A (ko) * 1997-07-22 1999-02-25 카나이 쯔또무 액정표시장치
JP2001168525A (ja) * 1999-12-14 2001-06-22 Fuji Kiko Denshi Kk 端面スルホール付きプリント配線板の製造方法
KR20090083238A (ko) * 2008-01-29 2009-08-03 엘지전자 주식회사 휴대 단말기

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06326439A (ja) * 1993-05-17 1994-11-25 Ricoh Co Ltd 印刷配線板の端子構造および接続方法
KR19990014011A (ko) * 1997-07-22 1999-02-25 카나이 쯔또무 액정표시장치
JP2001168525A (ja) * 1999-12-14 2001-06-22 Fuji Kiko Denshi Kk 端面スルホール付きプリント配線板の製造方法
KR20090083238A (ko) * 2008-01-29 2009-08-03 엘지전자 주식회사 휴대 단말기

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