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WO2014073813A1 - Interposeur et méthode de fabrication de celui-ci - Google Patents

Interposeur et méthode de fabrication de celui-ci Download PDF

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Publication number
WO2014073813A1
WO2014073813A1 PCT/KR2013/009630 KR2013009630W WO2014073813A1 WO 2014073813 A1 WO2014073813 A1 WO 2014073813A1 KR 2013009630 W KR2013009630 W KR 2013009630W WO 2014073813 A1 WO2014073813 A1 WO 2014073813A1
Authority
WO
WIPO (PCT)
Prior art keywords
terminal
housing
interposer
substrate
outside
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2013/009630
Other languages
English (en)
Korean (ko)
Inventor
신희석
임종개
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CNPLUS Co Ltd
Original Assignee
CNPLUS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CNPLUS Co Ltd filed Critical CNPLUS Co Ltd
Publication of WO2014073813A1 publication Critical patent/WO2014073813A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers

Definitions

  • the present invention relates to an interposer and a method of manufacturing the same, and to an interposer having a structure capable of simplifying a manufacturing process and preventing deformation of a terminal and a method of manufacturing the same.
  • a board-to-board type connector is used to implement an electrical connection between an external device and a printed circuit board.
  • This board-to-board connector electrically connects a printed circuit board with a flexible printed circuit board (“FPCB") containing a conductive pattern.
  • FPCB flexible printed circuit board
  • the connector used to electrically connect the FPCB to the printed circuit board has a problem that the electronic device to which the connector is mounted is bulky because the connector is relatively bulky.
  • an interposer mounted to an external device, of course, which is directly mounted on a printed circuit board and electrically connected to a pattern of the printed circuit board without using a connector having the above problem, It is used.
  • This interposer is electrically connected with the pattern of the printed circuit board by a clamp mounted on the printed circuit board (eg, the "surface mounted clamp” of patent application No. 10-2012-0115618 filed by the applicant). It is fixedly connected.
  • An object of the present invention is to provide an interposer having a structure in which the terminal is not separated from the housing as well as the elasticity of the terminal can be maintained even when the external force is repeatedly applied to the terminal.
  • Still another object of the present invention is to provide a manufacturing method capable of simply manufacturing an interposer having the above functional and structural features.
  • the terminal is composed of a fixing part exposed to the outside of the housing in the state fixed to the housing and a junction extending from the fixing part.
  • the housing includes a terminal exposed space, the terminal exposed space at a predetermined distance from other adjacent terminal exposed space, the top and bottom are open to expose the junction of the terminal to the outside.
  • the housing may further include a connection space disposed between two adjacent terminal exposure spaces.
  • solder balls are formed on the upper surface of the fixing part of each terminal exposed to the outside of the housing so that the terminals are electrically connected to the pattern of the substrate through the solder balls.
  • a method of manufacturing an interposer mounted on an external substrate through a clamp includes manufacturing a terminal assembly having a structure in which a terminal is connected to a frame; After disposing the terminal assembly on the mold, integrally forming the housing in the terminal assembly in a state of discharging a portion of the fixing portion of the terminal and the joint to the outside through a molding process; Removing the frame of the terminal assembly through a cutting process to separate the housing with each terminal independently disposed therein; And bonding the terminal to the conductive pattern of the substrate.
  • the terminal assembly used in the method of the present invention may consist of an outer frame and a connecting frame connecting adjacent terminals disposed inside the outer frame and connecting the outermost terminal to the outer frame.
  • the housing manufactured by the method of the present invention is a connection space disposed between a terminal exposure space for exposing a portion of the terminal to the outside and two adjacent terminal exposure spaces for exposing a portion of the connection frame of the terminal assembly to the outside. It includes.
  • the housing separation step may be performed through a cutting and removing process of the connection frame and the outer frame of the terminal assembly exposed to the outside through the connection space of the housing.
  • bonding the terminal to the conductive pattern of the substrate may comprise forming solder balls on a fixed portion of the terminal exposed out of the housing; And electrically connecting the fixing part of the terminal and the conductive pattern through the solder ball, so that the final interposer is manufactured.
  • the interposer according to the present invention as described above can maintain the shape without changing the elasticity of the terminal even when the external force is repeatedly acting, and also the bonding state of the housing and the terminal is not released.
  • the interposer according to the present invention can obtain an insulation effect between terminals without including a component such as an insulating tape.
  • the interposer manufacturing method according to the present invention can simply manufacture an interposer having the above functional and structural features.
  • FIG. 1 is a partial cross-sectional view showing a portion of an interposer according to an embodiment of the present invention.
  • FIG. 2 is a perspective view of the housing shown in FIG. 1.
  • FIG. 2 is a perspective view of the housing shown in FIG. 1.
  • 3a to 3c show step by step an interposer manufacturing method according to the invention.
  • FIG. 1 is a partial cross-sectional view showing a part of an interposer according to an embodiment of the present invention, and shows only a portion electrically connected to a printed circuit board (not shown) for convenience. Meanwhile, in FIG. 1, components in contact with each other are illustrated in a separated state in order to clearly illustrate each component.
  • the interposer 100 includes a flexible printed circuit board 110 (hereinafter referred to as “FPCB”) including a conductive pattern 112 formed on a surface and a contact 111 formed at an end of the conductive pattern 112. And a plurality of terminals 400 fixedly disposed within the housing 200 and a housing 200 positioned below the FPCB 110.
  • FPCB flexible printed circuit board 110
  • the structure and function of the FPCB 110 is the same as the structure and function of the FPCB constituting the general interposer, and thus description thereof will be omitted.
  • FIG. 2 is a perspective view of the housing 200 shown in FIG. 1, and for convenience, the terminal 400 of FIG. 1 is not illustrated.
  • FIG. 1 illustrates only a part of the plurality of terminal exposure spaces 210 in which a part of the terminal 400 is exposed, unlike FIG. 2.
  • the housing 200 made of an insulating material includes, for example, a plurality of terminal exposing spaces 210 arranged in a matrix form, each terminal exposing space 210 being disposed at a predetermined distance from other adjacent terminal exposing spaces. do.
  • the arrangement of the plurality of terminal exposed spaces 210 should be determined according to the arrangement of the contacts 111 of the FPCB 110 and the alignment of the conductive patterns of the external printed circuit board.
  • Each terminal 400 is fixedly located in an area adjacent the terminal exposure space 210 of the housing 200.
  • the terminal 400 extends from the fixing part 410 and the fixing part 410 fixed in the housing 200 to expose the curved portion exposed through the terminal exposure space 210 of the housing 200.
  • the shape of the terminal 400 is not limited thereto.
  • the terminal exposed space 210 of the housing 200 is open at the top and bottom, so as shown in Figure 1 of the terminal 400 is fixed to the adjacent area of the terminal exposed space 210 Some, in particular junction 420, are exposed at the bottom of the housing 200 outside.
  • a portion of the upper portion of the housing 200 corresponding to the fixing portion 410 of the terminal 400 is removed, and thus a portion of the upper surface of the fixing portion 410 of the terminal 400 is exposed to the outside.
  • Solder balls (300 of FIG. 1) are disposed at an upper end of a portion of the housing 200, that is, an area corresponding to the fixing part 410 of the terminal 400.
  • the lower end of the solder ball 300 is in contact with the exposed upper surface of the fixing part 410 of the terminal 400, and the upper end is joined to the corresponding contact 111 formed in the plane of the FPCB 100 (wherein “ “Top” and “bottom” are based on drawings). Accordingly, each terminal 400 is electrically connected to the conductive pattern 111 of the FPCB 110 through the solder ball 300.
  • the interposer 100 having such a structure is fixed by a clamp, and the junction 420 of the terminal 400 exposed to the outside through the terminal exposure space 210 of the housing 200 is electrically conductive on the external printed circuit board. It is electrically connected with an external printed circuit board by contacting / joining with the pattern / contact.
  • the housing 200 includes a connection space 211 disposed between two adjacent terminal exposure spaces 210.
  • the function of this connection space 211 formed in the housing 200 will be described later.
  • the plurality of terminals 400 are independently disposed at predetermined intervals in a housing 200 made of an insulating material, and in particular, a junction part 420 bonded to an external printed circuit board. ) Is exposed to the outside of the housing 200. Therefore, unlike the structure in which all parts of the terminal are exposed to the outside, no contact between neighboring terminals 400 occurs.
  • the interposer 100 since a plurality of terminals 400 are disposed in an insulated state in the insulating housing 200 which functions as a substrate, it is necessary to separately use an additional insulating member such as insulating tape. There is no.
  • the terminal 400 is fixedly located in the housing 200 except for a portion (that is, the junction portion 420) connecting to the external printed circuit board.
  • a portion that is, the junction portion 420
  • the terminal 400 remains in the housing 200. It is not separated from the interposer, and thus the interposer 100 can maintain a normal structure.
  • the structure of the FPCB 110 is the same as the FPCB constituting a general interposer, and therefore will be described below focusing on the manufacturing process of the assembly of the housing 200 and the terminal 400.
  • 3A to 3C are diagrams showing step by step methods of manufacturing an interposer according to the present invention.
  • 3B and 3C show the terminal assembly 410 and the housing 200 upside down in order to clearly show the shape of the terminal 400.
  • a terminal assembly 410 in which a plurality of terminals 400 are arranged in a matrix through a pressing process is manufactured (FIG. 3A).
  • the terminal assembly 410 is made of a metal material, the outer frame 411 of the polygon, the plurality of terminals 400, the plurality of terminals 400 disposed inside the outer frame 411, the outer frame 411 And a connection frame 412 for connecting thereto. Meanwhile, the surface of each terminal 400 may be coated with a material having excellent conductivity.
  • connection frame 412 is divided into a connection frame for connecting two adjacent terminals 400 and a connection frame for connecting the terminal 400 to the outer frame 411.
  • the housing 200 is integrally formed with the terminal assembly 410 through a molding process, preferably an insert injection process (state of FIG. 3B).
  • the mold is designed such that a housing 200 having the shape shown in FIG. 2 is manufactured.
  • the design of such a mold is known to those skilled in the art of injection molding, and thus description thereof is omitted.
  • the housing 200 is located inside the central area of the terminal assembly 410, ie the outer frame 411 in which the terminal 400 is aligned and the connecting frame 412 is arranged.
  • each terminal 400 and the connection frame 412 are exposed to the outside through the terminal exposure space 210 and the connection space 211 formed in the housing 200, respectively.
  • the outer frame 411 and the connection frame 412 are removed through a cutting process. That is, the connecting frame 412 connected to the outer frame 411 through the cutting tool is removed, and also through the connecting space 211 formed between the terminal exposed space 210 of the housing 200 to the outside of the housing 200.
  • the housing 200 shown in FIG. 3C is finally manufactured by removing the connecting frame 412 connecting the two adjacent, adjacent terminals 400.
  • a fixing part (410 of FIG. 1) of each terminal 400 is fixed, and the bonding part (420 of FIG. 1) is exposed to the outside through the terminal exposure space 210. (Of course, as described above, the upper surface of the fixing portion of the terminal 400 is exposed to the outside).
  • Solder balls (300 of FIG. 1) are formed on a predetermined area of the assembly of the housing 200 and the terminal 400 manufactured as described above, that is, the housing 200 in which the fixing part of each terminal 400 is exposed.
  • the interposer 100 having the structure as shown in FIG. 1 is finally manufactured.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

La présente invention concerne un interposeur qui ne présente aucun changement d'élasticité de borne, maintient une forme et évite la séparation entre la borne et un logement même lorsqu'une force extérieure est appliquée répétitivement à une borne, et une méthode de fabrication de celui-ci. L'interposeur de la présente invention comprend : un substrat dans lequel de multiples motifs conducteurs sont formés ; un logement fabriqué dans un matériau isolant et agencé dans un état correspondant au substrat ; et au moins une borne qui est agencée indépendamment dans l'espace intérieur du logement, dont une zone partielle est exposée à l'extérieur du logement de façon à être raccordée électriquement au motif conducteur et dans laquelle l'autre zone partielle est exposée à l'extérieur du logement de façon à être raccordée électriquement à un substrat extérieur. En cela, la borne est conçue de façon qu'une zone partielle d'une partie fixe soit exposée à l'extérieur du logement tout en étant fixée au logement et une partie de collage part de la partie fixe. De plus, le logement a un espace d'exposition de borne. L'espace d'exposition de borne maintient un interstice prédéterminé avec un autre espace d'exposition de borne qui lui est adjacent, et l'extrémité supérieure et l'extrémité inférieure de celui-ci sont ouvertes de façon à exposer la partie de collage de la borne à l'extérieur.
PCT/KR2013/009630 2012-11-12 2013-10-28 Interposeur et méthode de fabrication de celui-ci Ceased WO2014073813A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120127543A KR101425931B1 (ko) 2012-11-12 2012-11-12 인터포저 및 그 제조 방법
KR10-2012-0127543 2012-11-12

Publications (1)

Publication Number Publication Date
WO2014073813A1 true WO2014073813A1 (fr) 2014-05-15

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PCT/KR2013/009630 Ceased WO2014073813A1 (fr) 2012-11-12 2013-10-28 Interposeur et méthode de fabrication de celui-ci

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KR (1) KR101425931B1 (fr)
WO (1) WO2014073813A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI860220B (zh) * 2023-12-29 2024-10-21 利鴻科技股份有限公司 微型連接機構的製作方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101613512B1 (ko) * 2014-08-25 2016-04-19 주식회사 씨엔플러스 인터포저 조립체
CN110739585B (zh) 2018-07-20 2023-09-05 富加宜（美国）有限责任公司 具有反冲件的高频连接器
WO2020150218A1 (fr) 2019-01-14 2020-07-23 Amphenol Corporation Ensemble de raccordement de câbles de carte intermédiaire
US11404811B2 (en) 2019-01-14 2022-08-02 Amphenol Corporation Small form factor interposer
CN113258325A (zh) 2020-01-28 2021-08-13 富加宜（美国）有限责任公司 高频中板连接器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100698542B1 (ko) * 2005-12-16 2007-03-21 한국몰렉스 주식회사 이동통신단말기의 듀얼카드형 커넥터의 접속단자 제조방법
KR100725542B1 (ko) * 2005-12-01 2007-06-08 삼성전자주식회사 인터포저 조립체
KR20090071393A (ko) * 2007-12-27 2009-07-01 타이코 일렉트로닉스 에이엠피 케이.케이. 콘택트 및 인터포저

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100725542B1 (ko) * 2005-12-01 2007-06-08 삼성전자주식회사 인터포저 조립체
KR100698542B1 (ko) * 2005-12-16 2007-03-21 한국몰렉스 주식회사 이동통신단말기의 듀얼카드형 커넥터의 접속단자 제조방법
KR20090071393A (ko) * 2007-12-27 2009-07-01 타이코 일렉트로닉스 에이엠피 케이.케이. 콘택트 및 인터포저

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI860220B (zh) * 2023-12-29 2024-10-21 利鴻科技股份有限公司 微型連接機構的製作方法

Also Published As

Publication number Publication date
KR20140062550A (ko) 2014-05-26
KR101425931B1 (ko) 2014-08-06

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