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WO2012092991A1 - Procédé de fabrication d'un circuit électronique, cylindre compresseur et procédé de fabrication correspondant - Google Patents

Procédé de fabrication d'un circuit électronique, cylindre compresseur et procédé de fabrication correspondant Download PDF

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Publication number
WO2012092991A1
WO2012092991A1 PCT/EP2011/069548 EP2011069548W WO2012092991A1 WO 2012092991 A1 WO2012092991 A1 WO 2012092991A1 EP 2011069548 W EP2011069548 W EP 2011069548W WO 2012092991 A1 WO2012092991 A1 WO 2012092991A1
Authority
WO
WIPO (PCT)
Prior art keywords
pressure roller
layer
substrate
elastically
surface layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2011/069548
Other languages
German (de)
English (en)
Inventor
Steffen Polster
Erhard Hirth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of WO2012092991A1 publication Critical patent/WO2012092991A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon

Definitions

  • the invention relates to a method of manufacturing an electronic circuit comprising a plurality of circuit elements of predetermined cross-section on a circuit substrate.
  • the flexographic printing also allows the required layer thicknesses in the range of a few nm to a few ⁇ and is also applicable for rigid substrates.
  • a disadvantage of this process is the poor reproducibility of the material transfer in relation to the abovementioned processes and the inhomogeneity within a printed image (called a "squeeze margin")
  • the ink transfer from the tampon to the substrate by the squeezing of the ink by the surface pressure in this step is critical to the imaging accuracy of the printing form on the substrate over the tampon.
  • An alternative to the printing techniques for rigid substrates are spraying methods. Due to the process, it is possible to apply even thin layers homogeneously. Structuring of this coating can be done by masking, whereby lower limits in terms of structure resolution by the
  • Masking be set. Above all, however, depending on the structure, large material losses occur on the mask (for example, up to 95% of the surface is not coated in fineline applications, which is uneconomical, especially in the case of expensive functional materials).
  • the invention provides a gravure printing method employing a pressure roll having an elastically compliant surface layer or near-surface layer such that the pressure roll surface conforms to unevenness of the circuit substrate elastically.
  • Pressure cylinder (copper-chrome) is corrected by a change of material to a flexible pressure roller.
  • the pressure roller has a low surface energy cliche material.
  • Suitable z. Example, an ethylene-propylene-Dicn-Monomo (EPDM) with 16 to 18 mN / m surface tension or a silicone rubber with 13 to 15 mN / m surface tension.
  • EPDM ethylene-propylene-Dicn-Monomo
  • silicone rubber with 13 to 15 mN / m surface tension.
  • a rigid and / or brittle substrate and / or substrate structured on the surface to be printed for example a glass, a ceramic or a metal of high hardness
  • a soft impression cylinder since rigid substrates are usually subject to production-related deviations in form (ripple).
  • a hard cylinder does not make contact with the substrate in all areas, and the printed image is transferred incompletely.
  • even brittle substrates glass, silicon, etc.
  • the enclosure of the surface structures can be adjusted.
  • the specific adaptation of the Shore hardness of the printing cylinder depends on the dimension of the surface structure and the desired impression of the impression cylinder. A Shore hardness of 80 ° to 100 ° Shore is to be regarded as A suitable.
  • a pressure roller having at least one polymeric surface layer or polymeric sheath layer close to the surface is used.
  • a polymer printing cylinder can be adapted to the respective substrate to be printed in terms of material hardness.
  • Preferred polymer materials are EPDM and silicone rubber.
  • a pressure roller manufactured as a cylindrical sleeve, so-called SIeeve, with a removable elastically compliant surface layer or sheath layer close to the surface is used.
  • the method is configured as a method for producing an organic solar cell structure.
  • the invention offers significant processing advantages and thus cost advantages.
  • Fig. 3 is a schematic cross-sectional view of another
  • FIG. 4 is a schematic cross-sectional view of a pressure roller according to an embodiment of the invention.
  • Fig. 5 is a schematic cross-sectional view of a pressure roller according to another embodiment of the invention.
  • Fig. 1 shows a greatly enlarged section of the surface of a hard pressure roller 1 of conventional construction, such as chromium-plated copper, with engraving areas 3a, 3b in a printing process over a relatively hard substrate 5 with uneven or structured surface. It can be seen that the contact between the pressure roller surface and the substrate surface is imperfect and the engraving area 3a is partially and the engraving area 3b completely "suspended in the air", thus making possible no or at least no satisfactory transfer of printing paste to the substrate.
  • a hard pressure roller 1 of conventional construction such as chromium-plated copper
  • FIG. 2 shows that a pressure roller 1 'with an elastically soft surface layer in the engraving areas 3a' and 3b 'comes into perfect contact with the surface of the uneven substrate 5 and thus a substantially improved transfer of printing paste to the substrate surface
  • the surface energy or stress of the material from which the surface of the pressure roller is made is set to the lowest possible value (in particular based on the surface energy or stress of the substrate material)
  • a substantially complete transmission takes place
  • FIG. 4 shows in a schematic cross-sectional illustration a multilayered one Pressure roller 10, the next to egg a central mandrel 11 a hard core 13th and at the periphery of which a surface layer 15 made of an elastically yielding material has, which here also serves as a cliché material.
  • the material of the surface layer for example a polymer material, must be selected such that fine engraving in accordance with the structures to be produced on a substrate, in particular reproducibly in a large number of printing operations, is possible.
  • Fig. 5 shows as an alternative embodiment, a pressure roller 10 ', in which on the mandrel 11 removably a relatively soft core 13' is stretched.
  • the roll core 13 ' may have a hardness gradient in the radial direction or (which is not shown in the figure) in turn be composed of a plurality of concentric cylinders made of different materials. He wears a bend-deformable, but relatively hard surface layer 15 'as a cliché.
  • This may be a thin metal layer, which is thick enough to produce the desired engravings and which enables the reproducible production of particularly fine structures on a substrate to be printed (for example of fine circuit traces) on a circuit substrate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Printing Methods (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'un circuit électronique comprenant plusieurs éléments de circuit sur un substrat de circuit qui présentent une section transversale prédéfinie et une épaisseur de couche fonctionnelle de préférence inférieure à 200 nm, au moyen d'un cylindre compresseur. Ledit cylindre compresseur présente une couche de surface à déformation élastique ou une couche proche de la surface, de manière que la surface du cylindre compresseur s'adapte de manière élastique aux irrégularités du substrat de circuit.
PCT/EP2011/069548 2011-01-04 2011-11-07 Procédé de fabrication d'un circuit électronique, cylindre compresseur et procédé de fabrication correspondant Ceased WO2012092991A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011002416.6 2011-01-04
DE201110002416 DE102011002416A1 (de) 2011-01-04 2011-01-04 Verfahren zur Herstellung einer elektronischen Schaltung, Druckwalze und Verfahren zur Herstellung einer solchen

Publications (1)

Publication Number Publication Date
WO2012092991A1 true WO2012092991A1 (fr) 2012-07-12

Family

ID=44993538

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2011/069548 Ceased WO2012092991A1 (fr) 2011-01-04 2011-11-07 Procédé de fabrication d'un circuit électronique, cylindre compresseur et procédé de fabrication correspondant

Country Status (2)

Country Link
DE (1) DE102011002416A1 (fr)
WO (1) WO2012092991A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014223671A1 (de) * 2014-11-20 2016-05-25 Conti Temic Microelectronic Gmbh Niederschlagsdetektor und Verfahren zur Detektion eines Niederschlags

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2115369A1 (en) * 1971-03-30 1972-10-05 Siemens Ag Printed circuits with glass or ceramic platelets - printed with the conducting layer using a silicone rubber layered roller
DE3225483A1 (de) * 1981-11-17 1983-05-26 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zur herstellung elektrisch leitfaehiger bereiche
US4479432A (en) * 1980-05-15 1984-10-30 Toppan Printing Co., Ltd. Thick film printing method
WO2008111765A1 (fr) * 2007-03-09 2008-09-18 Lg Chem, Ltd. Procédé d'impression en creux permettant de produire des motifs fins et système d'impression permettant d'effectuer une telle impression

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2115369A1 (en) * 1971-03-30 1972-10-05 Siemens Ag Printed circuits with glass or ceramic platelets - printed with the conducting layer using a silicone rubber layered roller
US4479432A (en) * 1980-05-15 1984-10-30 Toppan Printing Co., Ltd. Thick film printing method
DE3225483A1 (de) * 1981-11-17 1983-05-26 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zur herstellung elektrisch leitfaehiger bereiche
WO2008111765A1 (fr) * 2007-03-09 2008-09-18 Lg Chem, Ltd. Procédé d'impression en creux permettant de produire des motifs fins et système d'impression permettant d'effectuer une telle impression

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014223671A1 (de) * 2014-11-20 2016-05-25 Conti Temic Microelectronic Gmbh Niederschlagsdetektor und Verfahren zur Detektion eines Niederschlags

Also Published As

Publication number Publication date
DE102011002416A1 (de) 2012-07-05

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