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DE2115369A1 - Printed circuits with glass or ceramic platelets - printed with the conducting layer using a silicone rubber layered roller - Google Patents

Printed circuits with glass or ceramic platelets - printed with the conducting layer using a silicone rubber layered roller

Info

Publication number
DE2115369A1
DE2115369A1 DE19712115369 DE2115369A DE2115369A1 DE 2115369 A1 DE2115369 A1 DE 2115369A1 DE 19712115369 DE19712115369 DE 19712115369 DE 2115369 A DE2115369 A DE 2115369A DE 2115369 A1 DE2115369 A1 DE 2115369A1
Authority
DE
Germany
Prior art keywords
printed
silicone rubber
glass
platelets
conducting layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712115369
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DE19712115369 priority Critical patent/DE2115369A1/en
Publication of DE2115369A1 publication Critical patent/DE2115369A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N10/00—Blankets or like coverings; Coverings for wipers for intaglio printing
    • B41N10/02—Blanket structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N2210/00—Location or type of the layers in multi-layer blankets or like coverings
    • B41N2210/02—Top layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N2210/00—Location or type of the layers in multi-layer blankets or like coverings
    • B41N2210/14—Location or type of the layers in multi-layer blankets or like coverings characterised by macromolecular organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Printing Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Thin layer circuits are printed onto glass or ceramic platelets uniformly and with sufficient thickness by transferring the noble metal/resin paste from the etched block to the platelets using a roller coated with silicone rubber. The rollers and the base for the platelets are pref. heated.

Description

Offset-Tiefdruckwalzo für elektrisch leitepde Schichtumuster Die Erfindung betrifft eine Offset-Tiefdruckwalze für elektrisch leitende Schichtumuster, insbesondere zur Hersiellung von dünnen Schichten für Dünnschicht-Schaltungen.Offset-Tiefdruckwalzo for electrically conductive layer pattern The invention relates to an offset gravure roller for electrically conductive layer patterns, in particular for the production of thin layers for thin-film circuits.

Das bekannte Offset-Druckverfahren ist für die Übertragung von clektrisch leitenden Schichten nicht ohne weiteres anwendbar, da die hiermit übertragenen Schichten zu dünn sind und die hohe Präzision, die bei Dünnschicht-Schaltungen erforderlich ist, nicht erreicht wird.The well-known offset printing process is clever for the transfer of conductive layers not readily applicable, as the layers transferred with them are too thin and the high precision required for thin-film circuits is not achieved.

Die französische Patentschrift 1.566.978 beschreibt ein Verfabsen zum Aufdrucken von elekirischen Schaltungen auf Trägorplatten, bei dem zum Ausgleich größerer Unebenheiten ein clastisches, konvexes Druckkissen verwendet wird. Die Übertragungsfäbigkeit der Druckpaste wird dabei durch Zugabe von zyklisehem Polymothylsiloxan verbessert. Dieses Verfahren kann beim Bedrucken dünner, ebener Glas- oder Keramikplättchan zum Zerbrechen der Plättchen führen.French patent 1,566,978 describes a method for printing electrical circuits on carrier plates, with which to compensate larger bumps a clastic, convex pressure pad is used. the The transferability of the printing paste is determined by adding cyclic polymothylsiloxane improved. This process can be used when printing on thin, flat glass or ceramic plates lead to breakage of the platelets.

Die Aufgabe, die unserer Erfindung zugrunde liegt, ist das Bedrucken dünner, ebener Glas- oder Keramikplättchen mit Edelmetail-Resinat-Paste in schneller Zeitfolg bei geringem Druck.The task on which our invention is based is printing thin, flat glass or ceramic plates with precious metal resinate paste in quicker Time sequence with little pressure.

Diese Aufgabe wird dadurch gcjöst, daß eine Druckvorrichtung zur Übertragung der Resinat-Paste von dem geätzten Klischee auf das Druckgut mit einer Walze ausgerüstet ist, daren zur Überteagung dienende elastische Schicht aus Silikonkautschuk bestekt.This object is achieved in that a printing device for transmission the resinate paste from the etched cliché onto the printing material with a roller is equipped with an elastic layer made of silicone rubber that is used for transmission.

Die erfindungsgemäße Vorrichtung bietet dadurch Vorteile, daß sich die Resinat-Paste beim Umdrucken vollständig von der Walze löst, ohne daß dazu dem Resinat Silikone suge setzt werden müssen, welche beim Einbrennen des Re.sinats störende Einflüsse auf die Schichteigenschaften ausüben können, und daß stets nur eb begrenzter Bereich des T gerplättchens zum bedrucken mit Resinat-Paste einem relativ geringen Druck ausgesetzt werden muß.The device according to the invention offers advantages in that the resinate paste completely dissolves from the roller during transfer printing without the Resinat silicones must be set carefully, which when firing the resin can exert disturbing influences on the layer properties, and always only eb limited area of the T ger plate for printing with resinate paste must be exposed to relatively low pressure.

Eine Beschleunigung des Druckvorganges wird dadurch erreicht, daß die Walze mit einer Heizung versehen ist und daß auch die Auflageflächen für die Trägerplättchen heizbar ausgebildet sind. Diese Ausführungen bieten Vorteile, da ein Verlaufen der Resinat-Paste verhindert und damit die Präzision des aufgedruckten Musters erhöht wird.An acceleration of the printing process is achieved in that the roller is provided with a heater and that the support surfaces for the Carrier plates are designed to be heatable. These designs offer advantages because The resinate paste does not run and thus the precision of the printed Pattern is increased.

Die Erfindung wird im folgenden anhand einer Zeichnung näher erläutert. Sie ist nicht auf das in der Figur gezeigte Beispiel beschränkt.The invention is explained in more detail below with reference to a drawing. It is not limited to the example shown in the figure.

Eipe Walze í besitzt eqne elastische Schicht aus Silikonkautschuk 2 und einen durch eine Heizung mit den Anschlüssen 3 und 4 heizbaren Walzenkern 5.Eipe roller í has an elastic layer made of silicone rubber 2 and a roller core that can be heated by a heater with connections 3 and 4 5.

1 Figur 3 Patentansprüche1 Figure 3 claims

Claims (3)

Patentansnrüche 1. Vorrichtung zum Bedrucken von dünnen, ebenen Glas- oder Keramikplättchen mit Edelmetall-Resinat-Paste, dad u r c h g e k e n n z e i c ii n e t t daß sie zur Übertragung der Resinat-Paste von einem geätzten Klischee auf dss Druckgut mit einer Walse ausgerüstet ist, deren zur Übertragung dienende elastische Schicht aus Silikonlautschuk besteht. Claims 1. Device for printing thin, flat glass or ceramic platelets with precious metal resinate paste i c ii n e t t they used to transfer the resinate paste from an etched cliché on dss print material is equipped with a barrel, whose serving for the transfer elastic layer made of silicone rubber. 2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß die Walze mit einer Heizung verschen ist. 2. Apparatus according to claim 1, characterized in that the roller is given away with a heater. 3. Vorrichtung nach Anspruch 1 oder 2, dadurch gek e n n z e 1 C h n e t daß die Auflageflächen für die Trägerplättchen aufheizbar ausgebildet sind. 3. Apparatus according to claim 1 or 2, characterized in that it is 1C h n e t that the bearing surfaces for the carrier plates are designed to be heatable. LeerseiteBlank page
DE19712115369 1971-03-30 1971-03-30 Printed circuits with glass or ceramic platelets - printed with the conducting layer using a silicone rubber layered roller Pending DE2115369A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19712115369 DE2115369A1 (en) 1971-03-30 1971-03-30 Printed circuits with glass or ceramic platelets - printed with the conducting layer using a silicone rubber layered roller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712115369 DE2115369A1 (en) 1971-03-30 1971-03-30 Printed circuits with glass or ceramic platelets - printed with the conducting layer using a silicone rubber layered roller

Publications (1)

Publication Number Publication Date
DE2115369A1 true DE2115369A1 (en) 1972-10-05

Family

ID=5803248

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712115369 Pending DE2115369A1 (en) 1971-03-30 1971-03-30 Printed circuits with glass or ceramic platelets - printed with the conducting layer using a silicone rubber layered roller

Country Status (1)

Country Link
DE (1) DE2115369A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3631058A1 (en) * 1986-09-12 1988-03-24 Preh Elektro Feinmechanik METHOD FOR PRODUCING GUIDANCE AND / OR RESISTANCE TRACKS ON A SUBSTRATE AND POTENTIOMETER PRODUCED BY THIS METHOD
DE19649116A1 (en) * 1996-11-27 1998-05-28 Gundokar Braumann Housing or circuit board with conductive structure e.g. for computer housing
WO2012092991A1 (en) * 2011-01-04 2012-07-12 Robert Bosch Gmbh Method for producing an electronic circuit, printing roller and method for producing same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3631058A1 (en) * 1986-09-12 1988-03-24 Preh Elektro Feinmechanik METHOD FOR PRODUCING GUIDANCE AND / OR RESISTANCE TRACKS ON A SUBSTRATE AND POTENTIOMETER PRODUCED BY THIS METHOD
DE19649116A1 (en) * 1996-11-27 1998-05-28 Gundokar Braumann Housing or circuit board with conductive structure e.g. for computer housing
WO2012092991A1 (en) * 2011-01-04 2012-07-12 Robert Bosch Gmbh Method for producing an electronic circuit, printing roller and method for producing same

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