WO2011036260A3 - Procédé de galvanisation et de passivation - Google Patents
Procédé de galvanisation et de passivation Download PDFInfo
- Publication number
- WO2011036260A3 WO2011036260A3 PCT/EP2010/064167 EP2010064167W WO2011036260A3 WO 2011036260 A3 WO2011036260 A3 WO 2011036260A3 EP 2010064167 W EP2010064167 W EP 2010064167W WO 2011036260 A3 WO2011036260 A3 WO 2011036260A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- metal
- deposition
- immersed
- galvanizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
- C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
L'invention vise à mettre en oeuvre un procédé de galvanisation permettant de revêtir galvaniquement et de passiver simultanément des objets conducteurs, de façon simple et économique. A cet effet, un substrat est immergé dans un bain de galvanisation contenant des ions d'au moins un métal pour le dépôt électrochimique sur la surface du substrat, des ions d'au moins un métal de transition et un solvant, le substrat formant la cathode d'une cellule électrochimique; une tension est appliquée à la cellule électrochimique de manière à produire un flux de courant qui entraîne le dépôt au moins du ou des métaux sur la surface du substrat; après dépôt du ou des métaux, le flux de courant est interrompu; puis un potentiel est produit sur la cathode ou une électrode supplémentaire réalisée dans le matériau du substrat, pouvant être connectée de façon conductrice au substrat, est immergée dans le bain de galvanisation et conservée ou maintenue immergée pendant un intervalle de temps.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009044982A DE102009044982A1 (de) | 2009-09-24 | 2009-09-24 | Verfahren zum Galvanisieren und zur Passivierung |
| DE102009044982.5 | 2009-09-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2011036260A2 WO2011036260A2 (fr) | 2011-03-31 |
| WO2011036260A3 true WO2011036260A3 (fr) | 2011-06-16 |
Family
ID=43638713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2010/064167 Ceased WO2011036260A2 (fr) | 2009-09-24 | 2010-09-24 | Procédé de galvanisation et de passivation |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE102009044982A1 (fr) |
| WO (1) | WO2011036260A2 (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114768509B (zh) * | 2022-04-01 | 2023-12-01 | 中北大学 | 基于超重力技术脱除烟气中多组分污染物的方法和装置 |
| IT202300006408A1 (it) * | 2023-03-31 | 2024-10-01 | De Lucchi S P A | Metodo per l'antichizzazione di oggetti metallici zincati, ed oggetto metallico realizzato tale metodo |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002050341A2 (fr) * | 2000-12-19 | 2002-06-27 | Centro Sviluppo Materiali S.P.A. | Procede de passivation d'une bande d'acier inoxydable etame au moyen d'un film de passivation sans chrome |
| WO2005014890A1 (fr) * | 2003-07-23 | 2005-02-17 | Seamless Plating (Uk) Limited | Solution electrolytique |
-
2009
- 2009-09-24 DE DE102009044982A patent/DE102009044982A1/de not_active Withdrawn
-
2010
- 2010-09-24 WO PCT/EP2010/064167 patent/WO2011036260A2/fr not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002050341A2 (fr) * | 2000-12-19 | 2002-06-27 | Centro Sviluppo Materiali S.P.A. | Procede de passivation d'une bande d'acier inoxydable etame au moyen d'un film de passivation sans chrome |
| WO2005014890A1 (fr) * | 2003-07-23 | 2005-02-17 | Seamless Plating (Uk) Limited | Solution electrolytique |
Non-Patent Citations (3)
| Title |
|---|
| MAGALHAES A A O ET AL: "Molybdate conversion coatings on zinc surfaces", JOURNAL OF ELECTROANALYTICAL CHEMISTRY AND INTERFACIALELECTRO CHEMISTRY, ELSEVIER, AMSTERDAM, NL, vol. 572, no. 2, 1 November 2004 (2004-11-01), pages 433 - 440, XP004588693, ISSN: 0022-0728, DOI: DOI:10.1016/J.JELECHEM.2004.07.016 * |
| WALKER D E ET AL: "Molybdate based conversion coatings for zinc and zinc alloy surfaces: a review", 20080901, vol. 86, no. 5, 1 September 2008 (2008-09-01), pages 251 - 259, XP001516988, DOI: DOI:10.1179/174591908X345022 * |
| WILCOX G D ET AL: "The development of passivation coatings by cathodic reduction in sodium molybdate solutions", CORROSION SCIENCE, OXFORD, GB, vol. 28, no. 6, 1 January 1988 (1988-01-01), pages 577 - 585,587, XP024046659, ISSN: 0010-938X, [retrieved on 19880101], DOI: DOI:10.1016/0010-938X(88)90025-X * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011036260A2 (fr) | 2011-03-31 |
| DE102009044982A1 (de) | 2011-03-31 |
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