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TW200702498A - Method for electrodeposition of bronzes - Google Patents

Method for electrodeposition of bronzes

Info

Publication number
TW200702498A
TW200702498A TW095113445A TW95113445A TW200702498A TW 200702498 A TW200702498 A TW 200702498A TW 095113445 A TW095113445 A TW 095113445A TW 95113445 A TW95113445 A TW 95113445A TW 200702498 A TW200702498 A TW 200702498A
Authority
TW
Taiwan
Prior art keywords
bronzes
electrodeposition
electrolyte
acid
plated
Prior art date
Application number
TW095113445A
Other languages
Chinese (zh)
Other versions
TWI391534B (en
Inventor
Katrin Zschintzsch
Joachim Heyer
Marlies Kleinfeld
Stefan Schafer
Ortrud Steinius
Original Assignee
Enthone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone filed Critical Enthone
Publication of TW200702498A publication Critical patent/TW200702498A/en
Application granted granted Critical
Publication of TWI391534B publication Critical patent/TWI391534B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

A method for electrodeposition of bronzes, with which the substrate to be coated is plated in an acid electrolyte that contains at least tin and copper ions, an alkylsulfonic acid and a wetting agent, and the preparation of such an electrolyte.
TW095113445A 2005-04-14 2006-04-14 Method for electrodeposition of bronzes TWI391534B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/105,947 US20060260948A2 (en) 2005-04-14 2005-04-14 Method for electrodeposition of bronzes

Publications (2)

Publication Number Publication Date
TW200702498A true TW200702498A (en) 2007-01-16
TWI391534B TWI391534B (en) 2013-04-01

Family

ID=37115474

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113445A TWI391534B (en) 2005-04-14 2006-04-14 Method for electrodeposition of bronzes

Country Status (7)

Country Link
US (1) US20060260948A2 (en)
EP (1) EP1874982B1 (en)
JP (1) JP2008537017A (en)
KR (1) KR101361431B1 (en)
CN (1) CN101194049B (en)
TW (1) TWI391534B (en)
WO (1) WO2006113473A1 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1408141B1 (en) * 2002-10-11 2014-12-17 Enthone Inc. Process and electrolyte for the galvanic deposition of bronze
DE102004041701A1 (en) * 2004-08-28 2006-03-02 Enthone Inc., West Haven Process for the electrolytic deposition of metals
US7296370B2 (en) * 2004-09-24 2007-11-20 Jarden Zinc Products, Inc. Electroplated metals with silvery-white appearance and method of making
ES2547566T3 (en) * 2006-05-24 2015-10-07 Atotech Deutschland Gmbh Metal coating compound and method for the deposition of copper, zinc and tin suitable for the production of a thin-film solar cell
DE102011008836B4 (en) * 2010-08-17 2013-01-10 Umicore Galvanotechnik Gmbh Electrolyte and method for depositing copper-tin alloy layers
US8426241B2 (en) 2010-09-09 2013-04-23 International Business Machines Corporation Structure and method of fabricating a CZTS photovoltaic device by electrodeposition
CN102605394B (en) * 2012-03-07 2015-02-18 深圳市华傲创表面技术有限公司 Cyanogen-free acidic cupronickel-tin plating solution
JP6101510B2 (en) * 2013-02-18 2017-03-22 株式会社シミズ Non-cyanide copper-tin alloy plating bath
US8945978B2 (en) * 2013-06-28 2015-02-03 Sunpower Corporation Formation of metal structures in solar cells
CN105899714B (en) * 2013-12-05 2018-09-21 霍尼韦尔国际公司 Stannous methanesulfonate solution with pH after the adjustment
HUE061592T2 (en) 2014-07-07 2023-07-28 Honeywell Int Inc Thermal interface material with ion scavenger
CA2957587C (en) * 2014-08-08 2019-03-05 Okuno Chemical Industries Co., Ltd. Copper-tin alloy plating bath
US20160298249A1 (en) * 2014-09-30 2016-10-13 Rohm And Haas Electronic Materials Llc Cyanide-free electroplating baths for white bronze based on copper (i) ions
US10287471B2 (en) 2014-12-05 2019-05-14 Honeywell International Inc. High performance thermal interface materials with low thermal impedance
CN107771227B (en) * 2015-04-20 2019-04-02 埃托特克德国有限公司 Electrolytic copper plating bath composition and usage thereof
WO2016205134A2 (en) * 2015-06-16 2016-12-22 3M Innovative Properties Company Plating bronze on polymer sheets
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
MX393621B (en) 2016-03-08 2025-03-24 Honeywell Int Inc PHASE CHANGE MATERIAL.
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
CN108103540B (en) * 2018-01-24 2020-01-07 永星化工(上海)有限公司 Tin alloy electroplating solution
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
JP6645609B2 (en) * 2018-07-27 2020-02-14 三菱マテリアル株式会社 Tin alloy plating solution
WO2020021965A1 (en) * 2018-07-27 2020-01-30 三菱マテリアル株式会社 Tin alloy plating solution
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2854388A (en) * 1955-03-14 1958-09-30 City Auto Stamping Co Electrodeposition of copper-tin alloys
US2916423A (en) * 1957-06-19 1959-12-08 Metal & Thermit Corp Electrodeposition of copper and copper alloys
DE3339541C2 (en) * 1983-11-02 1986-08-07 Degussa Ag, 6000 Frankfurt Alkaline-cyanide bath for the galvanic deposition of copper-tin alloy coatings
DE3934866A1 (en) * 1989-10-19 1991-04-25 Blasberg Oberflaechentech METHOD FOR DEPOSITING LEAD AND LEAD-CONTAINING LAYERS, ELECTROLYTE FOR CARRYING OUT THE METHOD AND USE OF SURFACTANTS IN ACID LEAD ELECTROLYTE
JP2901292B2 (en) * 1989-12-05 1999-06-07 住友ゴム工業 株式会社 Bead wire for rubber coated tire and tire using the same
DE4336664A1 (en) * 1993-10-27 1995-05-04 Demetron Gmbh Workpieces made of non-corrosion-resistant metals with coatings applied using the PVD process
US5385661A (en) * 1993-09-17 1995-01-31 International Business Machines Corporation Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition
US6176996B1 (en) * 1997-10-30 2001-01-23 Sungsoo Moon Tin alloy plating compositions
US6508927B2 (en) * 1998-11-05 2003-01-21 C. Uyemura & Co., Ltd. Tin-copper alloy electroplating bath
JP4359907B2 (en) * 1999-08-11 2009-11-11 石原薬品株式会社 Tin-copper alloy plating bath
JP3433291B2 (en) 1999-09-27 2003-08-04 石原薬品株式会社 Tin-copper-containing alloy plating bath, tin-copper-containing alloy plating method, and article formed with tin-copper-containing alloy plating film
JP2001107287A (en) * 1999-10-07 2001-04-17 Ebara Udylite Kk Sn-Cu alloy plating bath
JP2001181889A (en) * 1999-12-22 2001-07-03 Nippon Macdermid Kk Bright tin-copper alloy electroplating bath
JP2001234387A (en) * 2000-02-17 2001-08-31 Yuken Industry Co Ltd Whisker generation inhibitor and method for preventing tin-based electroplating
US7179362B2 (en) * 2000-09-20 2007-02-20 Dr.-Ing. Max Schlotter Gmbh & Co.Kg Electrolyte and method for depositing tin-copper alloy layers
US20020187364A1 (en) * 2001-03-16 2002-12-12 Shipley Company, L.L.C. Tin plating
JP3876383B2 (en) * 2002-06-03 2007-01-31 京都市 Copper-tin alloy plating bath and copper-tin alloy plating method using the plating bath
EP1408141B1 (en) * 2002-10-11 2014-12-17 Enthone Inc. Process and electrolyte for the galvanic deposition of bronze
EP1477588A1 (en) * 2003-02-19 2004-11-17 Rohm and Haas Electronic Materials, L.L.C. Copper Electroplating composition for wafers

Also Published As

Publication number Publication date
WO2006113473A1 (en) 2006-10-26
CN101194049A (en) 2008-06-04
TWI391534B (en) 2013-04-01
US20060260948A2 (en) 2006-11-23
EP1874982A4 (en) 2011-07-27
JP2008537017A (en) 2008-09-11
KR101361431B1 (en) 2014-02-10
CN101194049B (en) 2011-12-07
KR20070120600A (en) 2007-12-24
EP1874982A1 (en) 2008-01-09
US20050263403A1 (en) 2005-12-01
EP1874982B1 (en) 2014-05-07

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