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WO2006053062A3 - Tin alloy electroplating system - Google Patents

Tin alloy electroplating system Download PDF

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Publication number
WO2006053062A3
WO2006053062A3 PCT/US2005/040624 US2005040624W WO2006053062A3 WO 2006053062 A3 WO2006053062 A3 WO 2006053062A3 US 2005040624 W US2005040624 W US 2005040624W WO 2006053062 A3 WO2006053062 A3 WO 2006053062A3
Authority
WO
WIPO (PCT)
Prior art keywords
tin alloy
electroplating bath
tin
plating
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2005/040624
Other languages
French (fr)
Other versions
WO2006053062A2 (en
Inventor
George Bokisa
William E Eckles
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taskem Inc
Original Assignee
Taskem Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taskem Inc filed Critical Taskem Inc
Publication of WO2006053062A2 publication Critical patent/WO2006053062A2/en
Publication of WO2006053062A3 publication Critical patent/WO2006053062A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Disclosed are systems and methods of plating a tin alloy in an efficient economical, and environmentally friendly manner. The system for plating a tin alloy contains an electrochemical cell containing an anode, the cathode, and an electroplating bath. The electroplating bath contains water, an acid, at least one nitrogen-containing heterocyclic complexing agent, an ionic alloy metal, and ionic tin. The methods involve applying a current to the electroplating bath whereby a tin alloy forms on the cathode.
PCT/US2005/040624 2004-11-10 2005-11-09 Tin alloy electroplating system Ceased WO2006053062A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/985,194 US20060096867A1 (en) 2004-11-10 2004-11-10 Tin alloy electroplating system
US10/985,194 2004-11-10

Publications (2)

Publication Number Publication Date
WO2006053062A2 WO2006053062A2 (en) 2006-05-18
WO2006053062A3 true WO2006053062A3 (en) 2007-01-11

Family

ID=36315194

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/040624 Ceased WO2006053062A2 (en) 2004-11-10 2005-11-09 Tin alloy electroplating system

Country Status (2)

Country Link
US (1) US20060096867A1 (en)
WO (1) WO2006053062A2 (en)

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US8236159B2 (en) 1999-04-13 2012-08-07 Applied Materials Inc. Electrolytic process using cation permeable barrier
US8852417B2 (en) * 1999-04-13 2014-10-07 Applied Materials, Inc. Electrolytic process using anion permeable barrier
WO2007146192A2 (en) * 2006-06-08 2007-12-21 Eveready Battery Company, Inc. Tin-plated anode casings for alkaline cells
US10231344B2 (en) * 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
US8404160B2 (en) * 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
JP4632186B2 (en) * 2007-08-01 2011-02-16 太陽化学工業株式会社 Tin electrolytic plating solution for electronic parts, tin electrolytic plating method for electronic parts and tin electrolytic plated electronic parts
US8506849B2 (en) * 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US9730333B2 (en) * 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
US20090286383A1 (en) * 2008-05-15 2009-11-19 Applied Nanotech Holdings, Inc. Treatment of whiskers
US20100000762A1 (en) * 2008-07-02 2010-01-07 Applied Nanotech Holdings, Inc. Metallic pastes and inks
KR101735710B1 (en) 2009-03-27 2017-05-15 어플라이드 나노테크 홀딩스, 인크. Buffer layer to enhance photo and/or laser sintering
US8422197B2 (en) * 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
JP2011179085A (en) * 2010-03-02 2011-09-15 C Uyemura & Co Ltd Electroplating pretreatment agent, electroplating pretreatment method and electroplating method
WO2014007250A1 (en) * 2012-07-05 2014-01-09 株式会社ニコン Method for producing zinc oxide thin film, method for manufacturing thin film transistor, zinc oxide thin film, thin film transistor, and transparent oxide wiring line
IN2015DN00149A (en) * 2012-07-09 2015-06-12 Shikoku Chem
TW201419315A (en) 2012-07-09 2014-05-16 Applied Nanotech Holdings Inc Photosintering of micron-sized copper particles
JP6022922B2 (en) * 2012-12-13 2016-11-09 株式会社荏原製作所 Sn alloy plating apparatus and method
US10633754B2 (en) 2013-07-05 2020-04-28 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium
US10260159B2 (en) * 2013-07-05 2019-04-16 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with gold
US9918389B2 (en) * 2013-09-04 2018-03-13 Rohm And Haas Electronic Materials Llc Electroless metallization of dielectrics with alkaline stable pyrazine derivative containing catalysts
JP5938426B2 (en) * 2014-02-04 2016-06-22 株式会社豊田中央研究所 Electroplating cell and metal film manufacturing method
WO2019125951A1 (en) * 2017-12-18 2019-06-27 New Mexico Tech University Research Park Corporation Tin-indium alloy electroplating solution
US20210156043A1 (en) * 2019-11-25 2021-05-27 The Boeing Company Method for plating a metallic material onto a titanium substrate
US11280014B2 (en) * 2020-06-05 2022-03-22 Macdermid Enthone Inc. Silver/tin electroplating bath and method of using the same
CN118284722A (en) * 2021-11-22 2024-07-02 巴斯夫欧洲公司 Composition for tin or tin alloy electroplating comprising pyrazole antioxidants
CN117980544A (en) * 2023-07-12 2024-05-03 香港应用科技研究院有限公司 Co-plating Sn-Bi alloy solder for 3D-IC low temperature bonding

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4139425A (en) * 1978-04-05 1979-02-13 R. O. Hull & Company, Inc. Composition, plating bath, and method for electroplating tin and/or lead
US5196053A (en) * 1991-11-27 1993-03-23 Mcgean-Rohco, Inc. Complexing agent for displacement tin plating
US20030188974A1 (en) * 2002-04-03 2003-10-09 Applied Materials, Inc. Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects
WO2004011698A1 (en) * 2002-07-25 2004-02-05 Shinryo Electronics Co., Ltd. Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
US20050184369A1 (en) * 2002-07-25 2005-08-25 Sinryo Electronics Co., Ltd. Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film

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US4111772A (en) * 1975-05-22 1978-09-05 Pitt Metals And Chemicals, Inc. Process for electrodialytically controlling the alkali metal ions in a metal plating process
US4330377A (en) * 1980-07-10 1982-05-18 Vulcan Materials Company Electrolytic process for the production of tin and tin products
JPS61113781A (en) * 1984-11-08 1986-05-31 Tokuyama Soda Co Ltd Cathode for hydrogen generation
US4944851A (en) * 1989-06-05 1990-07-31 Macdermid, Incorporated Electrolytic method for regenerating tin or tin-lead alloy stripping compositions
JPH049493A (en) * 1990-04-27 1992-01-14 Permelec Electrode Ltd Method for electrolytically tinning steel sheet
US5251255A (en) * 1991-04-17 1993-10-05 At&T Bell Laboratories Processing interactions among telecommunications call features
FR2686352B1 (en) * 1992-01-16 1995-06-16 Framatome Sa APPARATUS AND METHOD FOR ELECTROLYTIC COATING OF NICKEL.
US5312539A (en) * 1993-06-15 1994-05-17 Learonal Inc. Electrolytic tin plating method
US5785833A (en) * 1996-04-29 1998-07-28 Vaughan; Daniel J. Process for removing iron from tin-plating electrolytes
DE19719020A1 (en) * 1997-05-07 1998-11-12 Km Europa Metal Ag Method and device for regenerating tinning solutions
JP3433291B2 (en) * 1999-09-27 2003-08-04 石原薬品株式会社 Tin-copper-containing alloy plating bath, tin-copper-containing alloy plating method, and article formed with tin-copper-containing alloy plating film
DE60113333T2 (en) * 2000-07-01 2006-07-06 Shipley Co., L.L.C., Marlborough Metal alloy compositions and associated plating methods

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4139425A (en) * 1978-04-05 1979-02-13 R. O. Hull & Company, Inc. Composition, plating bath, and method for electroplating tin and/or lead
US5196053A (en) * 1991-11-27 1993-03-23 Mcgean-Rohco, Inc. Complexing agent for displacement tin plating
US20030188974A1 (en) * 2002-04-03 2003-10-09 Applied Materials, Inc. Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects
WO2004011698A1 (en) * 2002-07-25 2004-02-05 Shinryo Electronics Co., Ltd. Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
US20050184369A1 (en) * 2002-07-25 2005-08-25 Sinryo Electronics Co., Ltd. Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film

Also Published As

Publication number Publication date
WO2006053062A2 (en) 2006-05-18
US20060096867A1 (en) 2006-05-11

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