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WO2010114300A3 - Method for manufacturing thin metal laminated film - Google Patents

Method for manufacturing thin metal laminated film Download PDF

Info

Publication number
WO2010114300A3
WO2010114300A3 PCT/KR2010/001968 KR2010001968W WO2010114300A3 WO 2010114300 A3 WO2010114300 A3 WO 2010114300A3 KR 2010001968 W KR2010001968 W KR 2010001968W WO 2010114300 A3 WO2010114300 A3 WO 2010114300A3
Authority
WO
WIPO (PCT)
Prior art keywords
thin metal
laminated film
metal laminated
film
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/001968
Other languages
French (fr)
Korean (ko)
Other versions
WO2010114300A2 (en
Inventor
정광춘
조현남
조남부
유지훈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
InkTec Co Ltd
Original Assignee
InkTec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by InkTec Co Ltd filed Critical InkTec Co Ltd
Publication of WO2010114300A2 publication Critical patent/WO2010114300A2/en
Publication of WO2010114300A3 publication Critical patent/WO2010114300A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The present invention relates to a method for manufacturing a thin metal laminated film. More specifically, the invention is a method for manufacturing thin metal laminated film, having a high-shield metal layer as its basic configuration material, by forming a resin layer on atypically processed film (separate film) or atypical paper. The thin metal laminated film according to the invention is able to improve heat-resistance, adhesive force and flexibility, and thus is able to obtain high frequency shielding properties for thin film. In addition, the thin metal laminated film enables mass production and cost reduction by reducing production time.
PCT/KR2010/001968 2009-03-31 2010-03-31 Method for manufacturing thin metal laminated film Ceased WO2010114300A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0027734 2009-03-31
KR1020090027734A KR101388972B1 (en) 2009-03-31 2009-03-31 process for preparation of laminated metal film

Publications (2)

Publication Number Publication Date
WO2010114300A2 WO2010114300A2 (en) 2010-10-07
WO2010114300A3 true WO2010114300A3 (en) 2011-01-20

Family

ID=42828852

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/001968 Ceased WO2010114300A2 (en) 2009-03-31 2010-03-31 Method for manufacturing thin metal laminated film

Country Status (2)

Country Link
KR (1) KR101388972B1 (en)
WO (1) WO2010114300A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109153239B (en) * 2016-05-20 2021-05-04 昭和电工材料株式会社 release film

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6348846B2 (en) * 2011-11-28 2018-06-27 スリーエム イノベイティブ プロパティズ カンパニー Method of manufacturing polarization beam splitter for providing high resolution image and system using the beam splitter
KR101525456B1 (en) * 2013-03-18 2015-06-03 (주)삼원에스티 Touch panel sensor and manufacturing method of the same
WO2014129852A1 (en) * 2013-02-21 2014-08-28 (주)삼원에스티 Touch panel sensor and method for manufacturing same
KR101381240B1 (en) * 2013-04-05 2014-04-04 와이엠티 주식회사 Manufacturing method of touch screen panel and touch screen panel using the same
US9832881B2 (en) 2013-04-19 2017-11-28 Inktec Co., Ltd. Method of manufacturing transparent electrode film for display and transparent electrode film for display
CN105378856B (en) * 2013-05-16 2019-07-12 印可得株式会社 The manufacturing method of transparent electrode thin film
KR101403543B1 (en) * 2013-05-20 2014-06-03 (주)삼원에스티 Touch panel sensor and manufacturing method of the same
KR101643411B1 (en) * 2014-02-28 2016-07-27 (주)삼원에스티 Touch panel sensor and manufacturing method of the same
WO2015186926A1 (en) * 2014-06-03 2015-12-10 주식회사 엘지화학 Ink composition for marking release-treated surface, and protective film containing same
KR101735917B1 (en) 2014-06-03 2017-05-15 주식회사 엘지화학 An ink composition for marking on release treatment surface and protective film having the same
CN105487341B (en) * 2016-01-14 2018-03-16 朱庆飞 A kind of production technology of sticking film for mobile phone
WO2024247973A1 (en) * 2023-05-30 2024-12-05 パナソニックＩｐマネジメント株式会社 Conductive film and electromagnetic wave shielding material using same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08307063A (en) * 1995-03-09 1996-11-22 Tokin Corp Electric circuit board and manufacturing method thereof
JP2005057118A (en) * 2003-08-06 2005-03-03 Hitachi Chem Co Ltd Manufacturing method of printed wiring board
JP2006302930A (en) * 2005-04-15 2006-11-02 Matsushita Electric Ind Co Ltd WIRING BOARD, ELECTRONIC COMPONENT BODY USING THE SAME, AND METHOD FOR MANUFACTURING THE SAME
JP2008106231A (en) * 2006-09-29 2008-05-08 Toray Ind Inc Adhesive sheet for electronic equipment

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1929994A (en) * 2004-03-04 2007-03-14 东丽株式会社 Heat-resistant resin laminated film, multilayer film with metal layer including same, and semiconductor device
KR100856508B1 (en) * 2007-06-15 2008-09-04 주식회사 잉크테크 Transparent conductive film and manufacturing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08307063A (en) * 1995-03-09 1996-11-22 Tokin Corp Electric circuit board and manufacturing method thereof
JP2005057118A (en) * 2003-08-06 2005-03-03 Hitachi Chem Co Ltd Manufacturing method of printed wiring board
JP2006302930A (en) * 2005-04-15 2006-11-02 Matsushita Electric Ind Co Ltd WIRING BOARD, ELECTRONIC COMPONENT BODY USING THE SAME, AND METHOD FOR MANUFACTURING THE SAME
JP2008106231A (en) * 2006-09-29 2008-05-08 Toray Ind Inc Adhesive sheet for electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109153239B (en) * 2016-05-20 2021-05-04 昭和电工材料株式会社 release film

Also Published As

Publication number Publication date
KR20100109233A (en) 2010-10-08
KR101388972B1 (en) 2014-04-25
WO2010114300A2 (en) 2010-10-07

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