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WO2010114300A3 - Procédé de fabrication d'un film feuilleté métallique mince - Google Patents

Procédé de fabrication d'un film feuilleté métallique mince Download PDF

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Publication number
WO2010114300A3
WO2010114300A3 PCT/KR2010/001968 KR2010001968W WO2010114300A3 WO 2010114300 A3 WO2010114300 A3 WO 2010114300A3 KR 2010001968 W KR2010001968 W KR 2010001968W WO 2010114300 A3 WO2010114300 A3 WO 2010114300A3
Authority
WO
WIPO (PCT)
Prior art keywords
thin metal
laminated film
metal laminated
film
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/001968
Other languages
English (en)
Korean (ko)
Other versions
WO2010114300A2 (fr
Inventor
정광춘
조현남
조남부
유지훈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
InkTec Co Ltd
Original Assignee
InkTec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by InkTec Co Ltd filed Critical InkTec Co Ltd
Publication of WO2010114300A2 publication Critical patent/WO2010114300A2/fr
Publication of WO2010114300A3 publication Critical patent/WO2010114300A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un film feuilleté métallique mince. En particulier, l'invention concerne un procédé de fabrication d'un film feuilleté métallique mince comportant une couche métallique fortement blindée, qui sert de matière de configuration de base. Ce procédé consiste à former une couche de résine sur un film traité de manière atypique (film séparé) ou papier atypique. Le film feuilleté métallique mince selon l'invention permet d'augmenter la résistance à la chaleur, la force d'adhésion et la souplesse du film mince, et ainsi de conférer des propriétés élevées de blindage contre les hautes fréquences au film mince. En outre, le film feuilleté métallique mince peut être produit par une production de masse et à coût réduit, grâce à une réduction du temps de production.
PCT/KR2010/001968 2009-03-31 2010-03-31 Procédé de fabrication d'un film feuilleté métallique mince Ceased WO2010114300A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090027734A KR101388972B1 (ko) 2009-03-31 2009-03-31 박막 금속적층필름의 제조방법
KR10-2009-0027734 2009-03-31

Publications (2)

Publication Number Publication Date
WO2010114300A2 WO2010114300A2 (fr) 2010-10-07
WO2010114300A3 true WO2010114300A3 (fr) 2011-01-20

Family

ID=42828852

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/001968 Ceased WO2010114300A2 (fr) 2009-03-31 2010-03-31 Procédé de fabrication d'un film feuilleté métallique mince

Country Status (2)

Country Link
KR (1) KR101388972B1 (fr)
WO (1) WO2010114300A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109153239B (zh) * 2016-05-20 2021-05-04 昭和电工材料株式会社 脱模膜

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI595273B (zh) * 2011-11-28 2017-08-11 ３Ｍ新設資產公司 製造提供高解析度影像之偏極化分光鏡的方法及使用此等分光鏡之系統
KR101525456B1 (ko) * 2013-03-18 2015-06-03 (주)삼원에스티 터치패널센서 및 그 제조방법
WO2014129852A1 (fr) * 2013-02-21 2014-08-28 (주)삼원에스티 Capteur de panneau tactile et son procédé de fabrication
KR101381240B1 (ko) * 2013-04-05 2014-04-04 와이엠티 주식회사 터치 스크린 패널의 제조 방법 및 이에 의하여 제조된 터치 스크린 패널
CN105359226B (zh) * 2013-04-19 2017-12-08 印可得株式会社 显示器用透明电极薄膜的制造方法及显示器用透明电极薄膜
JP6373360B2 (ja) 2013-05-16 2018-08-15 インクテック カンパニー， リミテッドＩｎｋｔｅｃ Ｃｏ．， Ｌｔｄ． 透明電極フィルムの製造方法
KR101403543B1 (ko) * 2013-05-20 2014-06-03 (주)삼원에스티 터치패널센서 및 그 제조방법
KR101643411B1 (ko) * 2014-02-28 2016-07-27 (주)삼원에스티 터치패널센서 및 그 제조방법
WO2015186926A1 (fr) * 2014-06-03 2015-12-10 주식회사 엘지화학 Composition d'encre pour marquer une surface traitée antiadhésive et film protecteur la contenant
KR101735917B1 (ko) 2014-06-03 2017-05-15 주식회사 엘지화학 이형처리 표면 마킹용 잉크 조성물 및 이를 포함하는 보호 필름
CN105487341B (zh) * 2016-01-14 2018-03-16 朱庆飞 一种手机贴膜的生产工艺
WO2024247973A1 (fr) * 2023-05-30 2024-12-05 パナソニックＩｐマネジメント株式会社 Film conducteur et matériau de blindage contre les ondes électromagnétiques correspondant

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08307063A (ja) * 1995-03-09 1996-11-22 Tokin Corp 電気回路基板及びその製造方法
JP2005057118A (ja) * 2003-08-06 2005-03-03 Hitachi Chem Co Ltd 印刷配線板の製造方法
JP2006302930A (ja) * 2005-04-15 2006-11-02 Matsushita Electric Ind Co Ltd 配線基板とそれを用いた電子部品実装体およびそれらの製造方法
JP2008106231A (ja) * 2006-09-29 2008-05-08 Toray Ind Inc 電子機器用接着剤シート

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070007083A (ko) * 2004-03-04 2007-01-12 도레이 가부시끼가이샤 내열성 수지적층필름 및 이것을 포함하는 금속층이 부착된적층필름 및 반도체장치
KR100856508B1 (ko) * 2007-06-15 2008-09-04 주식회사 잉크테크 투명도전막 및 이의 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08307063A (ja) * 1995-03-09 1996-11-22 Tokin Corp 電気回路基板及びその製造方法
JP2005057118A (ja) * 2003-08-06 2005-03-03 Hitachi Chem Co Ltd 印刷配線板の製造方法
JP2006302930A (ja) * 2005-04-15 2006-11-02 Matsushita Electric Ind Co Ltd 配線基板とそれを用いた電子部品実装体およびそれらの製造方法
JP2008106231A (ja) * 2006-09-29 2008-05-08 Toray Ind Inc 電子機器用接着剤シート

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109153239B (zh) * 2016-05-20 2021-05-04 昭和电工材料株式会社 脱模膜

Also Published As

Publication number Publication date
KR20100109233A (ko) 2010-10-08
KR101388972B1 (ko) 2014-04-25
WO2010114300A2 (fr) 2010-10-07

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