WO2010114300A2 - Method for manufacturing thin metal laminated film - Google Patents

Abstract

The present invention relates to a method for manufacturing a thin metal laminated film. More specifically, the invention is a method for manufacturing thin metal laminated film, having a high-shield metal layer as its basic configuration material, by forming a resin layer on atypically processed film (separate film) or atypical paper. The thin metal laminated film according to the invention is able to improve heat-resistance, adhesive force and flexibility, and thus is able to obtain high frequency shielding properties for thin film. In addition, the thin metal laminated film enables mass production and cost reduction by reducing production time.

Description

Manufacturing Method of Thin Film Metal Laminated Film

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a thin metal laminate film, and more particularly, to a resin layer formed on a release film or a release paper, and a thin film having a high shield metal layer as a basic configuration. It relates to a method for producing a metal laminated film.

Electromagnetic waves generated from internal devices of electronic devices such as mobile phones, digital cameras, notebook PCs, office equipment, and medical devices have been reported to affect various diseases such as headaches, poor vision, brain tumors, and circulatory problems. There is a growing controversy over the hazards to humans. In addition, as the integration of devices increases due to the light weight of electronic products, electromagnetic noise generated from each component may cause peripheral devices to malfunction, causing device failure. Therefore, in recent years, regulations on the emission of electromagnetic interference (EMI) and radio frequency interference (RFI) as well as the strengthening of shielding standards for electromagnetic waves generated from home, office, and industrial electronic products such as computers, mobile phones, medical devices, and multimedia players In addition, measures to shield electromagnetic waves of various electronic devices and components have emerged as important issues.

In recent years, in order to respond to requests for high performance and miniaturization of office equipment, communication equipment, mobile phones, and the like, flexible printed wiring boards (FPCBs) having a narrow and complicated structure are frequently used. FPCB is used to attach a shield film (shield film) for blocking electromagnetic noise. Repeated bending electrical circuits such as FPCB require a high degree of flexibility to withstand repeated bending in addition to good shielding effects.

As a conventional shield film, it is widely known that a base film and a conductive layer laminated thereon have a basic structure. Usually, a reinforcement film for workability is used for this basic structure, and a protective film is used for the conductive layer, and it is used.

Japanese Laid-Open Patent Publication No. 5-3395 describes a method of using a metal thin film to obtain excellent shielding effect and high bendability, and Japanese Laid-Open Patent Publication No. 7-122882 combines a conductive adhesive layer using a metal filler and a metal thin film. Although the method is described, the flexibility of the base film material and the shield layer itself is insufficient, and thus there is a limit to sufficiently satisfying the flexibility required by recent electronic components.

In addition, a method of forming conductive layers on both sides of the FPCB as a method for improving the shielding property of high frequency noise has been made, but the problem of flexibility is not completely solved.

In order to solve the above problems, the present invention can greatly improve the heat resistance, adhesion, and bendability of the thin film metal laminate film, as well as to ensure the shielding of the high frequency with a thin film, and shorten the production process time It is possible to provide a method of manufacturing a thin film metal laminate film having advantages of mass production and cost reduction.

The present invention relates to a method for manufacturing a thin metal laminate film, and more particularly, a resin having excellent heat resistance is coated on a release film and then cured to form a resin layer of a thin film, and a metal ink is applied thereon to laminate a metal. A method for producing a film. Removing the release film of the metal laminated film is characterized by improving the properties of high heat resistance and high flexibility to the laminated film of a thin film, the present invention will be described in more detail below.

As shown in FIG. 1, the thin film metal-laminated film formed by the present invention is formed by coating a resin having excellent heat resistance and adhesion with a metal on a base film 1 coated with a release agent 1 'or a release paper. It consists of a resin layer 2 to be formed, and a metal layer 3 of a thin film formed by coating a metal ink composition having excellent conductivity.

The base film coated with the release agent is a concept including a release paper, hereinafter referred to as a release film.

Method of forming a metal laminated film of the thin film of the present invention for achieving the above object

I) Preparing the Release Film

II) forming a resin layer having high heat resistance and excellent adhesion with a metal on the release film;

III) forming a thin metal layer by coating or printing a metal ink composition on the resin layer;

Characterized in that it comprises a.

The thin film metal laminate film prepared as described above has a feature of providing a thin film metal laminate film to improve the characteristics of high heat resistance and high flexibility by removing the release film when applied to electronic components or devices.

I) step;

This step is to prepare a release film, the release film for forming the resin layer is polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyether sulfone (PES), nylon ( Nylon), polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), polycarbonate (PC), polyarylate (PAR), etc., plastic film or paper (Paper) can be used, and the release agent Use treated film or paper. The release film is not particularly limited to those mentioned above and may be selectively used according to the characteristics of the film according to the heat treatment temperature described below.

II) step;

This step is to form a resin layer having a high heat resistance and excellent adhesion to the metal on the release film.

The resin composition coated on the release film is a heat-resistant resin as an essential component, and if necessary, a solvent, a stabilizer, a surfactant, a wetting agent, an adhesion promoter, a hardener, a thixotropic agent ( thixotropic agents) or additives such as leveling agents.

It is preferable that resin of the said composition is excellent in heat resistance and the adhesive force with a metal layer. Resins usable herein include epoxy resins, melamine resins, phenolic resins, phenol modified alkyd resins, epoxy modified alkyd resins, silicone modified alkyd resins, acrylic melamine resins, polyimide resins, and precursors. It is not limited to this.

The epoxy resin used in the present invention preferably contains an aromatic, and various epoxy resins can be used. For example, a glycidyl ether type epoxy resin, a glycidyl ester type epoxy resin, a glycidyl amine type epoxy etc. can be illustrated. Examples of glycidyl ether type epoxy resins include bisphenol A type, bisphenol F type, brominated bisphenol A type, bisphenol S type, bisphenol AF type, bisphenyl type, naphthalene type, phenol novolak type, cresol novolak type, DPP novolak type, and tris Hydroxyphenylmethane type, tetraphenylethane type, etc. can be illustrated. Examples of the glycidyl ester epoxy resins include hexahydrophthalic acid ester type and phthalic acid ester type. Examples of the glycidyl amine epoxy resins include tetraglycidyl diaminophenylmethane, aminophenol type, aniline type and toluidine type.

In addition, phosphoric acid containing a hydroxyl group may be added and used to improve adhesion and flexibility of the resin layer and heat resistance. For example, phosphoric acid, phosphonoacetic acid, normal phosphonomethylglycine, normal phosphonomethylglycine, normal phosphonomethyliminodiacetic acid, 4-phosphonoxytempohydrate, 3-phosphonopropionic acid, phosphoene Norpyruvic acid monosodium salt, etc. can be used.

In the present invention, the coverlay composition may need a solvent to form a uniform thin film as needed, and solvents that may be used may include ethanol, isopropanol, alcohols such as butanol, glycols such as ethylene glycol, glycerin, and ethyl acetate. , Acetates such as butyl acetate, methoxypropyl acetate, carbitol acetate, ethyl carbitol acetate, methyl cersolve, butyl cellosolve, diethyl ether, ethers such as tetrahydrofuran, dioxane, methyl ethyl ketone Ketones such as acetone, dimethylformamide, 1-methyl-2-pyrrolidone, hydrocarbons such as hexane, heptane, dodecane, paraffin oil, mineral split, aromatics such as benzene, toluene, xylene, and chloroform Halogen substituted solvents such as methylene chloride, carbon tetrachloride, acetonitrile, dimethyl sulfoxide or These mixed solvents and the like can be used.

The coating method of the resin composition thus obtained may be a known general film forming method, and does not need to be particularly limited in accordance with the features of the present invention. For example, spin coating, roll coating, spray coating, dip coating, flow coating, doctor blade and dispensing, inkjet printing, offset printing, It is possible to select and use screen printing, pad printing, gravure printing, flexography printing, stencil printing, imprinting, methods and the like.

The heat treatment of the resin composition should be applied in accordance with the heat resistance temperature of the release film and the curing conditions of the resin composition, usually between 100 ~ 300 ℃, preferably 120 ~ 250 ℃, more preferably 150 ~ 200 ℃ heat thin film Good for physical properties. In addition, heat treatment of two or more steps at low and high temperatures within the above range is also good for the uniformity of the thin film. For example, it is good to process for 1 to 30 minutes at 80-150 degreeC, and to process for 1 to 30 minutes at 150-200 degreeC.

Although the thickness of the resin layer does not need to be largely limited, the thickness of the resin layer is preferably 0.1 μm to 10 μm, preferably 0.5 μm to 7 μm, more preferably 1 μm to 5 μm. Too thin or too thick may cause problems with adhesion, flexibility and heat resistance.

III) step;

This step is to form a thin film metal layer by coating or printing a metal ink composition on the resin layer.

The type of the metal ink is not particularly limited, and in particular, the use of a metal ink containing an organometallic complex compound having a special structure as filed by the applicant of the Patent Application No. 2005-34371 has a uniform thickness of the metal thin film. And good conductivity, and also low firing temperature, and there is no residue other than the conductive material after the suit.

The metal ink can be prepared by reacting the metal ink with one or two or more mixtures selected from a metal compound, an ammonium carbamate compound, an ammonium carbonate compound or an ammonium bicarbonate compound. Ammonium carbonate-based compound or ammonium bicarbonate-based compound] to prepare a composite, and to prepare a metal ink containing the same, the same production method was used in the present invention.

The metal ink composition used in the present invention includes an organometallic complex compound or a metal conductor or metal precursor, and additives such as solvents, stabilizers, leveling agents and thin film aids, which are already known as necessary, may be used. It may be included in the metal ink composition.

The metal conductor does not need to be particularly limited. That is, any known one may be used as long as it is suitable for the purpose of the invention. That is, as the type of conductor, for example, Ag, Au, Cu, Zn, Ni, Co, Pd, Pt, Ti, V, Mn, Fe, Cr, Zr, Nb, Mo, W, Ru, Cd, Ta, Selected from the group of transition metals such as Re, Os, Ir, or a group of metals such as Al, Ga, Ge, In, Sn, Sb, Pb, Bi, or lanthanides such as Sm, Eu, At least one metal selected from the group of actinides-based metals, or alloys or alloy oxides thereof is included.

In addition, the metal precursor is not particularly limited. That is, it can be used when the purpose of the present invention is met, and in particular, it is more preferable to exhibit conductivity through heat treatment, oxidation or reduction treatment, infrared ray, ultraviolet ray, electron beam, laser treatment, and the like. Specifically, for example, gold acetate, palladium oxalate, silver 2-ethylhexanoate, copper 2-ethylhexanoate, iron stearate, nickel formate, zinc sheet Carboxylic acid metals such as zinc citrate, silver nitrate, copper cyanide, cobalt carbonate, platinum chloride, gold chloride, tetrabutoxy titanium, dimethoxyzirconium dichloride, aluminum isopropoxide, tin tetrafluoroborate, Metal compounds such as vanadium oxide, indium-tin oxide, tantalum methoxide, bismuth acetateo, dodecyl mercetoxide, indium acetylacetonate, and the like.

In addition, the shape of the metal conductor and the metal precursor may be spherical, linear, plate-shaped, or a mixture thereof, and may be in the form of particles containing nanoparticles, powder, flake, colloid ( It can be used in various states such as colloid, hybrid, sol, solution, or a mixture of one or more of them.

The size or the amount of the metal conductor or the metal precursor need not be particularly limited as long as it meets the ink characteristics of the present invention. That is, the size is preferably 10 microns or less, more preferably 1 nanometer (nm) or more and 1 micron or less, considering the uniformity of the coating film after firing, the amount of use does not exceed a certain limit so that the firing temperature is too high or printing process If you do not have a problem. Usually, the amount thereof is preferably in the range of 1 to 95 percent, more preferably 10 to 50 percent by weight, based on the total ink composition.

The solvent contained in the metal ink composition may be selected from water, alcohols, glycols, acetates, ethers, ketones, aliphatic hydrocarbons, aromatic hydrocarbons or halogenated hydrocarbon-based solvents, specifically, water, methanol, ethanol, isopropanol, 1 Methoxypropanol, butanol, ethylhexyl alcohol, terpineol, ethylene glycol, glycerin, ethyl acetate, butyl acetate, methoxypropyl acetate, carbitol acetate, ethyl carbitol acetate, methyl cellosolve, butyl cellosolve, Diethyl ether, tetrahydrofuran, dioxane, methyl ethyl ketone, acetone, dimethylformamide, 1-methyl-2-pyrrolidone, dimethyl sulfoxide, hexane, heptane, dodecane, paraffin oil, mineral spirit, benzene, At least one selected from toluene, xylene, chloroform, methylene chloride, carbon tetrachloride and acetonitrile It can be used.

The printing method of the metal ink composition is spin coating, roll coating, spray coating, dip coating, flow coating, comma coating, respectively, depending on the properties of the ink and the properties of the resin layer. Key coating, die coating, doctor blade, dispensing, inkjet, offset, screen, pad, gravure, flexography, etc. It is not specifically limited to this. In addition, if necessary, the printing method may be applied two or more times to form a pattern. For example, in detail, a 0.1 um particle size metal ink composition is formed using a micro gravure coater to form a conductive pattern having a thickness of 0.3 um, and a 0.2 um particle size metal ink composition is placed on the upper layer using a silk screen. A conductive pattern can be formed in thickness.

The post-treatment step may be heat treated under a normal inert atmosphere, but may be processed in air, nitrogen, carbon monoxide, or even a mixed gas of hydrogen and air or another inert gas, if necessary. The heat treatment is usually performed at 80 to 400 ° C, preferably at 90 to 300 ° C, more preferably at 100 to 250 ° C. In addition, heat treatment of two or more steps at low and high temperatures within the above range is also good for the uniformity of the thin film. For example, it is good to process for 1 to 30 minutes at 80-150 degreeC, and to process for 1 to 30 minutes at 150-300 degreeC.

The thickness of the metal layer after heat treatment is preferably between 0.05 and 2 microns, and the conductivity of the metal layer is preferably between 1 mPa / □ and 1 kPa / □, preferably 10 mPa / □ to 500 mPa / □. If the conductivity exceeds 500mΩ / □, the electromagnetic shielding characteristics are lowered, and if the shielding performance is less than 10mΩ / □, the shielding performance is improved, but manufacturing costs are increased.

The thin film metal-laminated film according to the present invention can greatly improve heat resistance, adhesion, and bendability, and can not only secure high frequency shielding properties with a thin film, but also shorten the production process time, thereby reducing mass production and cost. Has the advantage.

1 is a structure of a metal laminated film according to the present invention

<Explanation of symbols for the main parts of the drawings>

 1: Film 1 ': Release agent

2: resin layer 4: metal layer

The present invention will be described in more detail with reference to the following examples. However, the following examples are merely examples of the present invention, and the claims of the present invention are not limited thereto.

Preparation of Resin Ink Composition 1

In a 10 L glass reactor equipped with a stirrer, 728.5 g of SER-10 (Inchem), 249 g of NC-3000H (Japan Chemical), 225.5 g of YDCN-500P (Kukdo Chemical), 1,557 g of Nipol-1072 (Xeon Chemical), 187 g of OP-930 (Clariant) and 187 g of H42STV (Showa Denko) are mixed and dissolved in 450 g of methyl cellosolve, 750 g of methyl ethyl ketone, 225 g of toluene, and 75 g of xylene. 2.5 g of DAH, 15.3 g of dicyandiamide, 31.6 g of diaminodiphenylsulfone in this solution. 38.8 g of tertiary amine, 10 g of boric acid, and 3.5 g of A-187 (GE silicon) were dissolved in 211.2 g of methyl cellosolve and added and stirred at room temperature for 1 hour to obtain a resin ink coating composition 1.

Preparation of Resin Ink Composition 2

In a 3L glass reactor equipped with a reflux and stirring device and a thermometer, a mixture of 1200 g of 50% YD-011 (Kukdo Chemical) solution, 290 g of toluene, 180 g of isobutanol, and 180 g of methyl isobutyl ketone was heated to 70 ° C. and refluxed for 1 hour Stir. When the stirring liquid reaches the thermal equilibrium, 145.6 g of phosphoric acid is added and stirred under reflux for 12 hours at 70 ° C. Cooling to room temperature after completion of the reaction to give a light amber viscous liquid epoxy composition having a solid content of 30%. 50 g of Aerosil 300 (Degussa), 25 g of Z-6062 (Dow Corning) and 25 g of toluene were mixed and silica particles were crushed using a rod-type high pressure homogenizer to obtain a resin ink precursor I.

In a 10 L glass reactor equipped with a stirrer, 253.38 g of Nipol-1072 (Xeon Chemical) is dissolved in 3707.4 g of cyclohexanone. To this solution, 346.74 g of resin ink precursor I and 693.48 g of 50% YD-017 (Kukdo Chemical) solution were mixed and stirred for 5 hours to obtain a resin ink composition 2.

Preparation of Metal Ink Composition 1

34.89 grams (129.8 mmol) of viscous liquid containing 7: 3 2-ethylhexyl ammonium 2-ethylhexyl carbamate and butylammonium butyl carbamate in a molar ratio in a 250 milliliter Schlenk flask with a stirrer 12.03 grams (51.92 mmol) of silver oxide (manufactured by Aldrich Co., Ltd.) was added thereto, and the mixture was reacted with stirring at room temperature for 2 hours. As the reaction proceeded, the complex initially formed in a black suspension. The color faded, and finally 46.92 grams of a yellow, transparent liquid silver complex was obtained. The thermal analysis (TGA) revealed that the silver content was 23.65 weight. Percent. The silver complex solution was diluted with IPA to prepare metal ink solution 1 having a silver content of 10% by weight and a viscosity of 14 cps.

Preparation of Metal Ink Composition 2

Into a 250 milliliter Schlenk flask with a stirrer was added 58.93 grams of metal ink 1 and 41.07 grams of silver nanoparticles (manufactured by Ferro) and stirred for 30 minutes at room temperature. The stirred liquid was secondly stirred through a three-rod roll mill to prepare Metal Ink 2 having a content of 55 wt% silver and a viscosity of 6000 Cps (Brook field DVII pro, 15 spindle, 50 rpm).

Example 1

In order to prepare a metal laminate film, a 300 mm wide and 200 m long PET film having a release agent coating was prepared, and then the resin ink composition 1 was prepared using a gravure coating machine. After coating at a rate of 150 ℃ heat treated to prepare a coverlay film with a thickness of 3㎛ on PET surface using a microgravure coating machine on top of 20M / min. The conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 μm. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.

Example 2

In order to prepare a metal laminate film, a 300 mm wide and 200 m long PET film having a release agent coating was prepared, and then the resin ink composition 1 was prepared using a gravure coating machine. After coating at a speed, heat-treated at 150 ℃ to prepare a coverlay film with a thickness of 3㎛ on the surface of PET, and using a rotary screen coater on it, 10M / min. The conductive metal ink 2 was coated at a speed to prepare a metal laminate film having a thickness of 0.8 μm. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.

Example 3

In order to prepare a metal laminate film, a 300 mm wide and 200 m long PET film having a release agent coating was prepared, and then the resin ink composition 1 was prepared using a gravure coating machine. After coating at a rate of 150 ℃ heat treated to prepare a coverlay film having a thickness of 1㎛ on PET surface using a microgravure coating machine on top of 20M / min. The conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 μm. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.

Example 4

In order to prepare a metal laminate film, a 300 mm wide and 200 m long PET film having a release agent coating was prepared, and then the resin ink composition 1 was prepared using a gravure coating machine. After coating at a rate of 150 ℃ heat treatment to prepare a coverlay film of 5㎛ thickness on the PET surface using a microgravure coating machine on top of 20M / min. The conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 μm. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.

Example 5

In order to prepare a metal laminated film, a 300 mm wide and 200 m long paper was prepared with a release agent coating. Then, the gravure coating machine was used to apply the resin ink composition 1 to 10 M / min. After coating at a rate of 150 ℃ heat treated to prepare a coverlay film with a thickness of 3㎛ on PET surface using a microgravure coating machine on top of 20M / min. The conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 μm. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.

Example 6

In order to prepare a metal laminate film, a 300 mm wide and 200 m long PET film with a release agent coating was prepared, and then the resin ink composition 2 was prepared using a gravure coating machine. After coating at a rate of 150 ℃ heat treated to prepare a coverlay film with a thickness of 3㎛ on PET surface using a microgravure coating machine on top of 20M / min. The conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 μm. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.

Example 7

In order to prepare a metal laminate film, a 300 mm wide and 200 m long PET film with a release agent coating was prepared, and then the resin ink composition 2 was prepared using a gravure coating machine. After coating at a speed, heat-treated at 150 ℃ to prepare a coverlay film with a thickness of 3㎛ on the surface of PET, and using a rotary screen coater on it, 10M / min. The conductive metal ink 2 was coated at a speed to prepare a metal laminate film having a thickness of 0.8 μm. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.

Example 8

In order to prepare a metal laminate film, a 300 mm wide and 200 m long PET film with a release agent coating was prepared, and then the resin ink composition 2 was prepared using a gravure coating machine. After coating at a rate of 150 ℃ heat treated to prepare a coverlay film having a thickness of 1㎛ on PET surface using a microgravure coating machine on top of 20M / min. The conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 μm. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.

Example 9

In order to prepare a metal laminate film, a 300 mm wide and 200 m long PET film with a release agent coating was prepared, and then the resin ink composition 2 was prepared using a gravure coating machine. After coating at a rate of 150 ℃ heat treatment to prepare a coverlay film of 5㎛ thickness on the PET surface using a microgravure coating machine on top of 20M / min. The conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 μm. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.

Example 10

In order to prepare a metal laminated film, a 300 mm wide and 200 m long paper was prepared with a release agent coating, and then the resin ink composition 2 was applied to the resin ink composition 2 using a gravure coater. After coating at a rate of 150 ℃ heat treated to prepare a coverlay film with a thickness of 3㎛ on PET surface using a microgravure coating machine on top of 20M / min. The conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 μm. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.

Comparative Example 1

In order to prepare a metal laminate film, a 12 탆 thick, 300 mm wide, 200 m long PI film was prepared, and then the resin ink composition 1 was prepared using a gravure coating machine. After coating at a rate of 150 ℃ heat treated to prepare a coverlay film with a thickness of 3㎛ on PET surface using a microgravure coating machine on top of 20M / min. The conductive metal ink 1 was coated at a speed to prepare a metal laminate film having a thickness of 0.2 μm. Table 1 shows the surface resistance, electromagnetic wave shielding properties, flexibility, and adhesion of the prepared metal laminate film.

Table 1 Metal Laminated Film Thickness (㎛) Surface resistance (mΩ / □) Flexibility (× 1,000 Cycle) Adhesive force (N / cm) Shielding property Example 1 3.2 200 12 10 50 Comparative Example 1 15.2 200 7 10 50 Example 2 3.8 1,000 5 7 15 Example 3 1.2 150 9 8 53 Example 4 5.2 250 10 10 45 Example 5 3.2 200 12 10 50 Example 6 3.2 210 10 9 48 Example 7 3.8 1,200 4 7 10 Example 8 1.2 160 8 7 52 Example 9 5.2 260 7 10 45 Example 10 3.2 210 10 10 48

Surface resistance: measured by ASTM D-257 equipment

Adhesion: KS M ISO 8510-2, measured through 180-degree peeling.

Shielding property: 10MHz-1,000 MHz KEC method

The thin film metal-laminated film according to the present invention can greatly improve heat resistance, adhesion, and bendability, so that a thin film can not only secure high frequency shielding properties, but also a simple process and a short production time. Mass production is possible, so the economic effect of cost reduction is big.

Claims (14)

Claims [1] A method of manufacturing a thin metal laminate film, the method comprising: preparing a release film or a release paper; Forming a resin layer having high heat resistance and excellent adhesion to metal on the release film; And coating or printing a metal ink composition on the resin layer to form a thin metal layer. The method for producing a thin film metal laminated film, wherein the thin film metal laminated film prepared from claim 1 is applied to a product by removing the release film. The method of claim 1, wherein the resin forming the resin layer is epoxy resin, melamine resin, phenol resin, phenol modified alkyd resin, epoxy modified alkyd resin, silicone modified alkyd resin, acrylic melamine resin, polyimide resin or precursors thereof Method for producing a thin film metal laminate film, characterized in that used alone or mixed. The method of claim 1, wherein the resin layer further comprises a phosphoric acid or a phosphoric acid derivative including a hydroxyl group. 5. The phosphoric acid derivative according to claim 4, wherein the phosphate derivative is phosphono acetic acid, normal phosphonomethyl glycine, normal phosphonomethyl glycine, normal phosphonomethyliminodiacetic acid, 4-phosphonooxytempohydrate, 3-phosphono propionic acid , Phosphoenolpyruvic acid monosodium salt is selected from the method used for producing a thin-film metal laminated film. The method of claim 1, wherein the resin forming the resin layer is selected from a solvent, a stabilizer, a surfactant, a humectant, an adhesion promoter, a curing agent, a thixotropic agent or a leveling agent is used alone or mixed of the thin film metal laminate film, characterized in that Manufacturing method. The method of claim 6, wherein the solvent is ethanol, isopropanol, butanol, ethylene glycol, glycerin, ethyl acetate, butyl acetate, methoxypropyl acetate, carbitol acetate, ethyl carbitol acetate methyl cersolve, butyl cellosolve, diethyl Ether, tetrahydrofuran, dioxane, methylethylketone, acetone, dimethylformamide, 1-methyl-2-pyrrolidone, hexane, heptane, dodecane, paraffin oil, mineral split, benzene, toluene, xylene, A chloroform, methylene chloride, carbon tetrachloride, acetonitrile, dimethyl sulfoxide or a mixed solvent thereof. The method of claim 1, wherein the resin layer is formed by spin coating, roll coating, spray coating, dip coating, flow coating, doctor blade and dispensing, inkjet printing, offset printing, screen printing, pad printing, gravure printing, or printing. Method for manufacturing a thin film metal laminate film, characterized in that formed by selecting from flexographic printing, stencil printing, imprinting method. The method of claim 1, wherein the resin layer has a thickness of 0.1 μm to 10 μm. The metal ink composition of claim 1, wherein the metal ink composition comprises an organometallic complex prepared by reacting a metal compound with one or two or more mixtures selected from an ammonium carbamate compound, an ammonium carbonate compound, or an ammonium bicarbonate compound. Method for producing a thin film metal laminated film, characterized in that. The method of claim 1, wherein the metal ink composition is selected from a metal conductor, a metal precursor, a solvent, a stabilizer, a leveling agent, or a thin film auxiliary agent, and used alone or in combination. The method of claim 11, wherein the solvent is water, methanol, ethanol, isopropanol, 1-methoxypropanol, butanol, ethylhexyl alcohol, terpineol, ethylene glycol, glycerin, ethyl acetate, butyl acetate, methoxypropyl acetate, carbibi Tol acetate, ethyl carbitol acetate, methyl cellosolve, butyl cellosolve, diethyl ether, tetrahydrofuran, dioxane, methyl ethyl ketone, acetone, dimethylformamide, 1-methyl-2-pyrrolidone, dimethyl Preparation of thin metal laminated films characterized in that the sulfoxide, hexane, heptane, dodecane, paraffin oil, mineral spirits, benzene, toluene, xylene, chloroform, methylene chloride, carbon tetrachloride, acetonitrile or a mixed solvent thereof Way. The method of claim 1, wherein the method of forming the metal layer comprises spin coating, roll coating, spray coating, dip coating, flow coating, doctor blade and dispensing, inkjet printing, offset printing, screen printing, pad printing, gravure printing, flexo Method of manufacturing a thin film metal laminate film, characterized in that formed by selecting from the printing, stencil printing, imprinting method. The method of claim 1, wherein the metal layer has a thickness of 0.05 µm to 2 µm.

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