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WO2009157130A1 - 接合構造および電子部品 - Google Patents

接合構造および電子部品 Download PDF

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Publication number
WO2009157130A1
WO2009157130A1 PCT/JP2009/002265 JP2009002265W WO2009157130A1 WO 2009157130 A1 WO2009157130 A1 WO 2009157130A1 JP 2009002265 W JP2009002265 W JP 2009002265W WO 2009157130 A1 WO2009157130 A1 WO 2009157130A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
electrode
solder
electronic component
solder layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/002265
Other languages
English (en)
French (fr)
Inventor
古澤彰男
酒谷茂昭
中村太一
松尾隆広
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2010517680A priority Critical patent/JP5362719B2/ja
Priority to CN2009801159188A priority patent/CN102017107B/zh
Priority to US12/864,826 priority patent/US8421246B2/en
Publication of WO2009157130A1 publication Critical patent/WO2009157130A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
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    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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Definitions

  • the present invention relates to a junction structure, and more particularly to a technique for improving the durability of a junction structure that joins an electronic element constituting an electronic component and an electrode constituting the electronic component.
  • FIG. 7 shows an example of a conventional power transistor in a partially transparent view in which a part of a housing is seen through.
  • a semiconductor element 104 is disposed inside a housing 102, and the semiconductor element 104 is directly bonded to one electrode 106.
  • the semiconductor element 104 is connected to the other two electrodes 108 and 110 by wires.
  • solder is used for a joint for directly joining the semiconductor element 104 to the one electrode.
  • solder is used at the joint for mounting the electronic component itself such as a power transistor on another substrate.
  • a solder material for mounting an electronic component such as a power transistor on another substrate a solder material having a melting point of 200 to 230 ° C. is often used.
  • the soldering is generally performed by a solder immersion dipping device.
  • the temperature of the electrode of the electronic component may reach 250 to 260 ° C. in some cases.
  • the melting point of the solder material of the joint portion that internally joins the electronic element of the electronic component to the electrode is 200 to 230 ° C.
  • the solder material of the joint portion of the metal melts. If the solder material at the joint between the electronic element and the electrode is melted, a short circuit or disconnection may occur, or the electrical characteristics may change, resulting in a defect in the final product.
  • solder material having a higher melting point As such a solder material, a solder material containing Bi (bismuth) and a small amount of Cu (copper) having a melting point of 270 ° C. or higher has been proposed (see Patent Document 1).
  • Cu is used as a material such as an electrode to which an electronic element is connected because it has high conductivity and is less expensive than other highly conductive metals.
  • Ni (nickel) layer is formed on the surface of the electrode made of Cu by electrolytic plating to prevent oxidation of the electrode.
  • FIG. 8 shows an electrode having a Ni layer formed on the surface.
  • the electrode 120 in the illustrated example is made of Cu, and a Ni layer 122 having a thickness of 1 to 3 ⁇ m for preventing oxidation is formed on the surface thereof by plating.
  • FIG. 9 shows a state in which an electronic element is joined to the electrode by solder.
  • the electronic element 126 and the electrode 120 are joined by a joint portion including a solder layer 124 made of an alloy containing Bi as a main component and having a melting point of 270 ° C. or higher.
  • Bi contained in the solder layer 124 reacts with the Ni layer 122 on the surface of the electrode 120 to form an intermetallic compound made of Bi 3 Ni. Since Bi and Ni are highly reactive, almost all of the Ni layer 122 at the junction changes to an intermetallic compound made of Bi 3 Ni. Therefore, the solder layer 124 and the electrode 120 are joined with the intermetallic compound layer 128 made of Bi 3 Ni interposed therebetween.
  • Bi 3 Ni has a hard and brittle nature, when the thickness of the intermetallic compound layer 128 is increased, cracks are likely to occur in the joint, and the reliability of the joint is significantly reduced.
  • the present invention has been made in view of the above-described problems, is less likely to cause cracks, and has high reliability, a bonding structure for bonding an electronic element constituting an electronic component and an electrode constituting the electronic component, And it aims at providing the electronic component which has such a joining structure.
  • the present invention is a bonding structure for bonding an electronic element constituting an electronic component and an electrode constituting the electronic component, A solder layer comprising 0.2 to 6% by weight of copper, 0.02 to 0.2% by weight of germanium, and 93.8 to 99.78% by weight of bismuth for joining the electronic device and the electrode; , A nickel layer provided between the solder layer and at least one of the electrode and the electronic element; A barrier layer provided between the nickel layer and the solder layer, The barrier layer provides a joint structure having an average thickness of 0.5 to 4.5 ⁇ m after the electronic element and the electrode are joined by the solder layer.
  • the barrier layer contains at least one selected from the group consisting of silver, gold, palladium, aluminum and titanium.
  • the barrier layer has an initial thickness of 1 to 5 ⁇ m.
  • the solder layer contains 0.2 to 4% by weight of copper.
  • the solder layer contains 0.02 to 0.1% by weight of germanium.
  • the electrode contains copper.
  • the electronic element is a semiconductor element.
  • the semiconductor element contains Si, SiC or GaN.
  • the electronic component is a power transistor.
  • the present invention is an electronic component constituted by joining an electronic element to an electrode by a joint portion including a solder layer,
  • the solder layer comprises 0.2-6 wt% copper, 0.02-0.2 wt% germanium, and 93.8-99.78 wt% bismuth;
  • the joint further includes a nickel layer between the solder layer and at least one of the electrode and the electronic element, and a barrier layer between the nickel layer and the solder layer,
  • the barrier layer provides an electronic component having an average thickness of 0.5 to 4.5 ⁇ m after the electronic element and the electrode are joined by the solder layer.
  • the barrier layer has an initial thickness of 1 to 5 ⁇ m.
  • a joining structure for joining an electronic element constituting an electronic component and an electrode constituting the electronic component includes a solder layer made of a solder material containing Bi (bismuth) as a main component, and Ni (nickel). A layer and a barrier layer interposed therebetween.
  • the barrier layer has an average thickness of 0.5 to 4.5 ⁇ m after the electronic element and the electrode are joined by the solder layer, whereby the Bi of the solder layer reacts with Ni of the Ni layer, Generation of an intermetallic compound made of Bi 3 Ni, which is easily cracked, can be prevented. Therefore, the reliability of the joint structure can be improved.
  • the initial thickness of the barrier layer is preferably 1 to 5 ⁇ m.
  • solder material containing Bi as a main component contains 0.02 to 0.2% by weight of germanium, it is possible to remarkably suppress the generation of oxide (see FIG. 2). Therefore, the reliability of the joint structure can be further improved.
  • the solder material containing Bi as a main component has a melting point of 270 ° C. or higher.
  • a solder material having a melting point of 200 to 230 ° C. is usually used as a solder material used when mounting the electronic component itself on another substrate or the like. Thereby, it can prevent that the solder material which joins an electronic element to an electrode by the heating when mounting an electronic component on another board
  • FIG. 1 is a perspective view showing a schematic configuration of an electronic component according to an embodiment of the present invention. It is sectional drawing of an electronic component same as the above. In Examples and Comparative Examples of the present invention, it is a graph showing the relationship between the thickness of the soldering time and Bi 3 Ni layer.
  • FIG. 1 is a cross-sectional view showing a schematic configuration of a joint structure according to Embodiment 1 of the present invention.
  • the joining structure 10 in the illustrated example is a joining structure for joining an electronic element 12 constituting an electronic component (not shown) to an electrode 14 constituting the electronic component.
  • the electronic element 12 is not shown by a cross section, but a schematic shape is shown by a white figure.
  • the electronic element 12 is not particularly limited, and can be, for example, a Si (silicon) element, a GaN (gallium nitride) element, or a SiC (silicon carbide) element.
  • the electronic component is configured as a transistor or a power transistor (generally a transistor having a maximum collector loss of 1 W or more).
  • the electrode 14 contains Cu (copper) as a main component.
  • the bonding structure 10 includes a solder layer 16 for bonding the electronic element 12 and the electrode 14, a Ni (nickel) layer 18 formed on the surface of the electrode 14, and between the solder layer 16 and the Ni layer 18. And an intervening barrier layer 20.
  • the solder layer 16 is configured using an alloy (solder material) containing 90% or more of Bi (bismuth). More specifically, the solder material used for the solder layer 16 includes 0.2 to 6 wt% Cu, 0.02 to 0.2 wt% Ge (germanium), and 93.8 to 99.78 wt%. It is preferred to use alloys containing% Bi.
  • a more preferable Cu content is 0.2 to 4% by weight, and a more preferable Ge content is 0.02 to 0.1% by weight.
  • a more preferable Ge content is 0.02 to 0.1% by weight.
  • FIG. 2 shows the relationship between the Ge content and the amount of oxide produced.
  • an increase in cost can be suppressed by setting the Ge content to 0.1% by weight or less.
  • solder layer 16 made of the alloy having the above composition has a melting point of 270 to 275 ° C.
  • the solder layer 16 is melted to cause problems such as disconnection. Can be prevented. This is because the melting point of the solder material used when mounting electronic components on a substrate or the like is usually 200 to 230 ° C.
  • the Ni layer 18 is a layer provided to prevent the electrode 14 made of Cu from being oxidized, and can be formed by Ni plating.
  • the barrier layer 20 is a layer provided to prevent Ni constituting the Ni layer 18 from reacting with Bi contained in the solder layer 16 to generate an intermetallic compound composed of Bi 3 Ni.
  • the barrier layer 20 can be made of a material that does not form a compound with Bi. Examples of such materials include Ag (silver), Au (gold), Pd (palladium), Al (aluminum), and Ti (titanium). Among these, Ag, Au, and Ti are preferable from the viewpoint of being difficult to oxidize and good wettability, and Ag is most preferable in consideration of cost and bondability with Bi.
  • the barrier layer 20 is formed so that the average thickness after joining by the solder layer 16 is 0.5 to 4.5 ⁇ m. For this reason, it is preferable that the initial thickness of the barrier layer 20 before bonding by the solder layer 16 (so-called soldering) is 1 to 5 ⁇ m.
  • soldering is 1 to 5 ⁇ m.
  • the average thickness of the barrier layer 20 after joining with the solder layer 16 is obtained by cutting the joined sample with a precision cutting machine so that the cross section can be seen, and smoothing the cut surface with a polishing apparatus. It can be measured by magnifying the cut surface with an electron microscope, for example, 3000 times, measuring the thickness of arbitrary plural locations (for example, 10 locations), and calculating the average value.
  • the initial thickness of the barrier layer 20 can be similarly measured.
  • the barrier layer made of, for example, Ag so that the average thickness after the joining with the solder layer 16 is 0.5 to 4.5 ⁇ m between the Ni layer 18 and the solder layer 16.
  • the barrier layer 20 is not provided only on the electrode 14 side. As shown in FIG. 3, when the Ni layer 22 is provided on the surface of the electronic element 12, the barrier layer 24 can be provided between the solder layer 16 and the Ni layer 22 on the electronic element 12 side. Thereby, it is possible to prevent the Ni layer 22 on the surface of the electronic element 12 and the Bi of the solder layer 16 from reacting to generate an intermetallic compound composed of Bi 3 Ni.
  • FIGS. 4A and 4B As an electronic component, a transistor 30 including an IGBT discrete transistor shown in FIGS. 4A and 4B was produced. 4A is a perspective view of the transistor 30, and FIG. 4B is a cross-sectional view taken along line IVB-IVB of FIG. 4A.
  • the transistor 30 includes an Si element 32 that is the electronic element 12, a lead frame 34 that is an electrode joined to the Si element 32, and other electrodes.
  • the lead frame 34 is composed mainly of Cu.
  • the Si element 32 has a plurality of (four in the figure) terminals. One terminal of the Si element 32 is directly bonded to the lead frame 34 by the bonding portion 36. The other terminals of the Si element 32 are connected to other electrodes by aluminum wires 38, respectively.
  • the Si element 32 is protected by sealing with an epoxy resin mold (not shown).
  • the transistor 30 is used by being mounted on the substrate by bonding the external terminals 42, 44 and 46 to electrodes of another substrate (not shown) with a solder material having a melting point of 230 ° C. or less.
  • the joint portion 36 includes the solder layer 16, the Ni layer 18 formed on the surface of the lead frame 34, and the barrier layer 20 formed on the Ni layer 18.
  • the solder layer 16 was made of a solder material having a melting point of 274 ° C. containing 99.14 wt% Bi, 0.8 wt% Cu, 0.06 wt% Ge, and unavoidable impurities.
  • the thickness of the solder layer 16 was 40 ⁇ m.
  • the thickness of the Ni layer 18 was 2 ⁇ m.
  • the barrier layer 20 was formed by Ag plating so as to have a thickness of 3 ⁇ m.
  • soldering time refers to the time from when the solder material is melted until the temperature falls below the melting point.
  • the soldering temperature (solder material temperature) was adjusted according to the soldering time.
  • a test body including a total of 40 transistors 30 was produced. Then, for those specimens were examined for production of Bi 3 Ni at the junction 36. The result is shown in the graph of FIG.
  • a junction reliability test was performed on the transistors 30 of Examples 1 to 4 by a temperature cycle test.
  • the test content is 100 cycles of 100 cycles, 200 cycles, 300 cycles, 400 cycles, and 500 cycles, with each cycle of holding the transistor 30 for 30 minutes in each atmosphere of 150 ° C. and ⁇ 65 ° C.
  • the bonding failure means a state in which a crack or the like is generated in the bonded portion and there is no conduction.
  • test body made of an IGBT discrete transistor was produced in the same manner as in the above example except that the barrier layer 20 was not provided between the Ni layer 18 and the solder layer 16. At this time, there are four soldering times of 5 seconds (Comparative Example 1), 10 seconds (Comparative Example 2), 20 seconds (Comparative Example 3), and 30 seconds (Comparative Example 4). Ten test specimens were prepared for each hour. Then, with respect to those test specimens, whether or not Bi 3 Ni was generated in the joint was examined and a joint reliability test was performed in the same manner as the above-described example. The results are shown in FIG. 5 and FIG.
  • the average thickness of the intermetallic compound layer is 8 ⁇ m, and the result shows that 20% of the 40 ⁇ m solder layer 16 has changed to a hard and brittle intermetallic compound layer.
  • the intermetallic compound layer does not function as a stress relaxation layer, the solder layer functioning as a stress relaxation layer is reduced to 32 ⁇ m, which is 80% of the original, so as to maintain the reliability of bonding. It means to end.
  • the barrier layer 20 containing Ag having a sufficient thickness is formed between the Ni layer 18 and the solder layer 16 to prevent the formation of an intermetallic compound composed of Bi 3 Ni, and bonding. It can be seen that the reliability can be improved.
  • the barrier layer 20 having an initial thickness of 1 to 5 ⁇ m between the Ni layer 18 and the solder layer 16, the reliability of bonding is improved in each step.
  • the present invention the reliability of the joint structure between the electronic element and the electrode constituting the electronic component is improved. Therefore, the present invention can be suitably applied to electronic products such as transistors, SOP, QFP, CSP, chip inductors, and capacitors.

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Abstract

　接合構造は、電子部品を構成する電子素子１２と、その電子部品を構成する電極１４と、を接合する。接合構造は、０．２～６重量％の銅、０．０２～０．２重量％のゲルマニウム、および９３．８～９９．７８重量％のビスマスを含むはんだ層と、はんだ層と電極との間に設けられるニッケル層と、ニッケル層とはんだ層との間に設けられるバリア層とを含む。ここで、バリア層は、はんだ層により電子素子と電極とを接合した後の平均厚みが、０．５～４．５μｍとなるように形成される。

Description

接合構造および電子部品
　本発明は、接合構造に関し、特に電子部品を構成する電子素子と、電子部品を構成する電極と、を接合する接合構造の耐久性を向上させる技術に関する。
　パワートランジスタ等の電子部品は、半導体素子等の電子素子を少なくとも１つの電極に直接的に接合して構成されるものが多い。
　図７に、従来のパワートランジスタの一例を、筐体の一部を透視した一部透視図により示す。図示例のトランジスタ１００は、筐体１０２の内部に半導体素子１０４が配され、その半導体素子１０４は１つの電極１０６に直接的に接合されている。また、半導体素子１０４は、他の２つの電極１０８および１１０にワイヤにより接続されている。このような従来のパワートランジスタにおいて、半導体素子１０４を上記１つの電極に直接的に接合するための接合部には、はんだが使用されるのが通常である。
　また、パワートランジスタ等の電子部品それ自体を他の基板に実装するための接合部にもはんだが使用される。パワートランジスタ等の電子部品を他の基板に実装するためのはんだ材料には、融点が２００～２３０℃であるはんだ材料を使用することが多い。
　そのような場合のはんだ付けは、一般に、はんだ浸漬方式のディップ装置により接合が行われる。このとき、はんだ材料を２５０～２６０℃に加熱する必要があるために、電子部品の電極の温度も２５０～２６０℃に達することがある。このため、電子部品の電子素子を電極に内部的に接合する接合部のはんだ材料の融点が２００～２３０℃であると、電子部品を他の基板にはんだ付けする際に、電子素子と電極との接合部のはんだ材料が溶融するおそれがある。電子素子と電極との接合部のはんだ材料が溶融すると、短絡や断線が発生したり、電気特性に変化が生じたりして、最終製品に不良が発生する可能性がある。
　したがって、電子素子と電極との接合部のはんだ材料には、より高い融点のはんだ材料を使用することが要求される。そのようなはんだ材料として、融点が２７０℃以上である、Ｂｉ（ビスマス）と少量のＣｕ（銅）とを含むはんだ材料が提案されている（特許文献１参照）。
特開２００７－３１３５２６号公報
　しかしながら、Ｂｉを主成分とする融点２７０℃以上のはんだ材料を、電子素子と電極との接合部に使用すると、その接合部にクラックが入りやすくなり、接合の信頼性が低下するという問題が生じる。以下、その理由を詳しく説明する。
　電子素子が接続される電極等の材料には、高い導電性を持ち、且つ他の良導電性の金属と比較して安価であることから、一般に、Ｃｕが用いられている。
　しかし、Ｃｕは大気中に放置すると、時間の経過とともに酸化されて、酸化膜が厚くなっていく性質を持っている。このため、はんだ材料との良好な接合を得るためには、はんだによる接合の直前まで電極の表面が酸化しないように保護する必要がある。そのため、Ｃｕからなる電極の表面に、電解めっきによりＮｉ（ニッケル）層を形成し、電極の酸化を防ぐことが行われる。
　図８に、表面にＮｉ層が形成された電極を示す。図示例の電極１２０は、Ｃｕから構成されており、その表面には、酸化を防止するための厚さ１～３μｍのＮｉ層１２２がめっきにより形成されている。
　図９に、上記電極に、はんだにより電子素子を接合した様子を示す。ここでは、Ｂｉを主成分とする融点２７０℃以上の合金からなるはんだ層１２４を含む接合部により、電子素子１２６と電極１２０とが接合されている。このとき、接合部を２７１℃以上に加熱すると、はんだ層１２４に含まれるＢｉと、電極１２０の表面のＮｉ層１２２とが反応して、Ｂｉ３Ｎｉからなる金属間化合物が形成される。ＢｉとＮｉとは反応性が高いために、接合部のほぼ全てのＮｉ層１２２が、Ｂｉ３Ｎｉからなる金属間化合物に変化する。このため、はんだ層１２４と電極１２０とは、Ｂｉ３Ｎｉからなる金属間化合物層１２８を間に挟んで接合された状態となる。
　Ｂｉ３Ｎｉは、硬くて脆い性質を有しているために、金属間化合物層１２８の厚みが増すと接合部にクラックが入りやすくなり、接合の信頼性が著しく低下する。
　本発明は、上記問題点に鑑みてなされたものであり、クラックが生じ難く、信頼性の高い、電子部品を構成する電子素子と、その電子部品を構成する電極と、を接合する接合構造、およびそのような接合構造を有する電子部品を提供することを目的としている。
　上記目的を達成するために、本発明は、電子部品を構成する電子素子と、前記電子部品を構成する電極と、を接合する接合構造であって、
　前記電子素子と前記電極とを接合する、０．２～６重量％の銅、０．０２～０．２重量％のゲルマニウム、および９３．８～９９．７８重量％のビスマスを含むはんだ層と、
　前記はんだ層と、前記電極および前記電子素子の少なくとも一方と、の間に設けられるニッケル層と、
　前記ニッケル層と前記はんだ層との間に設けられるバリア層とを含み、
　前記バリア層は、前記はんだ層により前記電子素子と前記電極とを接合した後の平均厚みが、０．５～４．５μｍである接合構造を提供する。
　本発明の好ましい形態においては、前記バリア層が、銀、金、パラジウム、アルミニウムおよびチタンよりなる群から選択される少なくとも１種を含む。
　本発明の別の好ましい形態においては、前記バリア層は、初期厚みが、１～５μｍである。
　本発明の別の好ましい形態においては、前記はんだ層が、０．２～４重量％の銅を含む。
　本発明の別の好ましい形態においては、前記はんだ層が、０．０２～０．１重量％のゲルマニウムを含む。
　本発明の別の好ましい形態においては、前記電極が、銅を含む。
　本発明の別の好ましい形態においては、前記電子素子が、半導体素子である。
　本発明の別の好ましい形態においては、前記半導体素子が、Ｓｉ、ＳｉＣまたはＧａＮを含む。
　本発明の別の好ましい形態においては、前記電子部品が、パワートランジスタである。
　また、本発明は、電子素子を、はんだ層を含む接合部により電極に接合して構成される電子部品であって、
　前記はんだ層は、０．２～６重量％の銅、０．０２～０．２重量％のゲルマニウム、および９３．８～９９．７８重量％のビスマスを含み、
　前記接合部が、さらに、前記はんだ層と、前記電極および前記電子素子の少なくとも一方と、の間にニッケル層を有するとともに、前記ニッケル層と前記はんだ層との間にバリア層を有し、
　前記バリア層は、前記はんだ層により前記電子素子と前記電極とを接合した後の平均厚みが、０．５～４．５μｍである電子部品を提供する。
　本発明の電子部品において、好ましい形態においては、前記バリア層は、初期厚みが、１～５μｍである。
　本発明においては、電子部品を構成する電子素子と、電子部品を構成する電極と、を接合する接合構造が、Ｂｉ（ビスマス）を主成分として含むはんだ材料からなるはんだ層と、Ｎｉ（ニッケル）層と、それらの間に介在されるバリア層とを含む。バリア層は、はんだ層により電子素子と電極とを接合した後の平均厚みが、０．５～４．５μｍであり、これにより、はんだ層のＢｉと、Ｎｉ層のＮｉとが反応して、クラックの生じ易い、Ｂｉ３Ｎｉからなる金属間化合物が生成されるのを防止することができる。したがって、接合構造の信頼性を向上させることができる。
　はんだ層により電子素子と電極とを接合した後のバリア層の平均厚みを０．５～４．５μｍとするために、バリア層の初期厚みは、１～５μｍとするのが好ましい。これにより、接合の際にバリア層が消失してしまい、結果として、Ｂｉ３Ｎｉからなる金属間化合物が生成されてしまうのを確実に防止することができる。
　また、Ｂｉを主成分として含むはんだ材料が、０．０２～０．２重量％のゲルマニウムを含んでいることから、酸化物の生成を顕著に抑制することが可能である（図２参照）。したがって、接合構造の信頼性をさらに向上させることができる。
　また、Ｂｉを主成分として含むはんだ材料は、２７０℃以上の融点を有する。一方、電子部品それ自体を他の基板等に実装する際に使用されるはんだ材料には、通常、融点が２００～２３０℃のものが使用される。これにより、電子部品を他の基板等に実装するときの加熱により、電子素子を電極に接合するはんだ材料が溶融されるのを防止することができる。したがって、電子部品に、断線等の不良が発生するのを防止することができるという効果も奏し得る。
本発明の実施の形態１に係る接合構造の概略構成を示す一部断面図である。 はんだ材料に含まれるゲルマニウムと酸化物の生成量との関係を示すグラフである。 実施の形態１の接合構造の変形例の概略構成を示す一部断面図である。 本発明の一実施の形態に係る電子部品の概略構成を示す斜視図である。 同上の電子部品の断面図である。 本発明の実施例および比較例における、はんだ付け時間とＢｉ３Ｎｉ層の厚みとの関係を示すグラフである。 本発明の実施例および比較例における、温度サイクル試験のサイクル数と不良品発生数との関係を示すグラフである。 従来の電子部品の概略構成を示す一部透視図である。 従来の電子部品の電極の概略構成を示す断面図である。 従来の電子部品の接合構造の概略構成を示す断面図である。
　以下、図面を参照して、本発明の実施の形態を説明する。
　（実施の形態１）
　図１に、本発明の実施の形態１に係る接合構造の概略構成を断面図により示す。図示例の接合構造１０は、図示しない電子部品を構成する電子素子１２を、その電子部品を構成する電極１４と接合するための接合構造である。なお、図１においては、電子素子１２は断面により示しておらず、概略形状を白抜きの図形により示している。
　電子素子１２は、特に限定されないが、例えばＳｉ（珪素）素子、ＧａＮ（窒化ガリウム）素子、およびＳｉＣ（炭化珪素）素子とすることができる。電子素子１２が、これらの素子である場合には、電子部品は、トランジスタ、もしくはパワートランジスタ(一般に、最大コレクタ損失が１Ｗ以上のトランジスタ）として構成される。
　電極１４は、Ｃｕ（銅）を主成分として含む。
　接合構造１０は、電子素子１２と電極１４とを接合するためのはんだ層１６と、電極１４の表面に形成される、Ｎｉ（ニッケル）層１８と、はんだ層１６とＮｉ層１８との間に介在されるバリア層２０とを含んでいる。
　はんだ層１６は、Ｂｉ（ビスマス）を９０％以上含む合金（はんだ材料）を使用して構成される。より詳しくは、はんだ層１６に使用されるはんだ材料には、０．２～６重量％のＣｕ、０．０２～０．２重量％のＧｅ（ゲルマニウム）、および９３．８～９９．７８重量％のＢｉを含む合金を使用するのが好ましい。
　上記はんだ材料における、より好ましいＣｕの含有量は、０．２～４重量％であり、より好ましいＧｅの含有量は、０．０２～０．１重量％である。Ｃｕの含有量を０．２重量％以上とすることによって、はんだ材料の良好な濡れ性を確保することができる。また、Ｃｕの含有量を４重量％以下とすることによって、はんだ層１６が約２７０℃に加熱された場合にも、溶融させないようにすることが可能となる。
　また、Ｇｅの含有量を０．０２重量％以上とすることによって、酸化物の生成を顕著に抑制することができる。図２に、Ｇｅの含有量と、酸化物の生成量との関係を示す。
　一方、Ｇｅの含有量を０．１重量％以下とすることによって、コストの上昇を抑えることができる。
　また、上記組成の合金を材料とするはんだ層１６は、融点が２７０～２７５℃であるので、電子部品を他の基板等に実装するときに、はんだ層１６が溶融して、断線等の不具合が発生するのを防止することができる。電子部品を基板等に実装するときに使用されるはんだ材料の融点は、通常、２００～２３０℃だからである。
　Ｎｉ層１８は、Ｃｕからなる電極１４が酸化するのを防止するために設けられる層であり、Ｎｉメッキにより形成することができる。
　バリア層２０は、Ｎｉ層１８を構成するＮｉと、はんだ層１６に含まれるＢｉとが反応して、Ｂｉ３Ｎｉからなる金属間化合物が生成されるのを防ぐために設けられる層である。バリア層２０は、Ｂｉとの間に化合物を作らない材料から構成することができる。そのような、材料として、Ａｇ（銀）、Ａｕ（金）、Ｐｄ（パラジウム）、Ａｌ（アルミニウム）およびＴｉ（チタン）を挙げることができる。これらの中でも、酸化しにくく、濡れ性が良好であるという観点から、Ａｇ、ＡｕおよびＴｉが好ましく、さらに、コストおよびＢｉとの接合性を考慮すると、Ａｇが最も好ましい。
　バリア層２０は、はんだ層１６による接合を行った後の平均厚みが、０．５～４．５μｍとなるように形成する。このため、はんだ層１６による接合（いわゆるはんだ付け）が行われる以前のバリア層２０の初期厚みは１～５μｍであるのが好ましい。バリア層２０の初期厚みを１μｍ以上とすることによって、はんだ層１６による接合を行う際に、バリア層２０が熱等の影響により消失してしまうのを避けることができる。また、バリア層２０の初期厚みを５μｍ以下とすることによって、コストが上昇するのを避けることができる。
　ここで、はんだ層１６による接合を行った後のバリア層２０の平均厚みは、接合後の試料を、断面が見えるように精密切断機により切断し、研磨装置により切断面を平滑化した後、電子顕微鏡により切断面を例えば３０００倍に拡大し、任意の複数箇所（例えば１０箇所）の厚みを測定し、その平均値を算出することにより測定することができる。バリア層２０の初期厚みも同様にして測定することができる。
　Ｂｉとバリア層２０を構成する金属とが化合物を作ることはないために、Ｂｉとバリア層２０を構成する金属との接合は、Ｂｉおよびバリア層２０を構成する金属の拡散が徐々に進むことにより行われる。このため、ＢｉとＮｉとの場合のように、接合界面に短時間で金属間化合物の層を生成することはない。
　以上説明したように、Ｎｉ層１８と、はんだ層１６との間に、はんだ層１６による接合を行った後の平均厚みが、０．５～４．５μｍとなるように例えばＡｇからなるバリア層２０を形成することにより、Ｂｉ３Ｎｉからなる金属間化合物が生成されるのを確実に防止することができる。
　ここで、バリア層２０は、電極１４側のみに設けられるものではない。図３に示すように、電子素子１２の表面にＮｉ層２２が設けられる場合には、バリア層２４を、はんだ層１６と、電子素子１２側のＮｉ層２２との間に設けることができる。これにより、電子素子１２の表面のＮｉ層２２と、はんだ層１６のＢｉとが反応して、Ｂｉ３Ｎｉからなる金属間化合物が生成されるのを防止することができる。
　次に、本発明の実施例を説明する。本発明は、以下の実施例に限定されるものではない。
　（実施例）
　電子部品として、図４Ａおよび図４Ｂに示す、ＩＧＢＴディスクリート・トランジスタからなるトランジスタ３０を作成した。図４Ａは、トランジスタ３０の斜視図であり、図４Ｂは、図４ＡのIVＢ－IVＢ線による断面図である。
　トランジスタ３０は、電子素子１２であるＳｉ素子３２と、Ｓｉ素子３２と接合される電極であるリードフレーム３４と、他の電極とを含んでいる。リードフレーム３４は、Ｃｕを主成分として構成している。Ｓｉ素子３２は、複数（図では４つ）の端子を有している。Ｓｉ素子３２の１つの端子は、接合部３６によりリードフレーム３４に直接的に接合している。
　Ｓｉ素子３２の他の端子は、アルミニウム製のワイヤ３８により他の電極とそれぞれ接続している。また、Ｓｉ素子３２は、図示しないエポキシ樹脂のモールド体により封止して、保護している。
　また、トランジスタ３０は、各外部端子４２、４４および４６が、融点が２３０℃以下のはんだ材料により図示しない他の基板の電極と接合されることにより、その基板に実装されて、使用される。
　接合部３６は、はんだ層１６と、リードフレーム３４の表面に形成されたＮｉ層１８と、Ｎｉ層１８の上に形成されたバリア層２０とを含む。
　はんだ層１６は、９９．１４重量％のＢｉと、０．８重量％のＣｕと、０．０６重量％のＧｅと、不可避的不純物とを含む、融点が２７４℃のはんだ材料から構成した。はんだ層１６の厚みは４０μｍとした。
　Ｎｉ層１８の厚みは２μｍとした。バリア層２０は、Ａｇめっきにより、厚みが３μｍとなるように形成した。
　はんだ層１６による接合は、はんだ付け時間を、５秒(実施例１）、１０秒(実施例２）、２０秒(実施例３）および３０秒(実施例４）の４通りとし、その４通りのはんだ付け時間で各１０個のトランジスタ３０を作製した。ここで、はんだ付け時間とは、はんだ材料が溶融した時点から、その温度が融点を下回るまでの時間をいう。また、はんだ付け温度（はんだ材料温度）は、はんだ付け時間に応じて調節した。
　以上のようにして、計４０個のトランジスタ３０からなる試験体を作製した。そして、それらの試験体について、接合部３６におけるＢｉ３Ｎｉの生成の有無を調べた。その結果を、図５のグラフに示す。
　また、上記実施例１～４のトランジスタ３０について、接合信頼性試験を温度サイクル試験により実施した。その試験内容は、１５０℃および－６５℃の各雰囲気下で、トランジスタ３０を、それぞれ３０分間ずつ保持することを１サイクルとして、１００サイクル、２００サイクル、３００サイクル、４００サイクルおよび５００サイクルの１００サイクル毎に、接合不良が発生した試験体の数を計数した。その結果を、図６のグラフに示す。ここで、接合不良とは、接合部に亀裂等が発生し、導通がない状態をいう。
　（比較例）
　Ｎｉ層１８とはんだ層１６との間にバリア層２０を設けなかったこと以外は上記実施例と同様にして、ＩＧＢＴディスクリート・トランジスタからなる試験体を作製した。このとき、はんだ付け時間は、５秒(比較例１）、１０秒(比較例２）、２０秒(比較例３）および３０秒(比較例４）の４通りとし、その４通りのはんだ付け時間で各１０個の試験体を作製した。そして、それらの試験体に対して、上記実施例に対して行ったのと同様の方法で、接合部におけるＢｉ３Ｎｉの生成の有無を調べるとともに、接合信頼性試験を行った。その結果を、図５および図６に示す。
　（評価）
　図５に示すように、Ｎｉ層１８とはんだ層１６との間にバリア層２０を設けた実施例１～４においては、はんだ付け時間を３０秒に設定しても、Ｂｉ３Ｎｉからなる金属間化合物が生成されたものは存在しなかった。これに対して、バリア層２０を設けていない比較例においては、全ての比較例１～４において、Ｂｉ３Ｎｉからなる金属間化合物層が形成された。
　金属間化合物層の平均の厚みは８μｍであり、その結果は、４０μｍのはんだ層１６のうち、２０％が、硬くて脆い金属間化合物層に変化したことを示す。また、このことは、金属間化合物層は応力緩和層として機能しないために、接合の信頼性を維持するように応力緩和層として機能するはんだ層が、元の８０％である３２μｍに減少してしまうことを意味している。
　以上の結果、十分な厚みのＡｇを含むバリア層２０を、Ｎｉ層１８とはんだ層１６との間に形成しておくことにより、Ｂｉ３Ｎｉからなる金属間化合物の生成を防止して、接合の信頼性を向上させ得ることが分かる。
　また、図６から明らかなように、Ｎｉ層１８とはんだ層１６との間にバリア層２０を設けていない比較例１～４においては、２００サイクルの温度サイクル試験により接合不良が発生している。そして、サイクル数が増加するのにしたがって、不良品の発生個数が増大し、５００サイクルの温度サイクル試験においては、４０個中、２７個の試験体に接合不良が発生した。
　これに対して、Ｎｉ層１８とはんだ層１６との間にバリア層２０を設けた実施例１～４においては、５００サイクルの温度サイクル試験においても、接合不良の発生した試験体はなかった。
　以上の結果により、Ｎｉ層１８とはんだ層１６との間に、初期厚みが１～５μｍのバリア層２０を設けることによって、接合の信頼性が各段に向上することが分かる。
　本発明によれば、電子部品を構成する電子素子と電極との接合構造の信頼性が向上される。したがって、本発明は、トランジスタ、ＳＯＰ、ＱＦＰ、ＣＳＰ、チップインダクタおよびコンデンサなどの電子製品に好適に適用することができる。
　１０　接合構造
　１２　電子素子
　１４　電極
　１６　はんだ層
　１８、２２　Ｎｉ層
　２０、２４　バリア層

Claims (11)

  1. 　電子部品を構成する電子素子と、前記電子部品を構成する電極と、を接合する接合構造であって、
    　前記電子素子と前記電極とを接合する、０．２～６重量％の銅、０．０２～０．２重量％のゲルマニウム、および９３．８～９９．７８重量％のビスマスを含むはんだ層と、
    　前記はんだ層と、前記電極および前記電子素子の少なくとも一方と、の間に設けられるニッケル層と、
    　前記ニッケル層と前記はんだ層との間に設けられるバリア層とを含み、
    　前記バリア層は、前記はんだ層により前記電子素子と前記電極とを接合した後の平均厚みが、０．５～４．５μｍである接合構造。
  2. 　前記バリア層が、銀、金、パラジウム、アルミニウムおよびチタンよりなる群から選択される少なくとも１種を含む請求項１記載の接合構造。
  3. 　前記バリア層は、初期厚みが、１～５μｍである請求項１記載の接合構造。
  4. 　前記はんだ層が、０．２～４重量％の銅を含む請求項１記載の接合構造。
  5. 　前記はんだ層が、０．０２～０．１重量％のゲルマニウムを含む請求項１記載の接合構造。
  6. 　前記電極が、銅を含む請求項１記載の接合構造。
  7. 　前記電子素子が、半導体素子である請求項１記載の接合構造。
  8. 　前記半導体素子が、Ｓｉ、ＳｉＣまたはＧａＮを含む請求項７記載の接合構造。
  9. 　前記電子部品が、パワートランジスタである請求項８記載の接合構造。
  10. 　電子素子を、はんだ層を含む接合部により電極に接合して構成される電子部品であって、
    　前記はんだ層は、０．２～６重量％の銅、０．０２～０．２重量％のゲルマニウム、および９３．８～９９．７８重量％のビスマスを含み、
    　前記接合部が、さらに、前記はんだ層と、前記電極および前記電子素子の少なくとも一方と、の間にニッケル層を有するとともに、前記ニッケル層と前記はんだ層との間にバリア層を有し、
    　前記バリア層は、前記はんだ層により前記電子素子と前記電極とを接合した後の平均厚みが、０．５～４．５μｍである電子部品。
  11. 　前記バリア層は、初期厚みが、１～５μｍである請求項１０記載の電子部品。
PCT/JP2009/002265 2008-06-23 2009-05-22 接合構造および電子部品 Ceased WO2009157130A1 (ja)

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JP2012253126A (ja) * 2011-06-01 2012-12-20 Panasonic Corp 半導体装置、実装構造体、及び実装構造体の製造方法
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JP2014091149A (ja) * 2012-11-02 2014-05-19 Sumitomo Metal Mining Co Ltd Ｂｉを主成分とするはんだ合金との接合部を有する電子部品

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JPWO2009157130A1 (ja) 2011-12-08
CN102017107A (zh) 2011-04-13

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