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WO2009028360A1 - Photosensitive composition, cured film formed therefrom, and device having cured film - Google Patents

Photosensitive composition, cured film formed therefrom, and device having cured film Download PDF

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Publication number
WO2009028360A1
WO2009028360A1 PCT/JP2008/064776 JP2008064776W WO2009028360A1 WO 2009028360 A1 WO2009028360 A1 WO 2009028360A1 JP 2008064776 W JP2008064776 W JP 2008064776W WO 2009028360 A1 WO2009028360 A1 WO 2009028360A1
Authority
WO
WIPO (PCT)
Prior art keywords
carbon atoms
photosensitive composition
polysiloxane
cured film
acrylic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/064776
Other languages
French (fr)
Japanese (ja)
Inventor
Masahide Senoo
Toru Okazawa
Mitsuhito Suwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP2009530057A priority Critical patent/JP5099140B2/en
Priority to CN2008801036802A priority patent/CN101784958B/en
Publication of WO2009028360A1 publication Critical patent/WO2009028360A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G02B2006/12069—Organic material
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133357—Planarisation layers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/02—Materials and properties organic material
    • G02F2202/022—Materials and properties organic material polymeric
    • G02F2202/023—Materials and properties organic material polymeric curable

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Silicon Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

Disclosed is a photosensitive composition containing a polysiloxane (a), an acrylic resin (b), a quinonediazide compound (c) and a solvent (d). In this photosensitive composition, the mixing ratio between the polysiloxane (a) and the acrylic resin (b), namely polysiloxane/acrylic resin is from 80/20 to 20/80 in weight ratio, and the polysiloxane (a) is synthesized by reacting one or more organosilanes represented by the following general formula (1). (In the formula, R1 represents a hydrogen, an alkyl group having 1-10 carbon atoms, an alkenyl group having 2-10 carbon atoms or an aryl group having 6-15 carbon atoms, and a plurality of R1's may be the same as or different from each other; R2 represents a hydrogen, an alkyl group having 1-6 carbon atoms, an acyl group having 2-6 carbon atoms, or an aryl group having 6-15 carbon atoms, and a plurality of R2's may be the same as or different from each other; and n represents an integer of 0-3.) The photosensitive composition enables to obtain a cured film which has high heat resistance and high transparency, while exhibiting good adhesion to a substrate. This photosensitive composition is used for forming a planarization film for TFT substrates, an interlayer insulating film, or a core or cladding material for optical waveguides.
PCT/JP2008/064776 2007-08-24 2008-08-20 Photosensitive composition, cured film formed therefrom, and device having cured film Ceased WO2009028360A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009530057A JP5099140B2 (en) 2007-08-24 2008-08-20 Photosensitive composition, cured film formed therefrom, and device having cured film
CN2008801036802A CN101784958B (en) 2007-08-24 2008-08-20 Photosensitive composition, cured film formed therefrom, and device having cured film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007217984 2007-08-24
JP2007-217984 2007-08-24

Publications (1)

Publication Number Publication Date
WO2009028360A1 true WO2009028360A1 (en) 2009-03-05

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Family Applications (1)

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PCT/JP2008/064776 Ceased WO2009028360A1 (en) 2007-08-24 2008-08-20 Photosensitive composition, cured film formed therefrom, and device having cured film

Country Status (5)

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JP (1) JP5099140B2 (en)
KR (1) KR20100043259A (en)
CN (1) CN101784958B (en)
TW (1) TWI442185B (en)
WO (1) WO2009028360A1 (en)

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JP2010008603A (en) * 2008-06-25 2010-01-14 Jsr Corp Radiation sensitive resin composition for forming wiring partition, wiring partition, and its forming method
JP2010181866A (en) * 2009-01-07 2010-08-19 Fujifilm Corp Positive photosensitive resin composition, cured film, interlayer dielectric, organic electroluminescence display device, and liquid crystal display device
CN101937172A (en) * 2009-06-29 2011-01-05 Jsr株式会社 Positive type radiation-sensitive composition, cured film, interlayer insulating film and method for forming same, display element, and siloxane polymer
CN102156386A (en) * 2009-12-16 2011-08-17 Jsr株式会社 Positive radiation-sensitive composition, interlayer insulating film and method for forming the same
JP2011186247A (en) * 2010-03-09 2011-09-22 Fujifilm Corp Pattern forming method, chemically amplified resist composition, and resist film
WO2011142391A1 (en) * 2010-05-13 2011-11-17 日産化学工業株式会社 Photosensitive resin composition and display device
KR20120091138A (en) * 2009-10-30 2012-08-17 제이에스알 가부시끼가이샤 Method for forming reversed pattern and polysiloxane resin composition
WO2013089403A1 (en) * 2011-12-13 2013-06-20 주식회사 동진쎄미켐 Photoresist composition
CN103801278A (en) * 2014-02-25 2014-05-21 合肥工业大学 Method for preparing nanometer magnesium oxide composite material through dolomite attapulgite thermal activation and application thereof
JP2014189657A (en) * 2013-03-27 2014-10-06 Jsr Corp Radiation sensitive resin composition
JP2015501954A (en) * 2011-12-13 2015-01-19 ドンジン セミケム カンパニー リミテッド Photoresist composition
JP2015127829A (en) * 2009-11-27 2015-07-09 Jsr株式会社 Method for forming cured film
JP2016128901A (en) * 2014-11-21 2016-07-14 ローム・アンド・ハース・エレクトロニック・マテリアルズ・コリア・リミテッド Positive photosensitive resin composition and cured film prepared from the same
WO2017162831A1 (en) * 2016-03-25 2017-09-28 Az Electronic Materials (Luxembourg) S.A.R.L. Photosensitive siloxane composition
JPWO2016125836A1 (en) * 2015-02-04 2018-01-18 堺ディスプレイプロダクト株式会社 Positive photosensitive siloxane composition, active matrix substrate, display device, and method of manufacturing active matrix substrate
JP2019120932A (en) * 2017-12-29 2019-07-22 ローム・アンド・ハース・エレクトロニック・マテリアルズ・コリア・リミテッド Positive-type photosensitive resin composition and cured film prepared therefrom
JP2019211765A (en) * 2018-05-30 2019-12-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ・コリア・リミテッド Positive-type photosensitive resin composition and cured film prepared therefrom
JP2020086463A (en) * 2018-11-29 2020-06-04 ローム・アンド・ハース・エレクトロニック・マテリアルズ・コリア・リミテッド Positive photosensitive resin composition and cured film prepared therefrom
CN112147845A (en) * 2019-06-28 2020-12-29 罗门哈斯电子材料韩国有限公司 Positive photosensitive resin composition and cured film prepared therefrom
WO2025206117A1 (en) * 2024-03-29 2025-10-02 リンテック株式会社 Silane compound polymer, semiconductor insulating material, and semiconductor insulating film-forming agent

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TWI477914B (en) * 2012-03-29 2015-03-21 Chi Mei Corp Photocurable polydecane composition, protective film and component having protective film
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KR102058769B1 (en) * 2012-07-24 2019-12-23 닛산 가가쿠 가부시키가이샤 Method for manufacturing liquid crystal alignment film, liquid crystal alignment film, liquid crystal display element, polymer, and liquid crystal aligning agent
TWI468860B (en) * 2012-08-14 2015-01-11 奇美實業股份有限公司 Photosensitive resin composition and application thereof
WO2014054455A1 (en) * 2012-10-02 2014-04-10 日産化学工業株式会社 Negative photosensitive resin composition
TWI540181B (en) * 2012-12-20 2016-07-01 奇美實業股份有限公司 Photosensitive polysiloxane composition, protecting film and element containing said protecting film
TWI479269B (en) * 2012-12-25 2015-04-01 Chi Mei Corp Photosensitive polysiloxane composition and uses thereof
CN104280967A (en) * 2014-10-31 2015-01-14 京东方科技集团股份有限公司 Array substrate, manufacturing method of array substrate, display panel and display device
KR20160064758A (en) 2014-11-28 2016-06-08 롬엔드하스전자재료코리아유한회사 Positive-type photosensitive resin composition and cured film prepared therefrom
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KR102517695B1 (en) * 2017-01-20 2023-04-03 제이에스알 가부시끼가이샤 Photosensitive composition, cured film and method for producing same, display device, light emitting element, and light receiving element
US10748757B2 (en) * 2017-09-21 2020-08-18 Honeywell International, Inc. Thermally removable fill materials for anti-stiction applications
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KR20220093540A (en) 2020-12-28 2022-07-05 롬엔드하스전자재료코리아유한회사 Positive-type photosensitive resin composition and cured film prepared therefrom
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