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WO2009022870A3 - Appareil destiné à l'exécution d'une inspection électrique - Google Patents

Appareil destiné à l'exécution d'une inspection électrique Download PDF

Info

Publication number
WO2009022870A3
WO2009022870A3 PCT/KR2008/004738 KR2008004738W WO2009022870A3 WO 2009022870 A3 WO2009022870 A3 WO 2009022870A3 KR 2008004738 W KR2008004738 W KR 2008004738W WO 2009022870 A3 WO2009022870 A3 WO 2009022870A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
disposed
electrical contact
electrical
contact section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2008/004738
Other languages
English (en)
Other versions
WO2009022870A2 (fr
Inventor
Woo-Chang Choi
Ki-Joon Kim
Jun-Tae Hwang
Ji-Won Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soulbrain ENG Co Ltd
Original Assignee
Phicom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phicom Corp filed Critical Phicom Corp
Publication of WO2009022870A2 publication Critical patent/WO2009022870A2/fr
Publication of WO2009022870A3 publication Critical patent/WO2009022870A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Dans un appareil destiné à l'exécution d'une inspection électrique, un premier substrat possède une première surface et une deuxième surface située à l'opposé de la première surface sur le premier substrat et une zone de contact électrique est disposée sur la première surface du premier substrat. Une ligne d'acheminement de signaux est disposée à l'intérieur du premier substrat de façon à relier électriquement la première surface à la deuxième surface. La zone de contact électrique est reliée électriquement à la ligne d'acheminement de signaux et possède une élasticité lui permettant de s'incurver lorsque la zone de contact électrique est mise en contact avec un objet à inspecter. Une zone de connexion électrique est reliée électriquement à la deuxième surface du premier substrat et elle possède une structure à ligne microruban qui comprend une première couche conductrice servant de ligne de transmission, une deuxième couche conductrice servant de ligne de mise à la terre et une couche diélectrique disposée entre la première et la deuxième couche conductrice.
PCT/KR2008/004738 2007-08-14 2008-08-14 Appareil destiné à l'exécution d'une inspection électrique Ceased WO2009022870A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070081519A KR100799128B1 (ko) 2007-08-14 2007-08-14 전기 검사 장치
KR10-2007-0081519 2007-08-14

Publications (2)

Publication Number Publication Date
WO2009022870A2 WO2009022870A2 (fr) 2009-02-19
WO2009022870A3 true WO2009022870A3 (fr) 2009-04-02

Family

ID=39219658

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/004738 Ceased WO2009022870A2 (fr) 2007-08-14 2008-08-14 Appareil destiné à l'exécution d'une inspection électrique

Country Status (3)

Country Link
KR (1) KR100799128B1 (fr)
TW (1) TWI381179B (fr)
WO (1) WO2009022870A2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI418794B (zh) * 2009-10-23 2013-12-11 Mpi Corporaion Vertical probe card
CN102410237A (zh) * 2010-09-21 2012-04-11 纬创资通股份有限公司 风扇转速控制方法及相关计算机系统
IT201700017061A1 (it) * 2017-02-15 2018-08-15 Technoprobe Spa Scheda di misura perfezionata per applicazioni ad alta frequenza
JP7224575B2 (ja) * 2017-05-30 2023-02-20 株式会社オリティ プローブカード

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6545493B1 (en) * 1999-09-29 2003-04-08 Tokyo Electron Limited High-speed probing apparatus
US6876073B2 (en) * 2000-03-17 2005-04-05 Renesas Technology Corp. Semiconductor device and contractor for inspection
US6970004B2 (en) * 2000-02-25 2005-11-29 Hitachi, Ltd. Apparatus for inspecting defects of devices and method of inspecting defects

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6911835B2 (en) * 2002-05-08 2005-06-28 Formfactor, Inc. High performance probe system
US7245134B2 (en) * 2005-01-31 2007-07-17 Formfactor, Inc. Probe card assembly including a programmable device to selectively route signals from channels of a test system controller to probes
TWI285741B (en) * 2005-02-02 2007-08-21 Mjc Probe Inc Testing probe
US7279911B2 (en) * 2005-05-03 2007-10-09 Sv Probe Pte Ltd. Probe card assembly with dielectric structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6545493B1 (en) * 1999-09-29 2003-04-08 Tokyo Electron Limited High-speed probing apparatus
US6970004B2 (en) * 2000-02-25 2005-11-29 Hitachi, Ltd. Apparatus for inspecting defects of devices and method of inspecting defects
US6876073B2 (en) * 2000-03-17 2005-04-05 Renesas Technology Corp. Semiconductor device and contractor for inspection

Also Published As

Publication number Publication date
KR100799128B1 (ko) 2008-01-29
TW200912345A (en) 2009-03-16
WO2009022870A2 (fr) 2009-02-19
TWI381179B (zh) 2013-01-01

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