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WO2009022870A2 - Appareil destiné à l'exécution d'une inspection électrique - Google Patents

Appareil destiné à l'exécution d'une inspection électrique Download PDF

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Publication number
WO2009022870A2
WO2009022870A2 PCT/KR2008/004738 KR2008004738W WO2009022870A2 WO 2009022870 A2 WO2009022870 A2 WO 2009022870A2 KR 2008004738 W KR2008004738 W KR 2008004738W WO 2009022870 A2 WO2009022870 A2 WO 2009022870A2
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
disposed
section
electrical
electrical contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2008/004738
Other languages
English (en)
Other versions
WO2009022870A3 (fr
Inventor
Woo-Chang Choi
Ki-Joon Kim
Jun-Tae Hwang
Ji-Won Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soulbrain ENG Co Ltd
Original Assignee
Phicom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phicom Corp filed Critical Phicom Corp
Publication of WO2009022870A2 publication Critical patent/WO2009022870A2/fr
Publication of WO2009022870A3 publication Critical patent/WO2009022870A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Definitions

  • the present invention relates to an apparatus for performing an electrical inspection.
  • the present invention relates to an apparatus for performing an electrical inspection on an object to be inspected by making contact with the object.
  • semiconductor devices including circuit patterns are generally formed on a semiconductor substrate such as a silicon wafer, and an electrical inspection process such as an electrical die sorting (EDS) process may then be performed to inspect electrical characteristics of the semiconductor devices.
  • EDS electrical die sorting
  • An electrical inspection apparatus for example, a probe card, may be employed to perform the electrical inspection process.
  • electrical inspection apparatuses are being developed to cope with semiconductor substrates having relatively large diameters.
  • electrical inspection apparatuses are mainly being developed to smoothly perform electrical inspection processes on semiconductor substrates having large diameters, such as 8-inch wafers or 12-inch wafers.
  • Example embodiments of the present invention provide an apparatus for performing an electrical inspection suitable for performing an electrical inspection on a discrete device such as a radio frequency integrated circuit (RFIC) device.
  • RFIC radio frequency integrated circuit
  • An apparatus for performing an electrical inspection may include a first substrate having a first surface and a second surface opposite to the first surface, a signal line being disposed within the first substrate to electrically connect the first surface with the second surface; an electrical contact section disposed on the first surface of the first substrate and electrically connected with the signal line, the electrical contact section having elasticity so as to become curved when the electrical contact section is brought into contact with an object to be inspected; and an electrical connection section electrically connected with the second surface of the first substrate and having a micro-strip line structure that includes a first conductive layer serving as a transmission line, a second conductive layer serving as a ground line and a dielectric layer disposed between the first and second conductive layers.
  • the first substrate may include a ceramic material or glass.
  • the electrical connection section may be electrically connected with a coplanar waveguide (CPW) structure that is disposed on the second surface of the first substrate and includes a waveguide circuit line and a ground line.
  • CPW coplanar waveguide
  • a CPW structure including a waveguide circuit line and a ground line may be disposed on the first surface of the first substrate, and the electrical contact section may be electrically connected with the signal line by the waveguide circuit line.
  • the electrical contact section may include a bump disposed on the first surface of the first substrate; a beam extending from the bump and having elasticity; and a tip disposed on an end of the beam to be brought into contact with the object.
  • the electrical connection section may include a flexible cable or a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • the apparatus may further include a second substrate electrically connected with the second surface of the first substrate by the electrical connection section.
  • the object may be an RFIC device, an active element or a passive element.
  • An apparatus for performing an electrical inspection may include a first substrate having a first surface and a second surface opposite to the first surface, a signal line being disposed within the first substrate to electrically connect the first surface with the second surface; an electrical contact section disposed on the first surface of the first substrate and electrically connected with the signal line, the electrical contact section having elasticity so as to become curved when the electrical contact section is brought into contact with an object to be inspected; a second substrate having a through-hole to receive the first substrate; and an electrical connection section to electrically connect the second surface of the first substrate with the second substrate.
  • the first substrate may include a ceramic material or glass.
  • the electrical contact section may include a bump disposed on the first surface of the first substrate, a beam extending from the bump and having elasticity and a tip disposed on an end of the beam to be brought into contact with the object.
  • the electrical connection section may include a flexible cable or an FPCB.
  • the first substrate may be received in the through-hole of the second substrate to allow the electrical contact section to protrude from a surface of the second substrate.
  • the apparatus may further include a support section disposed through the through-hole of the second substrate and connected to the second surface of the first substrate to support the first substrate; a cover including a plate-shaped central portion and a ring- shaped edge portion extending from the central portion toward the second substrate to partially receive the support section; and a plurality of fasteners for mounting the cover on the second substrate.
  • the apparatus may further include an elastic member disposed between the edge portion of the cover and the second substrate and connected with the support section to elastically support the support section.
  • the apparatus may further include a plurality of horizontal level-adjusting members extending through the cover and pressurizing the support section to adjust the horizontal level of the first substrate.
  • the object may be an RFIC device, an active element or a passive element.
  • the electrical connection section may be detachably connected to the second substrate.
  • the electrical connection section may have a micro-strip line structure that includes a first conductive layer serving as a transmission line, a second conductive layer serving as a ground line and a dielectric layer disposed between the first and second conductive layers. Further, the electrical connection section may be electrically connected with a CPW structure that is disposed on the second surface of the first substrate and includes a waveguide circuit line and a ground line. [24] In accordance with some example embodiments of the present invention, a CPW structure including a waveguide circuit line and a ground line may be disposed on the first surface of the first substrate, and the electrical contact section may be electrically connected with the signal line by the waveguide circuit line.
  • an electrical inspection apparatus for performing an electrical inspection process on a discrete device such as an RFIC device may include an electrical contact section to be brought into contact with an object to be inspected, and a first substrate having a first surface to which the electrical contact section is connected.
  • the size of the first substrate may vary in accordance with that of the discrete device to thereby cope with discrete devices of various kinds.
  • the electrical inspection apparatus may further include a second substrate electrically connected with the first substrate.
  • the first substrate may be electrically connected with the second substrate by an electrical connection section.
  • the electrical connection section may have a micro-strip line structure, and a CPW structure may be disposed on a second surface of the first substrate and may be connected with the electrical connection section.
  • FIG. 1 is a schematic view illustrating an apparatus for performing an electrical inspection in accordance with an example embodiment of the present invention
  • FIG. 2 is a schematic view illustrating an electrical contact section of the electrical inspection apparatus shown in FIG. 1 ;
  • FIG. 3 is a schematic view illustrating a state in which the electrical contact section shown in FIG. 1 is in contact with an object to be inspected.
  • FIG. 4 is a schematic view illustrating an electrical connection section connected to a second surface of a first substrate shown in FIG. 1. Best Mode for Carrying Out the Invention
  • first, second, third etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.
  • spatially relative terms such as “lower,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
  • FIG. 1 is a schematic view illustrating an apparatus for performing an electrical inspection in accordance with an example embodiment of the present invention
  • FIG. 2 is a schematic view illustrating an electrical contact section of the electrical inspection apparatus shown in FIG. 1
  • FIG. 3 is a schematic view illustrating a state in which the electrical contact section shown in FIG. 1 is in contact with an object to be inspected
  • FIG. 4 is a schematic view illustrating an electrical connection section connected to a second surface of a first substrate shown in FIG. 1.
  • an apparatus 100 for performing an electrical inspection may include a first substrate 11, an electrical contact section 13, an electrical connection section 15, a second substrate 17, etc.
  • the first substrate 11 may be formed of a solid material to facilitate manufacture thereof.
  • the solid material that may be used for the first substrate 11 may include a ceramic material, glass, and the like. These solid materials may be used alone or in a combination thereof.
  • a signal line l ie may be disposed within the first substrate 11 to transmit electrical signals.
  • the first substrate 11 may have a first surface 11a and a second surface 1 Ib opposite to the first substrate 1 Ia, and the signal line 1 Ic may be disposed within the first substrate 11 to connect the first surface 11a with the second surface l ib.
  • the first substrate 11 may be equivalent to a micro-probe head (MPH) or a space transformer of a conventional probe card.
  • MPH micro-probe head
  • the first substrate 1 Ic of the electrical inspection apparatus 100 may have a size suitable for performing an electrical inspection process on a discrete device such as a radio frequency integrated circuit (RFIC) device, an active element, a passive element, and the like.
  • RFIC radio frequency integrated circuit
  • the first substrate 1 Ic may be distinct from the MPH or the space transformer of the conventional probe card.
  • the electrical contact section 13 may be disposed on the first surface 1 Ia of the first substrate 11 to come into contact with an object 300 to be inspected. Particularly, the electrical contact section 13 may be electrically connected with the signal line 1 Ic in the first substrate 11. In accordance with some example embodiments of the present invention, a plurality of electrical contact sections 13 may be disposed on the first surface 1 Ia of the first substrate 11, and a plurality of signal lines l ie that are electrically connected with the electrical contact sections 13 may be disposed within the first substrate 11.
  • the electrical contact section 13 may be configured to become curved when coming into contact with the object 300 as shown in FIG. 3. Particularly, when the electrical contact section 13 is brought into contact with a pad 300a of the object 300 to perform the electrical inspection process on the object 300, it is desirable that the electrical contact section 13 have elasticity to become curved.
  • the electrical contact section 13 may have a cantilever structure to become curved when the electrical contact section 13 is brought into contact with the pad 300a of the object 300.
  • the electrical contact section 13 is formed of a solid material, in the same way as the first substrate 11, the electrical contact section 13 and the pad 300a of the object 300 may be damaged by a force applied to the electrical contact section 13 or the object 300 when the electrical contact section 13 is brought into contact with the pad 300a of the object 300.
  • the force applied to the electrical contact section 13 or the object 300 may be elastically absorbed by the electrical contact section 13, thereby preventing damage to the electrical contact section 13 and the pad 300a of the object 300.
  • the electrical contact section 13 may be sufficiently brought into contact with the pad 300a of the object 300, and the reliability of the electrical inspection process may thus be improved.
  • the electrical contact section 13 may include a bump 13a, a beam 13b and a tip 13c.
  • the bump 13a may be disposed on the first surface 1 Ia of the first substrate 11 to connect the beam 13b to the first substrate 11.
  • the beam 13b may be connected to the bump 13a and may extend in a direction parallel to the first surface 1 Ia of the first substrate 11.
  • the tip 13c may be connected to an end of the beam 13b and may further be disposed on the end of the tip 13c in a direction perpendicular to the first surface 1 Ia of the first substrate.
  • the tip 13c may be disposed toward the object 300 so as to enable the tip 13c to bring into direct contact with the pad 300a of the object 300.
  • the beam 13b may have elasticity so as to become curved when the tip 13c is brought into contact with the pad 300a of the object 300.
  • the bump 13a may be used as an element for electrically connecting the beam 13b to the first substrate 11.
  • the electrical connection section 15 may be disposed on the second surface 1 Ib of the first substrate 11. Particularly, the electrical connection section 15 may be disposed on the second surface 1 Ib of the first substrate to be electrically connected with the signal line l ie disposed within the first substrate 11. In accordance with some example embodiments of the present invention, a plurality of electrical connection sections 15 may be disposed on the second surface 1 Ib of the first substrate and may be electrically connected with the plurality of signal lines l ie disposed within the first substrate 11.
  • the electrical connection section 15 may be provided to transmit electrical signals, which are transmitted from the electrical contact section 13 via the first substrate 11, to the outside, for example, to the second substrate 17. That is, the electrical connection section 15 may electrically connect the first substrate 11 with the second substrate 17.
  • the electrical connection section 15 may be formed of a flexible material to facilitate the electrical connection between the first substrate 11 and the second substrate 17.
  • examples of the electrical connection section 15 may include a flexible cable, a flexible printed circuit board (FPCB), and the like.
  • the electrical inspection apparatus 100 may include the first substrate 11 formed of the solid material, wherein the signal line 1 Ic is disposed within the first substrate 11, the electrical contact section 13 disposed on the first surface 1 Ia of the first substrate 11 and having elasticity to become curved when the electrical contact section 13 is brought into contact with the pad 300a of the object 300, and the electrical connection section 15 formed of the flexible material and disposed on the second surface 1 Ib of the first substrate 11.
  • the electrical connection section 15 may be detachably connected to the second substrate 17.
  • a socket (not shown) may be disposed on the second substrate 17, and a plug (not shown) may be connected to an end of the electrical connection section 15. That is, the electrical connection section 15 may be detachably connected to the second substrate 17 by the socket and the plug.
  • a plurality of first substrates 11 and a plurality of electrical contact sections 13 may be prepared to cope with discrete devices of various kinds, and the first substrates 11 and the electrical contact sections 13 may be selectively connected to the second substrate 17, thereby performing electrical inspection processes on the discrete devices of various kinds with ease.
  • the second substrate 17 may have a through-hole to receive the first substrate 11 having the first surface 1 Ia to which the electrical contact section 13 is connected. That is, the first substrate 11 having the first surface 1 Ia to which the electrical contact section 13 is connected may be disposed in the through-hole of the second substrate 17, and the electrical connection section 15 may electrically connect the first substrate 11 with the second substrate 17.
  • the electrical connection section 15 may be detachably connected to the second substrate 17. Particularly, the size of the first substrate 11 may vary to cope with the discrete devices, and thus it is desirable that the electrical connection section 15 be formed of the flexible material.
  • the second substrate 17 may be a printed circuit board (PCB).
  • the second substrate 17 has the through-hole to receive the first substrate 11
  • the scope of the present invention may not be limited by the through-hole of the second substrate 17. That is, the configuration of electrically connecting the first substrate 11 with the second substrate 17 using the electrical connection section 15 may vary in accordance with shapes of the discrete devices.
  • the 17 may protrude from the second substrate 17 to allow the electrical contact section 13 to come into contact with the pad 300a of the object 300. That is, the first substrate 11, as shown in FIG. 1, may be disposed in the through-hole of the second substrate 17 to allow the electrical contact section 13 to be spaced apart from the second substrate 17 toward the object 300.
  • the electrical inspection apparatus 100 may include a support section 19 to support the first substrate 11. Further, the support section 19 may be provided to mount the first substrate 11 on the second substrate 17 and to protect the first substrate 11. The support section 19 may be connected to the second surface 1 Ib of the first substrate 11. For example, the support section 19 may be connected to a remaining portion except for an edge portion of the second surface 1 Ib of the first substrate 11, and the electrical connection section 15 may be connected to the edge portion of the second surface 1 Ib of the first substrate 11.
  • the support section 19 may include first support members 19a connected to remaining portions except for the edge portion of the second surface 1 Ib of the first substrate 11.
  • each of the first support members 19a may have a pillar shape.
  • the support section 19 may further include a third support member 19c connected to the second substrate 17 and a second support member 19b to connect the first support members 19a with the third support member 19c.
  • the support section 19 may include one first support member.
  • the electrical inspection apparatus 100 may include a cover 21 mounted on the second substrate 17.
  • the cover 21 may be configured to partially receive the support section 19.
  • the cover 21, as shown in FIG. 1, may include a plate-shaped central portion 21a disposed over the third support member 19c of the support section 19 and a ring-shaped edge portion 21b extending from the central portion 21a toward the second substrate 17.
  • the edge portion 21b of the cover 21 may be disposed on the second substrate 17 to surround the through-hole of the second substrate 17 and may be mounted on the second substrate 17 by a plurality of fasteners 23 that are driven into the second substrate 17 through the edge portion 21b of the cover 21.
  • the fasteners 23 may be driven into the edge portion 21b of the cover 21 through the second substrate 17.
  • a plurality of bolts and a plurality of nuts may be used as the fasteners 23 to mount the cover 21 on the second substrate 17.
  • the third support member 19c of the support section 19 may have a width greater than that of the through-hole of the second substrate 17, and the third support 19c of the support section 19 may be stably fixed in a space between the second substrate 17 and the cover 21.
  • the electrical inspection apparatus 100 may further include horizontal level-adjusting members 25 to adjust the horizontal level or the flatness of the first substrate 11.
  • the horizontal level-adjusting members 25 may be provided to bring the electrical contact section 13 into sufficient contact with the pad 300a of the object 300.
  • the horizontal level-adjusting members 25 may extend through the central portion 21a of the cover and may pressurize the support section 19 to adjust the horizontal level of the first substrate 11.
  • a plurality of threaded holes may be formed through the central portion 21a of the cover 21, and a plurality of horizontal level-adjusting members 25 may be screwed into the threaded holes. Particularly, as shown in FIG.
  • the horizontal level-adjusting members 25 may be protruded toward the third support member 19c of the support section 19 and may pressurize the third support member 19c of the support section 19 to adjust the horizontal level of the first substrate 11. Further, a plurality of recesses may be formed at surface portions of the third support member 19c of the support section 19 opposite to the central portion 21a of the cover 21, and the horizontal level-adjusting members 25 may be inserted into the recesses. In accordance with some example embodiments of the present invention, a plurality of set screws may be used as the horizontal level-adjusting members 25.
  • the electrical inspection apparatus 100 may further include an elastic member 27 disposed between the second substrate 17 and the edge portion 21b of the cover 21 to elastically support the support section 19.
  • the elastic member 27 may be a ring plate formed of an elastic material and may be disposed between the second substrate 17 and the edge portion 21b of the cover 21 to allow the second support member 19b of the support section 19 to extend through a through-hole of the elastic member 27.
  • the third support member 19c of the support section 19 may be connected to the second substrate 17 via the elastic member 27.
  • the third support member 19c of the support section 19 may be disposed between the central portion 21a of the cover 21 and the elastic member 27 and may be elastically supported by the elastic member 27.
  • the third support member 19c of the support section 19 may be fixed by the horizontal level-adjusting members 25 and the elastic member 27.
  • the second support member 19b of the support section 19 may be connected to a central portion of a lower surface of the third support member 19c, and the elastic member 27 may elastically support an edge portion of the lower surface of the third support member 19c.
  • the edge portion of the lower surface of the third support member 19c may be chamfered to allow the elastic member 27 to elastically support the support section 19.
  • the second support member 19b of the support section 19 may extend downward through the through-hole of the second substrate 17 and the through-hole of the elastic member 27.
  • the third support member 19c of the support section 19 may be elastically supported by the elastic member 27, and the horizontal level of the first substrate 11 may be easily adjusted by the horizontal level-adjusting members 25.
  • a plurality of elastic members may be employed to elastically support the third support member 19c of the support section 19.
  • a plurality of leaf springs may be disposed between the second substrate 17 and the edge portion 21b of the cover 21 and may extend toward a central axis of the through-hole of the second substrate 17 to elastically support the third support member 19c of the support section 19.
  • the electrical inspection apparatus 100 may include the first substrate 11 formed of the solid material, wherein the signal line 1 Ic is disposed within the first substrate 11, the electrical contact section 13 disposed on the first surface 1 Ia of the first substrate 11 and having elasticity to become curved when the electrical contact section 13 is brought into contact with the pad 300a of the object 300, the electrical connection section 15 formed of the flexible material and disposed on the second surface 1 Ib of the first substrate 11, the support section 19 for supporting the first substrate 11, the cover 21 for mounting the support section 19 on the second substrate 17, the elastic member 27 disposed between the second substrate 17 and the cover 21 to elastically support the support section 19, and the horizontal level-adjusting members 25 disposed through the cover 21 to pressurize the support section 29 so as to adjust the horizontal level of the first substrate 11.
  • the horizontal level of the first substrate 11 may be adjusted by the horizontal level-adjusting members 25 and the elastic member 27 to thereby improve the reliability of the electrical inspection process.
  • the electrical connection section 15 may have a micro-strip line structure.
  • the electrical connection section 15 may include a first conductive layer 15b serving as a transmission line, a second conductive layer 15c serving as a ground line, and a dielectric layer 15a disposed between the first conductive layer 15b and the second conductive layer 15c.
  • a coplanar waveguide (CPW) structure may be disposed on the second surface 1 Ib of the first substrate 11 and may be electrically connected with the electrical connection section 15.
  • the CPW structure may include a waveguide circuit line 41 and a ground line 43.
  • a first CPW structure including a first waveguide circuit line and a first ground line may be disposed on the first surface 1 Ia of the first substrate 11, and a second CPW structure including a second waveguide circuit line and a second ground line may be disposed on the second surface 1 Ib of the first substrate 11.
  • the first waveguide circuit line may electrically connect the electrical contact section 13 with the signal line l ie
  • the second waveguide circuit line may electrically connect the signal line l ie with the second substrate 17 via the first conductive layer 15b of the electrical connection section 15.
  • the first ground line may be electrically connected with the second ground line by a via wiring formed through the first substrate 11, and the second ground line may be electrically connected with the second conductive layer 15c of the electrical connection section 15.
  • the first conductive layer 15b serving as the transmission line may be electrically connected with the waveguide circuit line 41 of the CPW structure
  • the second conductive layer 15c serving as the ground line may be electrically connected with the ground line 43 of the CPW structure.
  • the ground line 43 electrically connected with the second conductive layer 15c may be electrically connected with a via wiring formed through the first substrate 11.
  • the electrical connection section 15 may be electrically connected with the CPW structure disposed on the second surface 1 Ib of the first substrate 11 by a solder bonding process.
  • the width of the first conductive layer 15b serving as the transmission line and a height between the first and second conductive layers 15b and 15c may vary in accordance with the frequency of a high-frequency signal to be transmitted.
  • the CPW structure is disposed on the second surface 1 Ib of the first substrate 11, the width of the waveguide circuit line 41 and a gap between the waveguide circuit line 41 and the ground line 43 may vary the frequency of the high-frequency signal. As a result, the transmission efficiency of the high-frequency signal may be improved.
  • an electrical inspection apparatus for performing an electrical inspection process on a discrete device such as an RFIC device may include an electrical contact section to be brought into contact with an object to be inspected, a first substrate having a first surface to which the electrical contact section is connected, and a second substrate electrically connected with the first substrate.
  • the size of the first substrate may vary in accordance with that of the discrete device to thereby cope with discrete devices of various kinds.
  • an electrical connection section for electrically connecting the first substrate with the second substrate may have a micro-strip line structure, and a CPW structure may be disposed on a second surface of the first substrate and may be connected with the electrical connection section.
  • a CPW structure may be disposed on a second surface of the first substrate and may be connected with the electrical connection section.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)

Abstract

Dans un appareil destiné à l'exécution d'une inspection électrique, un premier substrat possède une première surface et une deuxième surface située à l'opposé de la première surface sur le premier substrat et une zone de contact électrique est disposée sur la première surface du premier substrat. Une ligne d'acheminement de signaux est disposée à l'intérieur du premier substrat de façon à relier électriquement la première surface à la deuxième surface. La zone de contact électrique est reliée électriquement à la ligne d'acheminement de signaux et possède une élasticité lui permettant de s'incurver lorsque la zone de contact électrique est mise en contact avec un objet à inspecter. Une zone de connexion électrique est reliée électriquement à la deuxième surface du premier substrat et elle possède une structure à ligne microruban qui comprend une première couche conductrice servant de ligne de transmission, une deuxième couche conductrice servant de ligne de mise à la terre et une couche diélectrique disposée entre la première et la deuxième couche conductrice.
PCT/KR2008/004738 2007-08-14 2008-08-14 Appareil destiné à l'exécution d'une inspection électrique Ceased WO2009022870A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070081519A KR100799128B1 (ko) 2007-08-14 2007-08-14 전기 검사 장치
KR10-2007-0081519 2007-08-14

Publications (2)

Publication Number Publication Date
WO2009022870A2 true WO2009022870A2 (fr) 2009-02-19
WO2009022870A3 WO2009022870A3 (fr) 2009-04-02

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KR (1) KR100799128B1 (fr)
TW (1) TWI381179B (fr)
WO (1) WO2009022870A2 (fr)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110312940A (zh) * 2017-02-15 2019-10-08 泰克诺探头公司 用于高频应用的改进的探针卡
CN110312940B (zh) * 2017-02-15 2021-11-12 泰克诺探头公司 用于高频应用的改进的探针卡
JP2018204988A (ja) * 2017-05-30 2018-12-27 株式会社オリティ プローブカード

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KR100799128B1 (ko) 2008-01-29
TW200912345A (en) 2009-03-16
WO2009022870A3 (fr) 2009-04-02

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