KR100799128B1 - 전기 검사 장치 - Google Patents
전기 검사 장치 Download PDFInfo
- Publication number
- KR100799128B1 KR100799128B1 KR1020070081519A KR20070081519A KR100799128B1 KR 100799128 B1 KR100799128 B1 KR 100799128B1 KR 1020070081519 A KR1020070081519 A KR 1020070081519A KR 20070081519 A KR20070081519 A KR 20070081519A KR 100799128 B1 KR100799128 B1 KR 100799128B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- electrical
- delete delete
- electrical contact
- electrical inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
Abstract
Description
Claims (18)
- 강성 재질로 이루어지고, 제1 표면 그리고 상기 제1 표면과 대향하는 제2 표면을 갖고, 상기 제1 표면과 제2 표면 사이를 전기적으로 연결하는 배선을 그 내부에 구비하는 제1 기판;상기 제1 기판 내부에 구비된 배선과 전기적으로 연결되게 상기 제1 기판의 제1 표면에 형성되고, 피검사체와 접촉할 때 탄성력의 제공이 가능한 전기 접촉부; 및고주파 소자를 대상으로 전기 검사를 수행하는 것이 가능하게, 플랙시블(flexible)한 연성 재질로 이루어지면서 유전체 기판을 사이에 두고 일면에는 전송 선로의 도체가 형성되고 타면에는 접지 기능의 선로가 형성된 마이크로 스트립 라인(microstrip line)의 구조를 갖고, 상기 마이크로 스트립 라인의 구조 중에서 상기 전송 선로의 도체는 상기 제1 기판 내부에 구비된 배선과 전기적으로 연결되게 상기 제1 기판의 제2 표면에 배치되고, 상기 전기 접촉부로부터 상기 제1 기판 내부에 구비된 배선을 통하여 전달되는 전기 신호를 외부와 연결하는 전기 연결부를 포함하는 전기 검사 장치.
- 제1 항에 있어서, 상기 제1 기판은 세라믹 재질 또는 유리 재질로 이루어지는 것을 특징으로 하는 전기 검사 장치.
- 제1 항에 있어서, 상기 전기 연결부와 연결되는 제1 기판의 제2 표면은 접지 선로와 도파 회로 선로를 포함하는 단일 평면 도파로(Co-planar waveguide : CPW) 구조를 갖는 것을 특징으로 하는 전기 검사 장치.
- 제1 항에 있어서, 상기 제1 기판의 제1 표면, 상기 제1 기판의 배선이 형성되는 내측벽 그리고 상기 전기 접촉부는 접지 선호와 도파 회로 선로를 포함하는 단일 평면 도파로 구조를 갖는 것을 특징으로 하는 전기 검사 장치.
- 제1 항에 있어서, 상기 전기 접촉부는 상기 피검사체와 접촉할 때 탄성력의 제공이 가능하게 상기 제1 기판의 제1 표면에 형성되는 범프, 상기 범프와 연결되는 빔 그리고 상기 빔과 연결되는 팁을 갖는 켄틸레버(cantilever) 구조를 갖는 것을 특징으로 하는 전기 검사 장치.
- 제1 항에 있어서, 상기 전기 연결부는 플랙시블한 케이블 또는 플랙시블-인쇄회로기판(FPCB)을 포함하는 것을 특징으로 하는 전기 검사 장치.
- 제1 항에 있어서, 상기 전기 연결부에 의해 상기 제1 기판과 전기적으로 연결되는 제2 기판을 더 포함하는 것을 특징으로 하는 전기 검사 장치.
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Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070081519A KR100799128B1 (ko) | 2007-08-14 | 2007-08-14 | 전기 검사 장치 |
| TW97130971A TWI381179B (zh) | 2007-08-14 | 2008-08-14 | 執行電子檢查的裝置 |
| PCT/KR2008/004738 WO2009022870A2 (en) | 2007-08-14 | 2008-08-14 | Apparatus for performing an electrical inspection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070081519A KR100799128B1 (ko) | 2007-08-14 | 2007-08-14 | 전기 검사 장치 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020070126286A Division KR20090017385A (ko) | 2007-12-06 | 2007-12-06 | 전기 검사 장치 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR100799128B1 true KR100799128B1 (ko) | 2008-01-29 |
Family
ID=39219658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020070081519A Expired - Fee Related KR100799128B1 (ko) | 2007-08-14 | 2007-08-14 | 전기 검사 장치 |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100799128B1 (ko) |
| TW (1) | TWI381179B (ko) |
| WO (1) | WO2009022870A2 (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI418794B (zh) * | 2009-10-23 | 2013-12-11 | Mpi Corporaion | Vertical probe card |
| CN102410237A (zh) * | 2010-09-21 | 2012-04-11 | 纬创资通股份有限公司 | 风扇转速控制方法及相关计算机系统 |
| IT201700017061A1 (it) * | 2017-02-15 | 2018-08-15 | Technoprobe Spa | Scheda di misura perfezionata per applicazioni ad alta frequenza |
| JP7224575B2 (ja) * | 2017-05-30 | 2023-02-20 | 株式会社オリティ | プローブカード |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040104706A (ko) * | 2002-05-08 | 2004-12-10 | 폼팩터, 인크. | 고성능 프로브 시스템 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4376370B2 (ja) * | 1999-09-29 | 2009-12-02 | 東京エレクトロン株式会社 | 高速測定対応プローブ装置 |
| WO2001063660A1 (en) * | 2000-02-25 | 2001-08-30 | Hitachi, Ltd. | Apparatus for detecting defect in device and method of detecting defect |
| JP3984773B2 (ja) * | 2000-03-17 | 2007-10-03 | 株式会社ルネサステクノロジ | 半導体装置 |
| US7245134B2 (en) * | 2005-01-31 | 2007-07-17 | Formfactor, Inc. | Probe card assembly including a programmable device to selectively route signals from channels of a test system controller to probes |
| TWI285741B (en) * | 2005-02-02 | 2007-08-21 | Mjc Probe Inc | Testing probe |
| US7279911B2 (en) * | 2005-05-03 | 2007-10-09 | Sv Probe Pte Ltd. | Probe card assembly with dielectric structure |
-
2007
- 2007-08-14 KR KR1020070081519A patent/KR100799128B1/ko not_active Expired - Fee Related
-
2008
- 2008-08-14 TW TW97130971A patent/TWI381179B/zh not_active IP Right Cessation
- 2008-08-14 WO PCT/KR2008/004738 patent/WO2009022870A2/en not_active Ceased
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040104706A (ko) * | 2002-05-08 | 2004-12-10 | 폼팩터, 인크. | 고성능 프로브 시스템 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI381179B (zh) | 2013-01-01 |
| WO2009022870A3 (en) | 2009-04-02 |
| WO2009022870A2 (en) | 2009-02-19 |
| TW200912345A (en) | 2009-03-16 |
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