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WO2009011335A1 - Composition de résine époxy pour une encapsulation de semi-conducteur et dispositif à semi-conducteur - Google Patents

Composition de résine époxy pour une encapsulation de semi-conducteur et dispositif à semi-conducteur Download PDF

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Publication number
WO2009011335A1
WO2009011335A1 PCT/JP2008/062700 JP2008062700W WO2009011335A1 WO 2009011335 A1 WO2009011335 A1 WO 2009011335A1 JP 2008062700 W JP2008062700 W JP 2008062700W WO 2009011335 A1 WO2009011335 A1 WO 2009011335A1
Authority
WO
WIPO (PCT)
Prior art keywords
formula
epoxy resin
resin composition
resin represented
following relation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/062700
Other languages
English (en)
Japanese (ja)
Inventor
Kenichi Kuboki
Katsuhiko Oshimi
Takao Sunaga
Masataka Nakanishi
Koichi Kawai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Priority to JP2009523644A priority Critical patent/JPWO2009011335A1/ja
Publication of WO2009011335A1 publication Critical patent/WO2009011335A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

L'invention porte sur une composition de résine époxy pour une encapsulation de semi-conducteur, qui contient une résine phénolique représentée par la formule (1) ci-dessous, une résine époxy représentée par la formule (2) ci-dessous et une charge inorganique (1) (Dans la formule (1), les différents R' représentent indépendamment un atome d'hydrogène ou un groupe alkyle ayant de 1 à 4 atomes de carbone ; et n représente une valeur moyenne satisfaisant la relation suivante : 1 < n ≤ 4). (2) (Dans la formule (2), n représente une valeur moyenne satisfaisant la relation suivante 1 < n ≤ 3). Le point de ramollissement (A) (en ˚C) de la résine phénolique représentée par la formule (1) et le point de ramollissement (B) (en ˚C) de la résine époxy représentée par la formule (2) satisfont la relation suivante (I): 80 ≤ A + B ≤ 150. Cette composition de résine époxy pour une encapsulation de semi-conducteur permet d'obtenir un produit durci qui présente une excellente capacité ignifuge et une excellente résistance à l'humidité.
PCT/JP2008/062700 2007-07-18 2008-07-14 Composition de résine époxy pour une encapsulation de semi-conducteur et dispositif à semi-conducteur Ceased WO2009011335A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009523644A JPWO2009011335A1 (ja) 2007-07-18 2008-07-14 半導体封止用エポキシ樹脂組成物および半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-187557 2007-07-18
JP2007187557 2007-07-18

Publications (1)

Publication Number Publication Date
WO2009011335A1 true WO2009011335A1 (fr) 2009-01-22

Family

ID=40259668

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062700 Ceased WO2009011335A1 (fr) 2007-07-18 2008-07-14 Composition de résine époxy pour une encapsulation de semi-conducteur et dispositif à semi-conducteur

Country Status (3)

Country Link
JP (1) JPWO2009011335A1 (fr)
TW (1) TW200911871A (fr)
WO (1) WO2009011335A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010185027A (ja) * 2009-02-13 2010-08-26 Nippon Kayaku Co Ltd 半導体封止用エポキシ樹脂組成物および半導体装置
WO2016194034A1 (fr) * 2015-05-29 2016-12-08 住友ベークライト株式会社 Composition de résine d'étanchéité, dispositif à semi-conducteurs, et structure
JP2021080363A (ja) * 2019-11-19 2021-05-27 Dic株式会社 ポリアリーレンスルフィド樹脂組成物、成形品、複合成形体及びそれら製造方法
CN117887016A (zh) * 2024-01-15 2024-04-16 同宇新材料(广东)股份有限公司 一种多联苯酚醛树脂及其制备方法和应用

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5691219B2 (ja) 2010-03-30 2015-04-01 住友ベークライト株式会社 半導体封止用樹脂組成物の製造方法および粉砕装置

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003128877A (ja) * 2001-10-22 2003-05-08 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2003292583A (ja) * 2002-03-29 2003-10-15 Hitachi Chem Co Ltd エポキシ樹脂成形材料及び電子部品装置
JP2004175842A (ja) * 2002-11-25 2004-06-24 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2004269754A (ja) * 2003-03-10 2004-09-30 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物及び光半導体装置
JP2004352894A (ja) * 2003-05-29 2004-12-16 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2005239901A (ja) * 2004-02-26 2005-09-08 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物及び光半導体装置
JP2005256011A (ja) * 2002-10-18 2005-09-22 Hitachi Chem Co Ltd 硬化性樹脂組成物及び電子部品装置
JP2005336418A (ja) * 2004-05-31 2005-12-08 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2006083212A (ja) * 2004-09-14 2006-03-30 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2006176549A (ja) * 2004-12-20 2006-07-06 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2006274186A (ja) * 2005-03-30 2006-10-12 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003128877A (ja) * 2001-10-22 2003-05-08 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2003292583A (ja) * 2002-03-29 2003-10-15 Hitachi Chem Co Ltd エポキシ樹脂成形材料及び電子部品装置
JP2005256011A (ja) * 2002-10-18 2005-09-22 Hitachi Chem Co Ltd 硬化性樹脂組成物及び電子部品装置
JP2004175842A (ja) * 2002-11-25 2004-06-24 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2004269754A (ja) * 2003-03-10 2004-09-30 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物及び光半導体装置
JP2004352894A (ja) * 2003-05-29 2004-12-16 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2005239901A (ja) * 2004-02-26 2005-09-08 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物及び光半導体装置
JP2005336418A (ja) * 2004-05-31 2005-12-08 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2006083212A (ja) * 2004-09-14 2006-03-30 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2006176549A (ja) * 2004-12-20 2006-07-06 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2006274186A (ja) * 2005-03-30 2006-10-12 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010185027A (ja) * 2009-02-13 2010-08-26 Nippon Kayaku Co Ltd 半導体封止用エポキシ樹脂組成物および半導体装置
WO2016194034A1 (fr) * 2015-05-29 2016-12-08 住友ベークライト株式会社 Composition de résine d'étanchéité, dispositif à semi-conducteurs, et structure
CN107406580A (zh) * 2015-05-29 2017-11-28 住友电木株式会社 密封用树脂组合物、半导体装置和结构体
KR20180013847A (ko) * 2015-05-29 2018-02-07 스미토모 베이클리트 컴퍼니 리미티드 봉지용 수지 조성물, 반도체 장치, 및 구조체
KR102367125B1 (ko) * 2015-05-29 2022-02-25 스미토모 베이클리트 컴퍼니 리미티드 봉지용 수지 조성물, 반도체 장치, 및 구조체
JP2021080363A (ja) * 2019-11-19 2021-05-27 Dic株式会社 ポリアリーレンスルフィド樹脂組成物、成形品、複合成形体及びそれら製造方法
JP7497568B2 (ja) 2019-11-19 2024-06-11 Dic株式会社 ポリアリーレンスルフィド樹脂組成物、成形品、複合成形体及びそれら製造方法
CN117887016A (zh) * 2024-01-15 2024-04-16 同宇新材料(广东)股份有限公司 一种多联苯酚醛树脂及其制备方法和应用

Also Published As

Publication number Publication date
JPWO2009011335A1 (ja) 2010-09-24
TW200911871A (en) 2009-03-16

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