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WO2009011335A1 - Epoxy resin composition for semiconductor encapsulation and semiconductor device - Google Patents

Epoxy resin composition for semiconductor encapsulation and semiconductor device Download PDF

Info

Publication number
WO2009011335A1
WO2009011335A1 PCT/JP2008/062700 JP2008062700W WO2009011335A1 WO 2009011335 A1 WO2009011335 A1 WO 2009011335A1 JP 2008062700 W JP2008062700 W JP 2008062700W WO 2009011335 A1 WO2009011335 A1 WO 2009011335A1
Authority
WO
WIPO (PCT)
Prior art keywords
formula
epoxy resin
resin composition
resin represented
following relation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/062700
Other languages
French (fr)
Japanese (ja)
Inventor
Kenichi Kuboki
Katsuhiko Oshimi
Takao Sunaga
Masataka Nakanishi
Koichi Kawai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Priority to JP2009523644A priority Critical patent/JPWO2009011335A1/en
Publication of WO2009011335A1 publication Critical patent/WO2009011335A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

Disclosed is an epoxy resin composition for semiconductor encapsulation, which contains a phenol resin represented by the formula (1) below, an epoxy resin represented by the formula (2) below and an inorganic filler. (1) (In the formula (1), a plurality of R's independently represent a hydrogen atom or an alkyl group having 1-4 carbon atoms; and n represents an average value satisfying the following relation: 1 < n ≤ 4.) (2) (In the formula (2), n represents an average value satisfying the following relation: 1 < n ≤ 3.) The softening point (A) (˚C) of the phenol resin represented by the formula (1) and the softening point (B) (˚C) of the epoxy resin represented by the formula (2) satisfy the following relation (I): 80 ≤ A + B ≤ 150. This epoxy resin composition for semiconductor encapsulation enables to obtain a cured product which is excellent in flame retardancy and moisture resistance.
PCT/JP2008/062700 2007-07-18 2008-07-14 Epoxy resin composition for semiconductor encapsulation and semiconductor device Ceased WO2009011335A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009523644A JPWO2009011335A1 (en) 2007-07-18 2008-07-14 Epoxy resin composition for semiconductor encapsulation and semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-187557 2007-07-18
JP2007187557 2007-07-18

Publications (1)

Publication Number Publication Date
WO2009011335A1 true WO2009011335A1 (en) 2009-01-22

Family

ID=40259668

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062700 Ceased WO2009011335A1 (en) 2007-07-18 2008-07-14 Epoxy resin composition for semiconductor encapsulation and semiconductor device

Country Status (3)

Country Link
JP (1) JPWO2009011335A1 (en)
TW (1) TW200911871A (en)
WO (1) WO2009011335A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010185027A (en) * 2009-02-13 2010-08-26 Nippon Kayaku Co Ltd Epoxy resin composition for semiconductor sealing and semiconductor device
WO2016194034A1 (en) * 2015-05-29 2016-12-08 住友ベークライト株式会社 Sealing resin composition, semiconductor device, and structure
JP2021080363A (en) * 2019-11-19 2021-05-27 Dic株式会社 Polyarylene sulfide resin composition, molding, composite molding and method for producing them
CN117887016A (en) * 2024-01-15 2024-04-16 同宇新材料(广东)股份有限公司 Polybiphenyl phenolic resin and preparation method and application thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5691219B2 (en) 2010-03-30 2015-04-01 住友ベークライト株式会社 Manufacturing method and pulverizing apparatus for resin composition for semiconductor encapsulation

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003128877A (en) * 2001-10-22 2003-05-08 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP2003292583A (en) * 2002-03-29 2003-10-15 Hitachi Chem Co Ltd Epoxy resin molding material and electronic part device
JP2004175842A (en) * 2002-11-25 2004-06-24 Hitachi Chem Co Ltd Epoxy resin molding compound for sealing and electronic component device
JP2004269754A (en) * 2003-03-10 2004-09-30 Sumitomo Bakelite Co Ltd Epoxy resin composition for optical semiconductor sealing, and optical semiconductor device
JP2004352894A (en) * 2003-05-29 2004-12-16 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP2005239901A (en) * 2004-02-26 2005-09-08 Sumitomo Bakelite Co Ltd Epoxy resin composition for encapsulating optical semiconductor and optical semiconductor device
JP2005256011A (en) * 2002-10-18 2005-09-22 Hitachi Chem Co Ltd Curable resin composition and electronic component device
JP2005336418A (en) * 2004-05-31 2005-12-08 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP2006083212A (en) * 2004-09-14 2006-03-30 Hitachi Chem Co Ltd Epoxy resin molding material for sealing and electronic component device
JP2006176549A (en) * 2004-12-20 2006-07-06 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP2006274186A (en) * 2005-03-30 2006-10-12 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003128877A (en) * 2001-10-22 2003-05-08 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP2003292583A (en) * 2002-03-29 2003-10-15 Hitachi Chem Co Ltd Epoxy resin molding material and electronic part device
JP2005256011A (en) * 2002-10-18 2005-09-22 Hitachi Chem Co Ltd Curable resin composition and electronic component device
JP2004175842A (en) * 2002-11-25 2004-06-24 Hitachi Chem Co Ltd Epoxy resin molding compound for sealing and electronic component device
JP2004269754A (en) * 2003-03-10 2004-09-30 Sumitomo Bakelite Co Ltd Epoxy resin composition for optical semiconductor sealing, and optical semiconductor device
JP2004352894A (en) * 2003-05-29 2004-12-16 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP2005239901A (en) * 2004-02-26 2005-09-08 Sumitomo Bakelite Co Ltd Epoxy resin composition for encapsulating optical semiconductor and optical semiconductor device
JP2005336418A (en) * 2004-05-31 2005-12-08 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP2006083212A (en) * 2004-09-14 2006-03-30 Hitachi Chem Co Ltd Epoxy resin molding material for sealing and electronic component device
JP2006176549A (en) * 2004-12-20 2006-07-06 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP2006274186A (en) * 2005-03-30 2006-10-12 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010185027A (en) * 2009-02-13 2010-08-26 Nippon Kayaku Co Ltd Epoxy resin composition for semiconductor sealing and semiconductor device
WO2016194034A1 (en) * 2015-05-29 2016-12-08 住友ベークライト株式会社 Sealing resin composition, semiconductor device, and structure
CN107406580A (en) * 2015-05-29 2017-11-28 住友电木株式会社 Resin composition for encapsulating, semiconductor device and structure
KR20180013847A (en) * 2015-05-29 2018-02-07 스미토모 베이클리트 컴퍼니 리미티드 Resin composition for sealing, semiconductor device, and structure
KR102367125B1 (en) * 2015-05-29 2022-02-25 스미토모 베이클리트 컴퍼니 리미티드 Resin composition for encapsulation, semiconductor device and structure
JP2021080363A (en) * 2019-11-19 2021-05-27 Dic株式会社 Polyarylene sulfide resin composition, molding, composite molding and method for producing them
JP7497568B2 (en) 2019-11-19 2024-06-11 Dic株式会社 Polyarylene sulfide resin composition, molded article, composite molded article, and methods for producing the same
CN117887016A (en) * 2024-01-15 2024-04-16 同宇新材料(广东)股份有限公司 Polybiphenyl phenolic resin and preparation method and application thereof

Also Published As

Publication number Publication date
JPWO2009011335A1 (en) 2010-09-24
TW200911871A (en) 2009-03-16

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