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WO2009004759A1 - 熱電素子 - Google Patents

熱電素子 Download PDF

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Publication number
WO2009004759A1
WO2009004759A1 PCT/JP2008/001451 JP2008001451W WO2009004759A1 WO 2009004759 A1 WO2009004759 A1 WO 2009004759A1 JP 2008001451 W JP2008001451 W JP 2008001451W WO 2009004759 A1 WO2009004759 A1 WO 2009004759A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrode
insulating substrate
thermoelectric device
thermoelectric
apart
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/001451
Other languages
English (en)
French (fr)
Inventor
Junichi Teraki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Original Assignee
Daikin Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Industries Ltd filed Critical Daikin Industries Ltd
Publication of WO2009004759A1 publication Critical patent/WO2009004759A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

本発明による熱電素子は、絶縁性基板(1)と、絶縁性基板(1)の一方の面に形成された第１の電極(2b)と、絶縁性基板(1)の一方の面に第１の電極(2b)と離隔して形成された第２の電極(3c)と、絶縁性基板(1)の他方の面に形成され、絶縁性基板(1)に設けられたスルーホール(4)によって第２の電極(3c)と接続された第３の電極(9c)と、絶縁性基板(1)の一方の面に第１の電極(2b)と第２の電極(3c)とに接するように薄膜形成された第１導電型の第１の熱電材料(5b)とを備える。
PCT/JP2008/001451 2007-07-02 2008-06-06 熱電素子 Ceased WO2009004759A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-174253 2007-07-02
JP2007174253A JP2009016442A (ja) 2007-07-02 2007-07-02 熱電素子

Publications (1)

Publication Number Publication Date
WO2009004759A1 true WO2009004759A1 (ja) 2009-01-08

Family

ID=40225826

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001451 Ceased WO2009004759A1 (ja) 2007-07-02 2008-06-06 熱電素子

Country Status (2)

Country Link
JP (1) JP2009016442A (ja)
WO (1) WO2009004759A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101840990A (zh) * 2010-04-30 2010-09-22 华南师范大学 一种N型纯Si掺杂热电材料中的孔洞制备方法
US11352582B2 (en) 2015-11-06 2022-06-07 The Lubrizol Corporation Lubricant with high pyrophosphate level

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101679833B1 (ko) * 2014-09-11 2016-11-28 고려대학교 산학협력단 열전발전모듈 및 그 제조방법
WO2016136363A1 (ja) * 2015-02-24 2016-09-01 富士フイルム株式会社 熱電変換素子および熱電変換モジュール
JP6431992B2 (ja) 2015-11-17 2018-11-28 富士フイルム株式会社 熱電変換素子および熱電変換モジュール
WO2018061460A1 (ja) * 2016-09-28 2018-04-05 Tdk株式会社 熱電変換装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111345A (ja) * 1993-10-14 1995-04-25 Matsushita Electric Ind Co Ltd 熱電発電デバイス
JP2008130718A (ja) * 2006-11-20 2008-06-05 Tokai Rika Co Ltd 熱電変換デバイス及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111345A (ja) * 1993-10-14 1995-04-25 Matsushita Electric Ind Co Ltd 熱電発電デバイス
JP2008130718A (ja) * 2006-11-20 2008-06-05 Tokai Rika Co Ltd 熱電変換デバイス及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101840990A (zh) * 2010-04-30 2010-09-22 华南师范大学 一种N型纯Si掺杂热电材料中的孔洞制备方法
CN101840990B (zh) * 2010-04-30 2012-07-11 华南师范大学 一种N型纯Si掺杂热电材料中的孔洞制备方法
US11352582B2 (en) 2015-11-06 2022-06-07 The Lubrizol Corporation Lubricant with high pyrophosphate level

Also Published As

Publication number Publication date
JP2009016442A (ja) 2009-01-22

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