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WO2009091219A3 - 인쇄 회로 기판의 장착 방법 - Google Patents

인쇄 회로 기판의 장착 방법 Download PDF

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Publication number
WO2009091219A3
WO2009091219A3 PCT/KR2009/000257 KR2009000257W WO2009091219A3 WO 2009091219 A3 WO2009091219 A3 WO 2009091219A3 KR 2009000257 W KR2009000257 W KR 2009000257W WO 2009091219 A3 WO2009091219 A3 WO 2009091219A3
Authority
WO
WIPO (PCT)
Prior art keywords
board
printed circuit
circuit board
installation method
board installation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2009/000257
Other languages
English (en)
French (fr)
Other versions
WO2009091219A2 (ko
Inventor
김덕용
김윤용
고희성
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KMW Inc
Original Assignee
KMW Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KMW Inc filed Critical KMW Inc
Priority to CN200980110112XA priority Critical patent/CN101978797B/zh
Priority to JP2010543058A priority patent/JP2011512025A/ja
Publication of WO2009091219A2 publication Critical patent/WO2009091219A2/ko
Publication of WO2009091219A3 publication Critical patent/WO2009091219A3/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

본 발명은 인쇄 회로 기판의 장착 방법에 있어서, 기판 하면의 절연이 요구되는 부위를 제외한 미리 설정된 부위에 솔더 크림을 제공하는 과정과, 기판을 해당 기판이 장착될 하우징의 장착 부위에 실장하는 과정과, 기판 하면의 솔더 크림을 용융 및 경화하여 기판을 하우징에 고정 결합하는 과정을 수행한다.
PCT/KR2009/000257 2008-01-18 2009-01-16 인쇄 회로 기판의 장착 방법 Ceased WO2009091219A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200980110112XA CN101978797B (zh) 2008-01-18 2009-01-16 印刷电路板安装方法
JP2010543058A JP2011512025A (ja) 2008-01-18 2009-01-16 プリント回路基板の装着方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080005686A KR20090079595A (ko) 2008-01-18 2008-01-18 인쇄 회로 기판의 장착 방법
KR10-2008-0005686 2008-01-18

Publications (2)

Publication Number Publication Date
WO2009091219A2 WO2009091219A2 (ko) 2009-07-23
WO2009091219A3 true WO2009091219A3 (ko) 2009-10-22

Family

ID=40875664

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/000257 Ceased WO2009091219A2 (ko) 2008-01-18 2009-01-16 인쇄 회로 기판의 장착 방법

Country Status (5)

Country Link
US (1) US9254531B2 (ko)
JP (2) JP2011512025A (ko)
KR (1) KR20090079595A (ko)
CN (1) CN101978797B (ko)
WO (1) WO2009091219A2 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090079595A (ko) 2008-01-18 2009-07-22 주식회사 케이엠더블유 인쇄 회로 기판의 장착 방법
CN102355797B (zh) * 2011-10-18 2013-07-31 武汉凡谷电子技术股份有限公司 一种金属基板与印制板烧结工艺
US8870051B2 (en) * 2012-05-03 2014-10-28 International Business Machines Corporation Flip chip assembly apparatus employing a warpage-suppressor assembly
CN103464852B (zh) * 2013-07-10 2015-10-07 南京信息职业技术学院 一种电子器件三维回流焊方法
US9706662B2 (en) 2015-06-30 2017-07-11 Raytheon Company Adaptive interposer and electronic apparatus
US9648729B1 (en) 2015-11-20 2017-05-09 Raytheon Company Stress reduction interposer for ceramic no-lead surface mount electronic device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06125173A (ja) * 1992-10-09 1994-05-06 Taiyo Yuden Co Ltd 混成集積回路装置の製造方法
KR19990031225U (ko) * 1997-12-30 1999-07-26 서평원 인쇄회로기판의 방열접착면 구조
JP2004087594A (ja) * 2002-08-23 2004-03-18 Alps Electric Co Ltd 電子回路ユニットの放熱構造
KR200394682Y1 (ko) * 2005-06-07 2005-09-05 김재용 인쇄회로기판
JP2006041240A (ja) * 2004-07-28 2006-02-09 Yutaka Denki Seisakusho:Kk 放熱性に優れたプリント配線板およびその製造方法、使用方法

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Publication number Priority date Publication date Assignee Title
JPS5683051A (en) * 1979-12-11 1981-07-07 Matsushita Electric Ind Co Ltd Semiconductor device
JPS6125222A (ja) * 1984-07-13 1986-02-04 Ricoh Co Ltd 温度制御装置
JPH0334497A (ja) * 1989-06-30 1991-02-14 Taiyo Yuden Co Ltd ハイブリッドｉｃの半田付け方法
JP3021552B2 (ja) 1990-06-12 2000-03-15 富士電機株式会社 パルス移相装置
JPH0446591U (ko) * 1990-08-27 1992-04-21
US5155904A (en) * 1991-04-03 1992-10-20 Compaq Computer Corporation Reflow and wave soldering techniques for bottom side components
JP3063924B2 (ja) 1991-06-28 2000-07-12 株式会社ユアサコーポレーション 薄形電池
JPH0513061U (ja) * 1991-07-30 1993-02-19 シヤープ株式会社 電力半導体装置
EP0608418B1 (en) * 1992-05-20 1998-11-04 Seiko Epson Corporation Cartridge for electronic apparatus
JPH0951183A (ja) 1995-05-30 1997-02-18 Sumitomo Electric Ind Ltd 電子部品
TW478716U (en) 1995-05-30 2002-03-01 Sumitomo Electric Industries Electronic component
JPH10189803A (ja) * 1996-12-27 1998-07-21 Nippon Inter Electronics Corp 放熱板への絶縁基板取付構造
US6276593B1 (en) * 1999-07-12 2001-08-21 Agere Systems Guardian Corp. Apparatus and method for solder attachment of high powered transistors to base heatsink
JP2001237585A (ja) * 2000-02-22 2001-08-31 Murata Mfg Co Ltd 電子部品及びその製造方法
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US7479039B2 (en) * 2004-08-06 2009-01-20 Super Talent Electronics, Inc. Manufacturing process for a super-digital (SD) flash card with slanted asymmetric circuit board
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KR20090079595A (ko) 2008-01-18 2009-07-22 주식회사 케이엠더블유 인쇄 회로 기판의 장착 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06125173A (ja) * 1992-10-09 1994-05-06 Taiyo Yuden Co Ltd 混成集積回路装置の製造方法
KR19990031225U (ko) * 1997-12-30 1999-07-26 서평원 인쇄회로기판의 방열접착면 구조
JP2004087594A (ja) * 2002-08-23 2004-03-18 Alps Electric Co Ltd 電子回路ユニットの放熱構造
JP2006041240A (ja) * 2004-07-28 2006-02-09 Yutaka Denki Seisakusho:Kk 放熱性に優れたプリント配線板およびその製造方法、使用方法
KR200394682Y1 (ko) * 2005-06-07 2005-09-05 김재용 인쇄회로기판

Also Published As

Publication number Publication date
JP6338895B2 (ja) 2018-06-06
JP2011512025A (ja) 2011-04-14
US9254531B2 (en) 2016-02-09
WO2009091219A2 (ko) 2009-07-23
KR20090079595A (ko) 2009-07-22
US20090184155A1 (en) 2009-07-23
CN101978797A (zh) 2011-02-16
JP2014132680A (ja) 2014-07-17
CN101978797B (zh) 2013-06-19

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