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WO2008120564A1 - 電子部品の実装構造、及び電子部品の実装方法 - Google Patents

電子部品の実装構造、及び電子部品の実装方法 Download PDF

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Publication number
WO2008120564A1
WO2008120564A1 PCT/JP2008/054820 JP2008054820W WO2008120564A1 WO 2008120564 A1 WO2008120564 A1 WO 2008120564A1 JP 2008054820 W JP2008054820 W JP 2008054820W WO 2008120564 A1 WO2008120564 A1 WO 2008120564A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
support
mounting
connection
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/054820
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English (en)
French (fr)
Inventor
Tomohiro Nishiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2009507452A priority Critical patent/JP5569676B2/ja
Publication of WO2008120564A1 publication Critical patent/WO2008120564A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

　導電性粒子を含む接着剤を用いて電子部品を支持体に実装する際に、応力の影響を抑制する事のできる技術を提供する。支持体上に配置された枠状の絶縁枠層と、前記絶縁枠の枠内に配置された接続用樹脂層と、前記接続用樹脂層を介して前記支持体上に配置された電子部品と、を具備する。前記接続用樹脂層は、前記電子部品の少なくとも一部と前記支持体の少なくとも一部とを電気的に接続する導電部を有している。
PCT/JP2008/054820 2007-03-28 2008-03-14 電子部品の実装構造、及び電子部品の実装方法 Ceased WO2008120564A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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JP2007085960 2007-03-28
JP2007-085960 2007-03-28

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010134230A1 (ja) * 2009-05-20 2010-11-25 パナソニック株式会社 半導体装置及びその製造方法
JP2011165981A (ja) * 2010-02-10 2011-08-25 Sumitomo Bakelite Co Ltd 半田層の形成方法、端子間の接続方法、半導体装置および電子機器
JP2011166094A (ja) * 2010-02-15 2011-08-25 Sumitomo Bakelite Co Ltd 導電接続シート、端子間の接続方法、接続端子の形成方法、半導体装置および電子機器
JP2011166093A (ja) * 2010-02-15 2011-08-25 Sumitomo Bakelite Co Ltd 導電接続シート、端子間の接続方法、接続端子の形成方法、半導体装置および電子機器
JP2013222833A (ja) * 2012-04-17 2013-10-28 Toshiba Corp 電子部品および電子機器

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3355666B1 (en) * 2017-01-26 2023-07-26 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Semifinished product and method of manufacturing a component carrier
US20240407573A1 (en) 2021-07-06 2024-12-12 Areco Finances Et Technologie - Arfitec Open vertical refrigerated display case comprising improved nebulizing means

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JPH0270436U (ja) * 1988-11-18 1990-05-29
JPH10199936A (ja) * 1997-01-14 1998-07-31 Olympus Optical Co Ltd フレキシブル配線板へのフリップチップ実装構造
JP2000151059A (ja) * 1998-11-09 2000-05-30 Toshiba Corp 配線基板ユニットおよび配線基板ユニット製造方法
JP2000260935A (ja) * 1999-03-09 2000-09-22 Rohm Co Ltd 半導体集積装置
JP2000340614A (ja) * 1999-05-28 2000-12-08 Sony Chem Corp 半導体素子の実装方法
JP2004006935A (ja) * 2003-07-22 2004-01-08 Oki Electric Ind Co Ltd 封止部材の製造方法、およびその封止部材を用いた半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0270436U (ja) * 1988-11-18 1990-05-29
JPH10199936A (ja) * 1997-01-14 1998-07-31 Olympus Optical Co Ltd フレキシブル配線板へのフリップチップ実装構造
JP2000151059A (ja) * 1998-11-09 2000-05-30 Toshiba Corp 配線基板ユニットおよび配線基板ユニット製造方法
JP2000260935A (ja) * 1999-03-09 2000-09-22 Rohm Co Ltd 半導体集積装置
JP2000340614A (ja) * 1999-05-28 2000-12-08 Sony Chem Corp 半導体素子の実装方法
JP2004006935A (ja) * 2003-07-22 2004-01-08 Oki Electric Ind Co Ltd 封止部材の製造方法、およびその封止部材を用いた半導体装置の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010134230A1 (ja) * 2009-05-20 2010-11-25 パナソニック株式会社 半導体装置及びその製造方法
JP2011165981A (ja) * 2010-02-10 2011-08-25 Sumitomo Bakelite Co Ltd 半田層の形成方法、端子間の接続方法、半導体装置および電子機器
JP2011166094A (ja) * 2010-02-15 2011-08-25 Sumitomo Bakelite Co Ltd 導電接続シート、端子間の接続方法、接続端子の形成方法、半導体装置および電子機器
JP2011166093A (ja) * 2010-02-15 2011-08-25 Sumitomo Bakelite Co Ltd 導電接続シート、端子間の接続方法、接続端子の形成方法、半導体装置および電子機器
JP2013222833A (ja) * 2012-04-17 2013-10-28 Toshiba Corp 電子部品および電子機器

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