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WO2008120564A1 - Structure de montage d'un composant électronique et procédé de montage d'un composant électronique - Google Patents

Structure de montage d'un composant électronique et procédé de montage d'un composant électronique Download PDF

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Publication number
WO2008120564A1
WO2008120564A1 PCT/JP2008/054820 JP2008054820W WO2008120564A1 WO 2008120564 A1 WO2008120564 A1 WO 2008120564A1 JP 2008054820 W JP2008054820 W JP 2008054820W WO 2008120564 A1 WO2008120564 A1 WO 2008120564A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
support
mounting
connection
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/054820
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English (en)
Japanese (ja)
Inventor
Tomohiro Nishiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2009507452A priority Critical patent/JP5569676B2/ja
Publication of WO2008120564A1 publication Critical patent/WO2008120564A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention concerne une technique pour supprimer l'influence d'une contrainte lorsqu'un composant électronique est monté sur un support à l'aide d'un adhésif contenant des particules conductrices. L'invention concerne spécifiquement une structure de montage d'un composant électronique, qui comprend une couche de cadre isolante de type cadre disposée sur un support, une couche de résine pour une connexion qui est disposée dans le cadre de la couche de cadre isolante, et un composant électronique disposé sur le support à travers la couche de résine pour une connexion. La couche de résine pour une connexion a une partie conductrice pour connecter électriquement au moins une partie du composant électronique avec au moins une partie du support.
PCT/JP2008/054820 2007-03-28 2008-03-14 Structure de montage d'un composant électronique et procédé de montage d'un composant électronique Ceased WO2008120564A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009507452A JP5569676B2 (ja) 2007-03-28 2008-03-14 電子部品の実装方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007085960 2007-03-28
JP2007-085960 2007-03-28

Publications (1)

Publication Number Publication Date
WO2008120564A1 true WO2008120564A1 (fr) 2008-10-09

Family

ID=39808146

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054820 Ceased WO2008120564A1 (fr) 2007-03-28 2008-03-14 Structure de montage d'un composant électronique et procédé de montage d'un composant électronique

Country Status (2)

Country Link
JP (1) JP5569676B2 (fr)
WO (1) WO2008120564A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010134230A1 (fr) * 2009-05-20 2010-11-25 パナソニック株式会社 Dispositif à semi-conducteur et son procédé de fabrication
JP2011165981A (ja) * 2010-02-10 2011-08-25 Sumitomo Bakelite Co Ltd 半田層の形成方法、端子間の接続方法、半導体装置および電子機器
JP2011166093A (ja) * 2010-02-15 2011-08-25 Sumitomo Bakelite Co Ltd 導電接続シート、端子間の接続方法、接続端子の形成方法、半導体装置および電子機器
JP2011166094A (ja) * 2010-02-15 2011-08-25 Sumitomo Bakelite Co Ltd 導電接続シート、端子間の接続方法、接続端子の形成方法、半導体装置および電子機器
JP2013222833A (ja) * 2012-04-17 2013-10-28 Toshiba Corp 電子部品および電子機器

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3355666B1 (fr) * 2017-01-26 2023-07-26 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Produit semi-fini et procédé de fabrication d'un support de composant
US20240407573A1 (en) 2021-07-06 2024-12-12 Areco Finances Et Technologie - Arfitec Open vertical refrigerated display case comprising improved nebulizing means

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0270436U (fr) * 1988-11-18 1990-05-29
JPH10199936A (ja) * 1997-01-14 1998-07-31 Olympus Optical Co Ltd フレキシブル配線板へのフリップチップ実装構造
JP2000151059A (ja) * 1998-11-09 2000-05-30 Toshiba Corp 配線基板ユニットおよび配線基板ユニット製造方法
JP2000260935A (ja) * 1999-03-09 2000-09-22 Rohm Co Ltd 半導体集積装置
JP2000340614A (ja) * 1999-05-28 2000-12-08 Sony Chem Corp 半導体素子の実装方法
JP2004006935A (ja) * 2003-07-22 2004-01-08 Oki Electric Ind Co Ltd 封止部材の製造方法、およびその封止部材を用いた半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0270436U (fr) * 1988-11-18 1990-05-29
JPH10199936A (ja) * 1997-01-14 1998-07-31 Olympus Optical Co Ltd フレキシブル配線板へのフリップチップ実装構造
JP2000151059A (ja) * 1998-11-09 2000-05-30 Toshiba Corp 配線基板ユニットおよび配線基板ユニット製造方法
JP2000260935A (ja) * 1999-03-09 2000-09-22 Rohm Co Ltd 半導体集積装置
JP2000340614A (ja) * 1999-05-28 2000-12-08 Sony Chem Corp 半導体素子の実装方法
JP2004006935A (ja) * 2003-07-22 2004-01-08 Oki Electric Ind Co Ltd 封止部材の製造方法、およびその封止部材を用いた半導体装置の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010134230A1 (fr) * 2009-05-20 2010-11-25 パナソニック株式会社 Dispositif à semi-conducteur et son procédé de fabrication
JP2011165981A (ja) * 2010-02-10 2011-08-25 Sumitomo Bakelite Co Ltd 半田層の形成方法、端子間の接続方法、半導体装置および電子機器
JP2011166093A (ja) * 2010-02-15 2011-08-25 Sumitomo Bakelite Co Ltd 導電接続シート、端子間の接続方法、接続端子の形成方法、半導体装置および電子機器
JP2011166094A (ja) * 2010-02-15 2011-08-25 Sumitomo Bakelite Co Ltd 導電接続シート、端子間の接続方法、接続端子の形成方法、半導体装置および電子機器
JP2013222833A (ja) * 2012-04-17 2013-10-28 Toshiba Corp 電子部品および電子機器

Also Published As

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JPWO2008120564A1 (ja) 2010-07-15
JP5569676B2 (ja) 2014-08-13

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