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WO2009037833A1 - Carte de câblage imprimée solide, procédé pour fabriquer une carte de câblage imprimée solide, et module de composant électronique - Google Patents

Carte de câblage imprimée solide, procédé pour fabriquer une carte de câblage imprimée solide, et module de composant électronique Download PDF

Info

Publication number
WO2009037833A1
WO2009037833A1 PCT/JP2008/002564 JP2008002564W WO2009037833A1 WO 2009037833 A1 WO2009037833 A1 WO 2009037833A1 JP 2008002564 W JP2008002564 W JP 2008002564W WO 2009037833 A1 WO2009037833 A1 WO 2009037833A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
printed wiring
solid printed
electronic component
component module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/002564
Other languages
English (en)
Japanese (ja)
Inventor
Takayuki Kita
Masaaki Katsumata
Keiichi Nakao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2009533045A priority Critical patent/JPWO2009037833A1/ja
Priority to CN200880107929A priority patent/CN101803476A/zh
Publication of WO2009037833A1 publication Critical patent/WO2009037833A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne une carte de câblage imprimée solide (13) comprenant une première carte de câblage imprimée (22) ayant une section d'ouverture (18), et une seconde carte de câblage imprimée (26), qui est fixée à la première carte de câblage imprimée (22), sous la section d'ouverture (18), par une couche de liaison (17) ayant une section de pâte conductrice (19). Un composant électronique de grande hauteur (11b) est agencé sur une seconde section de câblage (14b) sur la seconde carte de câblage imprimée (26) dans la section d'ouverture (18). Ainsi, un composant de montage est réduit en hauteur en rendant la hauteur équivalente à celle d'un composant électronique de faible hauteur (11a) agencé sur une première section de câblage (14a) de la première carte de câblage imprimée (22).
PCT/JP2008/002564 2007-09-21 2008-09-18 Carte de câblage imprimée solide, procédé pour fabriquer une carte de câblage imprimée solide, et module de composant électronique Ceased WO2009037833A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009533045A JPWO2009037833A1 (ja) 2007-09-21 2008-09-18 立体プリント配線板およびその製造方法ならびに電子部品モジュール
CN200880107929A CN101803476A (zh) 2007-09-21 2008-09-18 立体印刷布线板及其制造方法以及电子部件模块

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007244839 2007-09-21
JP2007244838 2007-09-21
JP2007-244839 2007-09-21
JP2007-244838 2007-09-21

Publications (1)

Publication Number Publication Date
WO2009037833A1 true WO2009037833A1 (fr) 2009-03-26

Family

ID=40467660

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002564 Ceased WO2009037833A1 (fr) 2007-09-21 2008-09-18 Carte de câblage imprimée solide, procédé pour fabriquer une carte de câblage imprimée solide, et module de composant électronique

Country Status (4)

Country Link
JP (1) JPWO2009037833A1 (fr)
CN (1) CN101803476A (fr)
TW (1) TW200922417A (fr)
WO (1) WO2009037833A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011148915A1 (fr) * 2010-05-26 2011-12-01 株式会社村田製作所 Substrat module et son procédé de fabrication
EP2473012A1 (fr) * 2010-12-30 2012-07-04 Research In Motion Limited Combinaison de cartes de circuits imprimés
JP2016039213A (ja) * 2014-08-06 2016-03-22 ローム株式会社 基板内蔵パッケージ、半導体装置およびモジュール
WO2018110383A1 (fr) * 2016-12-15 2018-06-21 株式会社村田製作所 Module électronique et procédé de production de module électronique
JP2021082771A (ja) * 2019-11-22 2021-05-27 株式会社ジェイテクト 電気機器

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105977364A (zh) * 2016-07-20 2016-09-28 广州硅能照明有限公司 多层led光引擎结构及其加工方法
CN108513432B (zh) * 2017-02-24 2021-06-29 泰连公司 电子元件组件和其组装方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63254788A (ja) * 1987-04-10 1988-10-21 松下電器産業株式会社 プリント配線板
JPH06334298A (ja) * 1993-05-27 1994-12-02 Fujitsu Ltd 表面実装部品の搭載構造
JP2005504443A (ja) * 2001-08-31 2005-02-10 エプコス　アクチエンゲゼルシャフト 構成要素装置
JP2005236256A (ja) * 2003-09-12 2005-09-02 Matsushita Electric Ind Co Ltd コネクタシート及び配線基板、並びにコネクタシート及び配線基板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090067147A1 (en) * 2005-05-25 2009-03-12 Matsushita Electric Industrial Co., Ltd. Circuit board connection structure and circuit board connection method
JP2006332246A (ja) * 2005-05-25 2006-12-07 Matsushita Electric Ind Co Ltd 回路基板、回路基板の接続構造および電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63254788A (ja) * 1987-04-10 1988-10-21 松下電器産業株式会社 プリント配線板
JPH06334298A (ja) * 1993-05-27 1994-12-02 Fujitsu Ltd 表面実装部品の搭載構造
JP2005504443A (ja) * 2001-08-31 2005-02-10 エプコス　アクチエンゲゼルシャフト 構成要素装置
JP2005236256A (ja) * 2003-09-12 2005-09-02 Matsushita Electric Ind Co Ltd コネクタシート及び配線基板、並びにコネクタシート及び配線基板の製造方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011148915A1 (fr) * 2010-05-26 2011-12-01 株式会社村田製作所 Substrat module et son procédé de fabrication
CN102907188A (zh) * 2010-05-26 2013-01-30 株式会社村田制作所 模块基板及其制造方法
JP5454681B2 (ja) * 2010-05-26 2014-03-26 株式会社村田製作所 モジュール基板およびその製造方法
CN102907188B (zh) * 2010-05-26 2015-10-21 株式会社村田制作所 模块基板及其制造方法
US9674970B2 (en) 2010-05-26 2017-06-06 Murata Manufacturing Co., Ltd. Module board and manufacturing method thereof
EP2473012A1 (fr) * 2010-12-30 2012-07-04 Research In Motion Limited Combinaison de cartes de circuits imprimés
JP2016039213A (ja) * 2014-08-06 2016-03-22 ローム株式会社 基板内蔵パッケージ、半導体装置およびモジュール
WO2018110383A1 (fr) * 2016-12-15 2018-06-21 株式会社村田製作所 Module électronique et procédé de production de module électronique
JPWO2018110383A1 (ja) * 2016-12-15 2019-10-24 株式会社村田製作所 電子モジュールおよび電子モジュールの製造方法
US10660227B2 (en) 2016-12-15 2020-05-19 Murata Manufacturing Co., Ltd. Electronic module and method of manufacturing electronic module
JP2021082771A (ja) * 2019-11-22 2021-05-27 株式会社ジェイテクト 電気機器
JP7427928B2 (ja) 2019-11-22 2024-02-06 株式会社ジェイテクト 電気機器

Also Published As

Publication number Publication date
TW200922417A (en) 2009-05-16
CN101803476A (zh) 2010-08-11
JPWO2009037833A1 (ja) 2011-01-06

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