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WO2009063764A1 - Feuille de cuivre comprenant une couche de film résistif - Google Patents

Feuille de cuivre comprenant une couche de film résistif Download PDF

Info

Publication number
WO2009063764A1
WO2009063764A1 PCT/JP2008/070006 JP2008070006W WO2009063764A1 WO 2009063764 A1 WO2009063764 A1 WO 2009063764A1 JP 2008070006 W JP2008070006 W JP 2008070006W WO 2009063764 A1 WO2009063764 A1 WO 2009063764A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper foil
film layer
resistive film
layer
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/070006
Other languages
English (en)
Japanese (ja)
Inventor
Toshio Kurosawa
Masaru Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Original Assignee
Nippon Mining and Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining and Metals Co Ltd filed Critical Nippon Mining and Metals Co Ltd
Priority to KR1020107001751A priority Critical patent/KR101188146B1/ko
Priority to JP2009503343A priority patent/JP4460026B2/ja
Publication of WO2009063764A1 publication Critical patent/WO2009063764A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C23C28/3455—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

L'invention porte sur une feuille de cuivre comprenant une couche de film électriquement résistif, caractérisée par le fait qu'une couche d'alliage cuivre-zinc contenant 1 000 µg/dm2 à 9 000 µg/dm2 de zinc par unité de surface est disposée sur une surface rugueuse ou sur une surface brillante de la feuille de cuivre, qu'une couche stabilisée avec une épaisseur entre 5 Å et 100 Å, constituée par au moins un composant sélectionné parmi l'oxyde de zinc, l'oxyde de chrome et l'oxyde de nickel, est formée sur la couche d'alliage cuivre-zinc, et qu'une couche de film constituée par un matériau électriquement résistif est disposée sur la couche stabilisée. La formation supplémentaire de la couche de film électriquement résistif dans la feuille de cuivre permet à une résistance d'être incorporée dans un substrat, et la feuille de cuivre comprend la couche de film résistif avec une adhérence améliorée.
PCT/JP2008/070006 2007-11-14 2008-11-04 Feuille de cuivre comprenant une couche de film résistif Ceased WO2009063764A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020107001751A KR101188146B1 (ko) 2007-11-14 2008-11-04 저항막층을 구비한 구리박
JP2009503343A JP4460026B2 (ja) 2007-11-14 2008-11-04 抵抗膜層を備えた銅箔

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-295117 2007-11-14
JP2007295117 2007-11-14

Publications (1)

Publication Number Publication Date
WO2009063764A1 true WO2009063764A1 (fr) 2009-05-22

Family

ID=40638616

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070006 Ceased WO2009063764A1 (fr) 2007-11-14 2008-11-04 Feuille de cuivre comprenant une couche de film résistif

Country Status (4)

Country Link
JP (1) JP4460026B2 (fr)
KR (2) KR101188146B1 (fr)
TW (1) TWI443226B (fr)
WO (1) WO2009063764A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012132593A1 (fr) * 2011-03-31 2012-10-04 Jx日鉱日石金属株式会社 Feuille métallique pourvue d'une couche électro-résistive, et carte pour circuit imprimé utilisant ladite feuille métallique
WO2012132592A1 (fr) * 2011-03-28 2012-10-04 Jx日鉱日石金属株式会社 Feuille de métal pourvue d'un film électriquement résistif et procédé de fabrication de cette dernière
JP2013004236A (ja) * 2011-06-14 2013-01-07 Dainippon Printing Co Ltd 太陽電池用集電シートの配線パターン形成用の導電性基材
JP2014146544A (ja) * 2013-01-30 2014-08-14 Hitachi Metals Ltd 高速伝送ケーブル用導体、及びその製造方法、並びに高速伝送ケーブル
US9666746B2 (en) 2011-06-14 2017-05-30 Dai Nippon Printing Co., Ltd. Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2644754B1 (fr) * 2010-11-22 2016-05-11 Mitsui Mining & Smelting Co., Ltd. Feuille de cuivre traitée en surface
KR102101046B1 (ko) * 2012-05-22 2020-04-14 미쓰이금속광업주식회사 구리박, 부극 집전체 및 비수계 2차 전지의 부극재

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925297A (ja) * 1982-08-03 1984-02-09 日本電解株式会社 印刷回路用銅箔
JPH07233497A (ja) * 1994-02-24 1995-09-05 Nippon Denkai Kk 非シアン系銅−亜鉛電気めっき浴、これを用いたプリント配線板用銅箔の表面処理方法及びプリント配線板用銅箔
JP2002319407A (ja) * 2001-04-23 2002-10-31 Sanyo Electric Co Ltd リチウム二次電池用電極及びリチウム二次電池
JP3452557B2 (ja) * 2000-07-31 2003-09-29 グールド エレクトロニクス インコーポレイテッド プリント回路基板で用いられる銅層上に抵抗材料を形成する方法およびシート材料

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6489034B1 (en) * 2000-02-08 2002-12-03 Gould Electronics Inc. Method of forming chromium coated copper for printed circuit boards

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925297A (ja) * 1982-08-03 1984-02-09 日本電解株式会社 印刷回路用銅箔
JPH07233497A (ja) * 1994-02-24 1995-09-05 Nippon Denkai Kk 非シアン系銅−亜鉛電気めっき浴、これを用いたプリント配線板用銅箔の表面処理方法及びプリント配線板用銅箔
JP3452557B2 (ja) * 2000-07-31 2003-09-29 グールド エレクトロニクス インコーポレイテッド プリント回路基板で用いられる銅層上に抵抗材料を形成する方法およびシート材料
JP2002319407A (ja) * 2001-04-23 2002-10-31 Sanyo Electric Co Ltd リチウム二次電池用電極及びリチウム二次電池

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012132592A1 (fr) * 2011-03-28 2012-10-04 Jx日鉱日石金属株式会社 Feuille de métal pourvue d'un film électriquement résistif et procédé de fabrication de cette dernière
JP5346408B2 (ja) * 2011-03-28 2013-11-20 Ｊｘ日鉱日石金属株式会社 電気抵抗膜を備えた金属箔及びその製造方法
CN103429788A (zh) * 2011-03-28 2013-12-04 吉坤日矿日石金属株式会社 具备电阻膜的金属箔及其制造方法
WO2012132593A1 (fr) * 2011-03-31 2012-10-04 Jx日鉱日石金属株式会社 Feuille métallique pourvue d'une couche électro-résistive, et carte pour circuit imprimé utilisant ladite feuille métallique
US20140041910A1 (en) * 2011-03-31 2014-02-13 Jx Nippon Mining & Metals Corporation Metal Foil Provided with Electrically Resistive Layer, and Board for Printed Circuit Using Said Metal Foil
US9578739B2 (en) 2011-03-31 2017-02-21 Jx Nippon Mining & Metals Corporation Metal foil provided with electrically resistive layer, and board for printed circuit using said metal foil
JP2013004236A (ja) * 2011-06-14 2013-01-07 Dainippon Printing Co Ltd 太陽電池用集電シートの配線パターン形成用の導電性基材
US9666746B2 (en) 2011-06-14 2017-05-30 Dai Nippon Printing Co., Ltd. Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells
JP2014146544A (ja) * 2013-01-30 2014-08-14 Hitachi Metals Ltd 高速伝送ケーブル用導体、及びその製造方法、並びに高速伝送ケーブル

Also Published As

Publication number Publication date
TW200927993A (en) 2009-07-01
JP4460026B2 (ja) 2010-05-12
KR20120084784A (ko) 2012-07-30
KR101188146B1 (ko) 2012-10-05
TWI443226B (zh) 2014-07-01
KR20100030654A (ko) 2010-03-18
JPWO2009063764A1 (ja) 2011-03-31

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