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WO2008139853A1 - 電子部品試験装置、電子部品試験システム及び電子部品の試験方法 - Google Patents

電子部品試験装置、電子部品試験システム及び電子部品の試験方法 Download PDF

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Publication number
WO2008139853A1
WO2008139853A1 PCT/JP2008/057764 JP2008057764W WO2008139853A1 WO 2008139853 A1 WO2008139853 A1 WO 2008139853A1 JP 2008057764 W JP2008057764 W JP 2008057764W WO 2008139853 A1 WO2008139853 A1 WO 2008139853A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
component testing
contact plate
testing
customer tray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057764
Other languages
English (en)
French (fr)
Inventor
Akihiko Ito
Yoshihito Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to JP2009514067A priority Critical patent/JPWO2008139853A1/ja
Priority to KR1020097025220A priority patent/KR101163628B1/ko
Publication of WO2008139853A1 publication Critical patent/WO2008139853A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

電子部品試験装置は、ＩＣデバイスのテストを行う直前に、カスタマトレイ（５）と試験専用のコンタクトプレート（６Ａ）とを重ね合わせて反転させて、カスタマトレイ（５）からコンタクトプレート（６Ａ）にＩＣデバイスを移し替える第１の反転装置（２２０）と、ＩＣデバイスをテストする際に、コンタクトプレート（６Ａ）にＩＣデバイスを保持した状態で、ＩＣデバイスをテストヘッド（４）のソケット（４１）に押し付ける押圧装置（２５０）と、を備えている。
PCT/JP2008/057764 2007-05-09 2008-04-22 電子部品試験装置、電子部品試験システム及び電子部品の試験方法 Ceased WO2008139853A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009514067A JPWO2008139853A1 (ja) 2007-05-09 2008-04-22 電子部品試験装置、電子部品試験システム及び電子部品の試験方法
KR1020097025220A KR101163628B1 (ko) 2007-05-09 2008-04-22 전자부품 시험장치 및 전자부품 시험 시스템

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2007/059597 WO2008139579A1 (ja) 2007-05-09 2007-05-09 電子部品試験装置、電子部品試験システム及び電子部品の試験方法
JPPCT/JP2007/059597 2007-05-09

Publications (1)

Publication Number Publication Date
WO2008139853A1 true WO2008139853A1 (ja) 2008-11-20

Family

ID=40001811

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2007/059597 Ceased WO2008139579A1 (ja) 2007-05-09 2007-05-09 電子部品試験装置、電子部品試験システム及び電子部品の試験方法
PCT/JP2008/057764 Ceased WO2008139853A1 (ja) 2007-05-09 2008-04-22 電子部品試験装置、電子部品試験システム及び電子部品の試験方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/059597 Ceased WO2008139579A1 (ja) 2007-05-09 2007-05-09 電子部品試験装置、電子部品試験システム及び電子部品の試験方法

Country Status (4)

Country Link
JP (1) JPWO2008139853A1 (ja)
KR (1) KR101163628B1 (ja)
TW (1) TW200912340A (ja)
WO (2) WO2008139579A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010146708A1 (ja) * 2009-06-19 2010-12-23 株式会社アドバンテスト 電子部品移載装置及びそれを備えた電子部品試験装置
WO2010146709A1 (ja) * 2009-06-19 2010-12-23 株式会社アドバンテスト 電子部品移載装置及び電子部品の移載方法
CN103185849A (zh) * 2011-12-28 2013-07-03 株式会社爱德万测试 电子元件测试装置
JP2016153165A (ja) * 2016-04-26 2016-08-25 平田機工株式会社 搬送システム

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102072390B1 (ko) * 2013-06-18 2020-02-04 (주)테크윙 테스트핸들러
KR102015572B1 (ko) * 2013-10-02 2019-10-22 삼성전자주식회사 실장 장치
KR101670051B1 (ko) * 2014-07-08 2016-10-28 피에스케이 주식회사 처리 장치 및 방법
KR102145306B1 (ko) * 2014-07-21 2020-08-19 (주)테크윙 전자부품 테스트 장비
JP7281250B2 (ja) * 2018-05-11 2023-05-25 株式会社アドバンテスト 試験用キャリア
KR102122760B1 (ko) * 2018-11-21 2020-06-26 정성욱 트레이 교체 시스템
JP7192620B2 (ja) * 2019-03-29 2022-12-20 新東工業株式会社 検査装置
CN113552463B (zh) * 2021-07-15 2022-04-26 中国科学院长春光学精密机械与物理研究所 一种电子元器件测试装置及其测试方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08194032A (ja) * 1995-01-18 1996-07-30 Advantest Corp Ｉｃテスタ用水平搬送型ハンドラ
JP2000039307A (ja) * 1998-07-22 2000-02-08 Hitachi Ltd 半導体検査装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01116461A (ja) * 1987-10-29 1989-05-09 Nec Yamagata Ltd 半導体装置の電気的特性測定方法
JPH11198988A (ja) * 1998-01-12 1999-07-27 Murata Mfg Co Ltd 収納具
JPH11326448A (ja) * 1998-05-20 1999-11-26 Advantest Corp Ｉｃ試験装置
JP2000258493A (ja) * 1999-03-08 2000-09-22 Hitachi Ltd 半導体素子検査装置
JP2006284384A (ja) * 2005-03-31 2006-10-19 Fujitsu Ltd 半導体装置の試験装置及び試験方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08194032A (ja) * 1995-01-18 1996-07-30 Advantest Corp Ｉｃテスタ用水平搬送型ハンドラ
JP2000039307A (ja) * 1998-07-22 2000-02-08 Hitachi Ltd 半導体検査装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010146708A1 (ja) * 2009-06-19 2010-12-23 株式会社アドバンテスト 電子部品移載装置及びそれを備えた電子部品試験装置
WO2010146709A1 (ja) * 2009-06-19 2010-12-23 株式会社アドバンテスト 電子部品移載装置及び電子部品の移載方法
JPWO2010146709A1 (ja) * 2009-06-19 2012-11-29 株式会社アドバンテスト 電子部品移載装置及び電子部品の移載方法
TWI409204B (zh) * 2009-06-19 2013-09-21 Advantest Corp Electronic component processing device and electronic component testing device
CN103185849A (zh) * 2011-12-28 2013-07-03 株式会社爱德万测试 电子元件测试装置
KR101421102B1 (ko) 2011-12-28 2014-09-26 가부시키가이샤 아드반테스트 전자부품 시험장치
JP2016153165A (ja) * 2016-04-26 2016-08-25 平田機工株式会社 搬送システム

Also Published As

Publication number Publication date
KR20090133141A (ko) 2009-12-31
JPWO2008139853A1 (ja) 2010-07-29
WO2008139579A1 (ja) 2008-11-20
KR101163628B1 (ko) 2012-07-09
TW200912340A (en) 2009-03-16

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