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WO2008120519A1 - Tcpハンドリング装置 - Google Patents

Tcpハンドリング装置 Download PDF

Info

Publication number
WO2008120519A1
WO2008120519A1 PCT/JP2008/053517 JP2008053517W WO2008120519A1 WO 2008120519 A1 WO2008120519 A1 WO 2008120519A1 JP 2008053517 W JP2008053517 W JP 2008053517W WO 2008120519 A1 WO2008120519 A1 WO 2008120519A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe
tcp
tcp handler
probe card
carrier tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/053517
Other languages
English (en)
French (fr)
Inventor
Hisashi Murano
Katsuhiro Imaizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to JP2009507437A priority Critical patent/JPWO2008120519A1/ja
Publication of WO2008120519A1 publication Critical patent/WO2008120519A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867Handlers or transport devices, e.g. loaders, carriers, trays
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2896Testing of IC packages; Test features related to IC packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

 TCPが複数形成されたキャリアテープ5を搬送して、テストヘッド10に電気的に接続されているプローブ81を有するプローブカード8に対してキャリアテープ5を押圧し、TCPのテストパッドをプローブカード8のプローブ81に接続させることにより、TCPを順次試験に付すことのできるTCPハンドラ2において、クリーニングステージ91によってキャリアテープ5とプローブカード8との間に挿入され、プローブカード8のプローブ81をクリーニングすることのできるクリーニング部材93を設ける。かかるTCPハンドラ2によれば、TCPハンドラ2の実稼動中であっても、プローブ81を簡便にクリーニングすることができる。
PCT/JP2008/053517 2007-03-29 2008-02-28 Tcpハンドリング装置 Ceased WO2008120519A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009507437A JPWO2008120519A1 (ja) 2007-03-29 2008-02-28 Tcpハンドリング装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007089810 2007-03-29
JP2007-089810 2007-03-29

Publications (1)

Publication Number Publication Date
WO2008120519A1 true WO2008120519A1 (ja) 2008-10-09

Family

ID=39808103

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053517 Ceased WO2008120519A1 (ja) 2007-03-29 2008-02-28 Tcpハンドリング装置

Country Status (4)

Country Link
JP (1) JPWO2008120519A1 (ja)
KR (1) KR20090132617A (ja)
TW (1) TW200902997A (ja)
WO (1) WO2008120519A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011059010A (ja) * 2009-09-11 2011-03-24 Ueno Seiki Kk テストコンタクト、そのクリーニング方法及び半導体製造装置
JP2011149917A (ja) * 2009-12-22 2011-08-04 Micronics Japan Co Ltd プローブ清掃ユニット及びそれを備えたパネル検査装置並びにプローブ清掃方法
EP2426794A1 (en) * 2010-09-06 2012-03-07 Rasco GmbH Cleaning a contactor in a test-in-strip handler for ICs
JP2022003330A (ja) * 2020-06-12 2022-01-11 致茂電子股▲分▼有限公司Chroma Ate Inc. 洗浄治具
CN114879018A (zh) * 2022-06-21 2022-08-09 上海捷策创电子科技有限公司 一种芯片测试装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012068032A (ja) * 2010-09-21 2012-04-05 Tesetsuku:Kk Tcp試験装置
KR102440287B1 (ko) * 2020-08-24 2022-09-06 (주)퓨쳐하이테크 전자부품 착탈장치와 그를 이용한 시험장치

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0679149U (ja) * 1993-04-23 1994-11-04 安藤電気株式会社 研磨シートつきテープキャリア
JPH11145212A (ja) * 1997-11-07 1999-05-28 Matsushita Electric Ind Co Ltd プローブカードの洗浄装置
JPH11295392A (ja) * 1998-04-15 1999-10-29 Micronics Japan Co Ltd プローブに付着している異物の除去装置
JP2000223539A (ja) * 1999-01-29 2000-08-11 Tokyo Electron Ltd クリーナ及びクリーニング方法
JP2002307316A (ja) * 2001-04-09 2002-10-23 Nihon Micro Coating Co Ltd 接触子先端及び側面クリーニング用具
WO2004068154A1 (ja) * 2003-01-31 2004-08-12 Japan Engineering Co.,Ltd. Tcpハンドリング装置および当該装置における位置ずれ補正方法
JP2006208009A (ja) * 2005-01-25 2006-08-10 Ricoh Co Ltd 回路基板検査装置、記憶媒体、回路基板検査方法、回路基板製造方法及び回路基板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0679149U (ja) * 1993-04-23 1994-11-04 安藤電気株式会社 研磨シートつきテープキャリア
JPH11145212A (ja) * 1997-11-07 1999-05-28 Matsushita Electric Ind Co Ltd プローブカードの洗浄装置
JPH11295392A (ja) * 1998-04-15 1999-10-29 Micronics Japan Co Ltd プローブに付着している異物の除去装置
JP2000223539A (ja) * 1999-01-29 2000-08-11 Tokyo Electron Ltd クリーナ及びクリーニング方法
JP2002307316A (ja) * 2001-04-09 2002-10-23 Nihon Micro Coating Co Ltd 接触子先端及び側面クリーニング用具
WO2004068154A1 (ja) * 2003-01-31 2004-08-12 Japan Engineering Co.,Ltd. Tcpハンドリング装置および当該装置における位置ずれ補正方法
JP2006208009A (ja) * 2005-01-25 2006-08-10 Ricoh Co Ltd 回路基板検査装置、記憶媒体、回路基板検査方法、回路基板製造方法及び回路基板

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011059010A (ja) * 2009-09-11 2011-03-24 Ueno Seiki Kk テストコンタクト、そのクリーニング方法及び半導体製造装置
JP2011149917A (ja) * 2009-12-22 2011-08-04 Micronics Japan Co Ltd プローブ清掃ユニット及びそれを備えたパネル検査装置並びにプローブ清掃方法
EP2426794A1 (en) * 2010-09-06 2012-03-07 Rasco GmbH Cleaning a contactor in a test-in-strip handler for ICs
JP2022003330A (ja) * 2020-06-12 2022-01-11 致茂電子股▲分▼有限公司Chroma Ate Inc. 洗浄治具
JP7274525B2 (ja) 2020-06-12 2023-05-16 致茂電子股▲分▼有限公司 洗浄治具
CN114879018A (zh) * 2022-06-21 2022-08-09 上海捷策创电子科技有限公司 一种芯片测试装置
CN114879018B (zh) * 2022-06-21 2025-02-18 上海捷策创电子科技有限公司 一种芯片测试装置

Also Published As

Publication number Publication date
JPWO2008120519A1 (ja) 2010-07-15
KR20090132617A (ko) 2009-12-30
TW200902997A (en) 2009-01-16

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