[go: up one dir, main page]

WO2008012209A3 - Integrated circuit heat dissipation device - Google Patents

Integrated circuit heat dissipation device Download PDF

Info

Publication number
WO2008012209A3
WO2008012209A3 PCT/EP2007/057198 EP2007057198W WO2008012209A3 WO 2008012209 A3 WO2008012209 A3 WO 2008012209A3 EP 2007057198 W EP2007057198 W EP 2007057198W WO 2008012209 A3 WO2008012209 A3 WO 2008012209A3
Authority
WO
WIPO (PCT)
Prior art keywords
integrated circuit
heat dissipation
dissipation device
compressive force
minimum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2007/057198
Other languages
French (fr)
Other versions
WO2008012209A2 (en
Inventor
John Lee Colbert
Jr John Saunders Corbin
Jason Rodney Eagle
Roger Duane Hamilton
Amanda Elisa Mikhail
Arvind Kumar Sinha
Terry Leo Sobotta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IBM United Kingdom Ltd
International Business Machines Corp
Original Assignee
IBM United Kingdom Ltd
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IBM United Kingdom Ltd, International Business Machines Corp filed Critical IBM United Kingdom Ltd
Priority to JP2009521204A priority Critical patent/JP5315241B2/en
Priority to EP07787469.1A priority patent/EP2047508B1/en
Priority to CN2007800254792A priority patent/CN101484991B/en
Publication of WO2008012209A2 publication Critical patent/WO2008012209A2/en
Publication of WO2008012209A3 publication Critical patent/WO2008012209A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or equal to a maximum pressure which may be exerted on the integrated circuit device.
PCT/EP2007/057198 2006-07-27 2007-07-12 Integrated circuit heat dissipation device Ceased WO2008012209A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009521204A JP5315241B2 (en) 2006-07-27 2007-07-12 Heat dissipation device for integrated circuits
EP07787469.1A EP2047508B1 (en) 2006-07-27 2007-07-12 Integrated circuit heat dissipation device
CN2007800254792A CN101484991B (en) 2006-07-27 2007-07-12 Integrated circuit cooling device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/460,334 US7777329B2 (en) 2006-07-27 2006-07-27 Heatsink apparatus for applying a specified compressive force to an integrated circuit device
US11/460,334 2006-07-27

Publications (2)

Publication Number Publication Date
WO2008012209A2 WO2008012209A2 (en) 2008-01-31
WO2008012209A3 true WO2008012209A3 (en) 2008-05-08

Family

ID=38457991

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/057198 Ceased WO2008012209A2 (en) 2006-07-27 2007-07-12 Integrated circuit heat dissipation device

Country Status (6)

Country Link
US (1) US7777329B2 (en)
EP (1) EP2047508B1 (en)
JP (1) JP5315241B2 (en)
KR (1) KR101020010B1 (en)
CN (1) CN101484991B (en)
WO (1) WO2008012209A2 (en)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2815944B2 (en) 1989-12-21 1998-10-27 株式会社ブリヂストン Pneumatic bias tire for heavy-duty vehicles
US20070226911A1 (en) * 2006-04-03 2007-10-04 Dreamwell, Ltd Mattress or mattress pad with gel section
US7408776B2 (en) * 2006-10-10 2008-08-05 International Business Machines Corporation Conductive heat transport cooling system and method for a multi-component electronics system
US7420808B2 (en) * 2006-10-10 2008-09-02 International Business Machines Corporation Liquid-based cooling system for cooling a multi-component electronics system
US7400505B2 (en) * 2006-10-10 2008-07-15 International Business Machines Corporation Hybrid cooling system and method for a multi-component electronics system
US7751918B2 (en) * 2007-01-05 2010-07-06 International Business Machines Corporation Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates
US7499279B2 (en) * 2007-04-30 2009-03-03 International Business Machines Corporation Cold plate stability
US7450385B1 (en) * 2007-06-15 2008-11-11 International Business Machines Corporation Liquid-based cooling apparatus for an electronics rack
US20090086432A1 (en) * 2007-09-27 2009-04-02 International Business Machines Corporation Docking station with closed loop airlfow path for facilitating cooling of an electronics rack
US8387249B2 (en) 2007-11-19 2013-03-05 International Business Machines Corporation Apparatus and method for facilitating servicing of a liquid-cooled electronics rack
US7963119B2 (en) * 2007-11-26 2011-06-21 International Business Machines Corporation Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center
US7885070B2 (en) 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US7916483B2 (en) 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US7961475B2 (en) 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US7983040B2 (en) 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US7944694B2 (en) 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
CN102192995B (en) * 2010-03-11 2015-06-10 希森美康株式会社 Sample analyzer and reagent management method
JP5359951B2 (en) * 2010-03-23 2013-12-04 株式会社デンソー Power converter and manufacturing method thereof
US8559180B2 (en) * 2010-03-23 2013-10-15 Alcatel Lucent Removable IC package stiffening brace and method
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
US8363406B2 (en) * 2010-12-17 2013-01-29 International Business Machines Corporation Rotatable latch for compressing thermal interface material between a heat generating electrical component and a cooling electrical component
US8182280B1 (en) * 2011-03-22 2012-05-22 Hon Hai Precision Ind. Co., Ltd. Socket connector having cushioning arrangement facilitating smooth placement and ejection of electronic device
US8619420B2 (en) * 2011-06-30 2013-12-31 Apple Inc. Consolidated thermal module
WO2013089677A1 (en) * 2011-12-13 2013-06-20 Intel Corporation Heat dissipation device loading mechanisms
US8693200B2 (en) * 2012-02-07 2014-04-08 International Business Machines Corporation Semiconductor device cooling module
US9629232B2 (en) * 2012-05-17 2017-04-18 The Regents Of The University Of California Thermally actuated printed circuit board retainers
US20130306293A1 (en) * 2012-05-21 2013-11-21 Hamilton Sundstrand Space Systems International Extruded matching set radiators
US20130308273A1 (en) * 2012-05-21 2013-11-21 Hamilton Sundstrand Space Systems International Laser sintered matching set radiators
JP5623463B2 (en) * 2012-06-25 2014-11-12 三菱電機株式会社 Semiconductor module
JP5751273B2 (en) * 2013-04-02 2015-07-22 トヨタ自動車株式会社 Semiconductor device
US9379037B2 (en) 2014-03-14 2016-06-28 Apple Inc. Thermal module accounting for increased board/die size in a portable computer
US10019028B2 (en) * 2015-01-28 2018-07-10 International Business Machines Corporation Latch and spring assembly
US10448543B2 (en) * 2015-05-04 2019-10-15 Google Llc Cooling electronic devices in a data center
US9913361B2 (en) 2016-01-06 2018-03-06 International Business Machines Corporation Integrated circuit device assembly
US9831151B1 (en) 2016-08-03 2017-11-28 International Business Machines Corporation Heat sink for semiconductor modules
US10262919B2 (en) 2017-02-01 2019-04-16 Cisco Technology, Inc. Bi-directional heatsink dampening force system
JP7108415B2 (en) * 2017-10-06 2022-07-28 シナプティクス インコーポレイテッド Integrated circuit devices and electronic equipment
CN110137720B (en) * 2018-02-09 2022-07-26 富士康(昆山)电脑接插件有限公司 Fixing device for fixing radiator and abutting device thereof
JP7000931B2 (en) * 2018-03-12 2022-01-19 富士通株式会社 Substrate with cooling mechanism
US11719428B2 (en) * 2019-04-19 2023-08-08 Xtremelux Corporation Compressive heat sink
US11991863B2 (en) * 2021-11-22 2024-05-21 Juniper Networks, Inc. Apparatus, system, and method for mitigating deformation of spring-loaded heatsinks
US11997817B2 (en) * 2021-12-08 2024-05-28 Ciena Corporation Load distributing frame for heat sink applications
US11950354B2 (en) 2022-03-04 2024-04-02 Apple Inc. Internal architecture of a computing device
US12046534B2 (en) 2022-03-04 2024-07-23 Apple Inc. Structural and thermal management of an integrated circuit
US20240256005A1 (en) * 2023-02-01 2024-08-01 Advanced Micro Devices, Inc. Load from with load balanced clamp and electronic device having the same

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998010631A1 (en) * 1996-09-09 1998-03-12 Intricast, Inc. Adjustable-pressure mount heatsink system
WO1998035540A1 (en) * 1997-01-24 1998-08-13 Aavid Thermal Technologies, Inc. A spring clip for mounting a heat sink to an electronic component
EP1059665A2 (en) * 1999-06-11 2000-12-13 Thomas & Betts International, Inc. Land grid array package clamp mechanism
US6385044B1 (en) * 2001-07-27 2002-05-07 International Business Machines Corporation Heat pipe heat sink assembly for cooling semiconductor chips
US6386890B1 (en) * 2001-03-12 2002-05-14 International Business Machines Corporation Printed circuit board to module mounting and interconnecting structure and method
US20020060064A1 (en) * 2000-11-17 2002-05-23 Hung-Chi Yu Heat sink assembly
US6449162B1 (en) * 2001-06-07 2002-09-10 International Business Machines Corporation Removable land grid array cooling solution
US6475011B1 (en) * 2001-09-07 2002-11-05 International Business Machines Corporation Land grid array socket actuation hardware for MCM applications
US20040252462A1 (en) * 2003-06-11 2004-12-16 Cromwell Stephen D. Land grid array assembly using a compressive load

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4748495A (en) 1985-08-08 1988-05-31 Dypax Systems Corporation High density multi-chip interconnection and cooling package
US5357404A (en) * 1991-11-18 1994-10-18 The Whitaker Corporation EMI shield, and assembly using same
JPH05243439A (en) * 1992-03-03 1993-09-21 Mitsubishi Electric Corp Heat sink mounting mechanism
US5305185A (en) * 1992-09-30 1994-04-19 Samarov Victor M Coplanar heatsink and electronics assembly
FR2729045B1 (en) * 1994-12-29 1997-01-24 Bull Sa METHOD AND DEVICE FOR FIXING TWO ELEMENTS SUCH AS AN INTEGRATED CIRCUIT RADIATOR IN A PRINTED CIRCUIT BOARD
US5730620A (en) 1995-09-08 1998-03-24 International Business Machines Corporation Method and apparatus for locating electrical circuit members
US5691041A (en) 1995-09-29 1997-11-25 International Business Machines Corporation Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer
US5745344A (en) 1995-11-06 1998-04-28 International Business Machines Corporation Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device
US5738531A (en) * 1996-09-09 1998-04-14 International Business Machines Corporation Self-alligning low profile socket for connecting ball grid array devices through a dendritic interposer
JP2959506B2 (en) * 1997-02-03 1999-10-06 日本電気株式会社 Multi-chip module cooling structure
US5870286A (en) 1997-08-20 1999-02-09 International Business Machines Corporation Heat sink assembly for cooling electronic modules
US5978223A (en) 1998-02-09 1999-11-02 International Business Machines Corporation Dual heat sink assembly for cooling multiple electronic modules
US6061235A (en) 1998-11-18 2000-05-09 Hewlett-Packard Company Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management
US6198630B1 (en) 1999-01-20 2001-03-06 Hewlett-Packard Company Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules
JP3881488B2 (en) 1999-12-13 2007-02-14 株式会社東芝 Circuit module cooling device and electronic apparatus having the cooling device
US6299460B1 (en) 2000-04-14 2001-10-09 Hewlett Packard Company Spring-loaded backing plate assembly for use with land grid array-type devices
US6634095B2 (en) 2001-06-27 2003-10-21 International Business Machines Corporation Apparatus for mounting a land grid array module
US6789312B2 (en) * 2001-07-30 2004-09-14 Hewlett-Packard Development Company, L.P. Method of attaching an integrated circuit to a chip mounting receptacle in a PCB with a bolster plate
US6557675B2 (en) * 2001-07-31 2003-05-06 Compaq Information Technologies Group, L.P. Tunable vibration damper for processor packages
JP2003059602A (en) * 2001-08-08 2003-02-28 Yamaichi Electronics Co Ltd Socket for semiconductor device
US6449155B1 (en) 2001-08-09 2002-09-10 International Business Machines Corporation Land grid array subassembly for multichip modules
US6802733B2 (en) * 2001-08-16 2004-10-12 International Business Machines Corporation Topside installation apparatus for land grid array modules
US6835072B2 (en) * 2002-01-09 2004-12-28 Paricon Technologies Corporation Apparatus for applying a mechanically-releasable balanced compressive load to a compliant anisotropic conductive elastomer electrical connector
US6415853B1 (en) 2002-01-22 2002-07-09 Chaun-Choung Technology Corp. Wind cover locking element structure of heat radiator
US6639800B1 (en) * 2002-04-30 2003-10-28 Advanced Micro Devices, Inc. Heat sink subassembly
US6836408B2 (en) 2002-09-19 2004-12-28 Sun Microsystems, Inc. Method and apparatus for force transfer via bare die package
TW551791U (en) 2002-12-31 2003-09-01 Hon Hai Prec Ind Co Ltd A clip for heat sink
US6724629B1 (en) 2003-04-29 2004-04-20 Hewlett-Packard Development Company, L.P. Leaf spring load plate with retained linear cam slide
US20040247925A1 (en) 2003-06-06 2004-12-09 Cromwell Stephen Daniel Method and system for adjusting a curvature of a load plate based on a target load
US6988533B2 (en) 2003-06-26 2006-01-24 International Business Machines Corporation Method and apparatus for mounting a heat transfer apparatus upon an electronic component
US7323358B1 (en) 2003-08-13 2008-01-29 Hewlett-Packard Development Company, L.P. Method and system for sizing a load plate
US6898083B1 (en) * 2003-11-10 2005-05-24 Tyco Electronics Corporation Heat sink integrated retention system
US7068510B2 (en) 2003-12-04 2006-06-27 International Business Machines Corporation Dissipating heat reliably in computer systems
US6950310B2 (en) 2003-12-31 2005-09-27 Texas Instruments Incorporated System and method for self-leveling heat sink for multiple height devices
US7095614B2 (en) * 2004-04-20 2006-08-22 International Business Machines Corporation Electronic module assembly
US7486516B2 (en) * 2005-08-11 2009-02-03 International Business Machines Corporation Mounting a heat sink in thermal contact with an electronic component
US7382620B2 (en) 2005-10-13 2008-06-03 International Business Machines Corporation Method and apparatus for optimizing heat transfer with electronic components
US7283368B2 (en) * 2005-10-21 2007-10-16 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating assembly
US7345881B2 (en) * 2006-04-20 2008-03-18 International Business Machines Corporation Non-influencing fastener for mounting a heat sink in contact with an electronic component
US7417864B2 (en) * 2006-05-16 2008-08-26 Hewlett-Packard Development Company, Lp. Gear driven socket activation mechanism
WO2008035540A1 (en) 2006-09-19 2008-03-27 Nec Corporation Apparatus with electronic device mounted therein and method for suppressing resonance of the apparatus
US20080081489A1 (en) 2006-09-29 2008-04-03 Macgregor Mike G Reliable land grid array socket loading device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998010631A1 (en) * 1996-09-09 1998-03-12 Intricast, Inc. Adjustable-pressure mount heatsink system
WO1998035540A1 (en) * 1997-01-24 1998-08-13 Aavid Thermal Technologies, Inc. A spring clip for mounting a heat sink to an electronic component
EP1059665A2 (en) * 1999-06-11 2000-12-13 Thomas & Betts International, Inc. Land grid array package clamp mechanism
US20020060064A1 (en) * 2000-11-17 2002-05-23 Hung-Chi Yu Heat sink assembly
US6386890B1 (en) * 2001-03-12 2002-05-14 International Business Machines Corporation Printed circuit board to module mounting and interconnecting structure and method
US6449162B1 (en) * 2001-06-07 2002-09-10 International Business Machines Corporation Removable land grid array cooling solution
US6385044B1 (en) * 2001-07-27 2002-05-07 International Business Machines Corporation Heat pipe heat sink assembly for cooling semiconductor chips
US6475011B1 (en) * 2001-09-07 2002-11-05 International Business Machines Corporation Land grid array socket actuation hardware for MCM applications
US20040252462A1 (en) * 2003-06-11 2004-12-16 Cromwell Stephen D. Land grid array assembly using a compressive load

Also Published As

Publication number Publication date
KR20090035533A (en) 2009-04-09
JP5315241B2 (en) 2013-10-16
EP2047508B1 (en) 2013-04-24
US20080024991A1 (en) 2008-01-31
US7777329B2 (en) 2010-08-17
EP2047508A2 (en) 2009-04-15
CN101484991B (en) 2012-02-08
KR101020010B1 (en) 2011-03-09
WO2008012209A2 (en) 2008-01-31
JP2009545148A (en) 2009-12-17
CN101484991A (en) 2009-07-15

Similar Documents

Publication Publication Date Title
WO2008012209A3 (en) Integrated circuit heat dissipation device
WO2006099936A3 (en) Device and method for determining the temperature of a heat sink
MY148803A (en) Electronic component pressing device and electronic component test apparatus
EP2284849A4 (en) Electronic device and method for connecting electronic circuit board
GB0722233D0 (en) Control method and device for impact screw tightening device
NZ590752A (en) Pressurization coating systems, methods, and apparatuses
WO2008005591A3 (en) Low-profile board level emi shielding and thermal management apparatus and spring clips for use therewith
EG25336A (en) Method for applying an electronic assembly to a substrate and a device for applying said assembly.
PL1839883T3 (en) Method and device for printing on plate-like objects
WO2008139853A1 (en) Electronic component testing apparatus, electronic component testing system and electronic component testing method
WO2010099180A3 (en) Support assembly for an ear
WO2011009022A3 (en) Method and apparatus of heat dissipaters for electronic components in downhole tools
WO2005069828A3 (en) Thermal protection for electronic components during processing
WO2008040707A3 (en) Device for reshaping bones
WO2006015685A3 (en) Component arrangement with an optimized assembly capability
EP2543971B8 (en) A method for an electronic device
WO2007127825A3 (en) Fabrication tool for bonding
GB2423420B (en) Device and method for cooling an electronic control
WO2008101884A3 (en) Method for contacting electrical components
SG134221A1 (en) Electronic component mounting apparatus and electronic component mounting method
WO2008123248A1 (en) Base-equipped insulating sheet, multi-layer printed circuit board, semiconductor device, and multi-layer printed circuit board manufacturing method
PL1972405T3 (en) Device and method for pretreating electronic components before soldering
WO2005069858A3 (en) Nano-composite piezoelectric material
WO2010112478A3 (en) Pressure support for an electronic circuit
WO2006083870A3 (en) Systems and methods for controlling operation of electronic devices

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200780025479.2

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07787469

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 1020097001191

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2007787469

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2009521204

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

NENP Non-entry into the national phase

Ref country code: RU