[go: up one dir, main page]

WO2008133101A1 - Système de refroidissement - Google Patents

Système de refroidissement Download PDF

Info

Publication number
WO2008133101A1
WO2008133101A1 PCT/JP2008/057319 JP2008057319W WO2008133101A1 WO 2008133101 A1 WO2008133101 A1 WO 2008133101A1 JP 2008057319 W JP2008057319 W JP 2008057319W WO 2008133101 A1 WO2008133101 A1 WO 2008133101A1
Authority
WO
WIPO (PCT)
Prior art keywords
cooling
radiators
radiator
heat
cooling system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057319
Other languages
English (en)
Japanese (ja)
Inventor
Hitoshi Onishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of WO2008133101A1 publication Critical patent/WO2008133101A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/0246—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid heat-exchange elements having several adjacent conduits forming a whole, e.g. blocks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

Le système de refroidissement à liquide selon l'invention est muni d'une plaque de réception de chaleur, qui est amenée en contact thermique avec une source de génération de chaleur afin d'absorber la chaleur provenant de la source de génération de chaleur ; d'un radiateur ; d'une pompe destinée à faire circuler un milieu de refroidissement entre la plaque de réception de chaleur et le radiateur ; et un ventilateur destiné à appliquer un flux d'air de refroidissement au radiateur. Une pluralité de radiateurs ayant des canaux indépendants est prévue, et un nombre de ventilateurs inférieur au nombre de radiateurs est prévu afin d'appliquer un flux d'air de refroidissement aux radiateurs.
PCT/JP2008/057319 2007-04-20 2008-04-15 Système de refroidissement Ceased WO2008133101A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-112196 2007-04-20
JP2007112196A JP2010156467A (ja) 2007-04-20 2007-04-20 液冷システム

Publications (1)

Publication Number Publication Date
WO2008133101A1 true WO2008133101A1 (fr) 2008-11-06

Family

ID=39925559

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057319 Ceased WO2008133101A1 (fr) 2007-04-20 2008-04-15 Système de refroidissement

Country Status (3)

Country Link
JP (1) JP2010156467A (fr)
TW (1) TW200850137A (fr)
WO (1) WO2008133101A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010133642A (ja) * 2008-12-04 2010-06-17 Fujitsu Ltd ラジエータ、冷却ユニット、冷却システム及び電子機器
WO2011137774A1 (fr) * 2010-11-17 2011-11-10 华为技术有限公司 Centre de données de type conteneur
WO2012056261A1 (fr) * 2010-10-28 2012-05-03 Asetek A/S Système de refroidissement liquide pour un système électronique
US8358505B2 (en) 2010-10-28 2013-01-22 Asetek A/S Integrated liquid cooling system
US8432691B2 (en) 2010-10-28 2013-04-30 Asetek A/S Liquid cooling system for an electronic system
JP2020170779A (ja) * 2019-04-03 2020-10-15 株式会社日立パワーソリューションズ 冷却システム
CN111863748A (zh) * 2020-08-17 2020-10-30 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) 一体化微型冷却器及冷却系统
CN114087592A (zh) * 2021-11-18 2022-02-25 九江畔月照明电器有限责任公司 一种室内广角出光的照明灯具
CN119933223A (zh) * 2025-03-10 2025-05-06 徐州徐工挖掘机械有限公司 一种混动挖掘机热管理系统、控制方法及装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140315830A1 (en) 2011-11-14 2014-10-23 Kameda Seika Co., Ltd. Rice-protein composition and method for manufacturing same
KR101282780B1 (ko) 2012-01-05 2013-07-05 국방과학연구소 독립 다상 인버터의 냉각장치
JP6331771B2 (ja) 2014-06-28 2018-05-30 日本電産株式会社 ヒートモジュール
CN105611790B (zh) * 2015-11-02 2017-10-13 上海理工大学 封闭式喷雾冷却装置
JP7131312B2 (ja) 2018-11-07 2022-09-06 日本電産株式会社 冷却装置
CN119828404A (zh) 2020-05-29 2025-04-15 中强光电股份有限公司 散热系统与投影装置
JP7591733B2 (ja) * 2020-07-30 2024-11-29 パナソニックＩｐマネジメント株式会社 冷却装置およびそれを備えるプロジェクタ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261223A (ja) * 2001-03-02 2002-09-13 Sanyo Electric Co Ltd コールドプレートの連結構造及び連結方法
JP2004003816A (ja) * 2002-04-02 2004-01-08 Mitsubishi Electric Corp 熱輸送素子および熱輸送素子を用いた半導体装置および熱輸送素子を用いた大気圏外移動体
JP2004266247A (ja) * 2003-02-12 2004-09-24 Denso Corp 発熱性部品の冷却構造
JP2006173481A (ja) * 2004-12-17 2006-06-29 Fujitsu Ltd 電子機器
JP2007027340A (ja) * 2005-07-15 2007-02-01 Hitachi Ltd 電子機器用冷却装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261223A (ja) * 2001-03-02 2002-09-13 Sanyo Electric Co Ltd コールドプレートの連結構造及び連結方法
JP2004003816A (ja) * 2002-04-02 2004-01-08 Mitsubishi Electric Corp 熱輸送素子および熱輸送素子を用いた半導体装置および熱輸送素子を用いた大気圏外移動体
JP2004266247A (ja) * 2003-02-12 2004-09-24 Denso Corp 発熱性部品の冷却構造
JP2006173481A (ja) * 2004-12-17 2006-06-29 Fujitsu Ltd 電子機器
JP2007027340A (ja) * 2005-07-15 2007-02-01 Hitachi Ltd 電子機器用冷却装置

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010133642A (ja) * 2008-12-04 2010-06-17 Fujitsu Ltd ラジエータ、冷却ユニット、冷却システム及び電子機器
WO2012056261A1 (fr) * 2010-10-28 2012-05-03 Asetek A/S Système de refroidissement liquide pour un système électronique
US8358505B2 (en) 2010-10-28 2013-01-22 Asetek A/S Integrated liquid cooling system
US8432691B2 (en) 2010-10-28 2013-04-30 Asetek A/S Liquid cooling system for an electronic system
WO2011137774A1 (fr) * 2010-11-17 2011-11-10 华为技术有限公司 Centre de données de type conteneur
US8755184B2 (en) 2010-11-17 2014-06-17 Huawei Technologies Co., Ltd. Container data center
JP2020170779A (ja) * 2019-04-03 2020-10-15 株式会社日立パワーソリューションズ 冷却システム
CN111863748A (zh) * 2020-08-17 2020-10-30 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) 一体化微型冷却器及冷却系统
CN111863748B (zh) * 2020-08-17 2022-02-15 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) 一体化微型冷却器及冷却系统
CN114087592A (zh) * 2021-11-18 2022-02-25 九江畔月照明电器有限责任公司 一种室内广角出光的照明灯具
CN114087592B (zh) * 2021-11-18 2022-09-16 九江畔月照明电器有限责任公司 一种室内广角出光的照明灯具
CN119933223A (zh) * 2025-03-10 2025-05-06 徐州徐工挖掘机械有限公司 一种混动挖掘机热管理系统、控制方法及装置

Also Published As

Publication number Publication date
JP2010156467A (ja) 2010-07-15
TW200850137A (en) 2008-12-16

Similar Documents

Publication Publication Date Title
WO2008133101A1 (fr) Système de refroidissement
TW200611632A (en) Computer
CY1119116T1 (el) Συστηματα ενισχυμενης μεταφορας θερμοτητας για ψυξη θαλαμων και επιφανειων
WO2012009460A3 (fr) Systèmes et procédés de refroidissement d'équipement électronique
JO2898B1 (en) Cooling system
FR2924864B1 (fr) Module photovoltaique avec un echangeur thermique
WO2008076208A3 (fr) Dispositif de génération d'énergie thermoélectrique
WO2010127035A3 (fr) Améliorations apportées au refroidissement ou le concernant
EP4336127A3 (fr) Appareils et procédés pour système de chauffage et de refroidissement modulaire
WO2007130583A3 (fr) Système de refroidissement de liquide adaptable à radiateurs modulaires
GB2464046A (en) Computer device heat dissipation system
MY160141A (en) Self cooling heat exchanger
ATE504953T1 (de) Kombination aus einem wärmeerzeugungssystem und einem brennstoffzellensystem
CN205017766U (zh) 一种发射机水冷散热结构
US20110192572A1 (en) Heat exchanger
CN204612555U (zh) 换热装置及具有该换热装置的半导体制冷设备
WO2010057017A3 (fr) Système et méthode de gestion de température d'un composant thermique de fond
US9766668B2 (en) Forced and natural convection liquid cooler for personal computer
CN103249282A (zh) 一种热管水冷组合散热设备
WO2011038765A3 (fr) Système de refroidissement pour une machine électrique
WO2011002191A3 (fr) Système de génération d'énergie thermoélectrique utilisant la chaleur perdue d'un fluide de refroidissement
TR201908668T4 (tr) Isının taşınmasına yönelik bir cihaz ve yöntem.
US10303229B2 (en) Water-cooling heat dissipation module
US10088249B2 (en) Heat exchange device
CN201935520U (zh) 热交换机结构改良

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08740405

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08740405

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP