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TW200850137A - Cooling system - Google Patents

Cooling system Download PDF

Info

Publication number
TW200850137A
TW200850137A TW97113814A TW97113814A TW200850137A TW 200850137 A TW200850137 A TW 200850137A TW 97113814 A TW97113814 A TW 97113814A TW 97113814 A TW97113814 A TW 97113814A TW 200850137 A TW200850137 A TW 200850137A
Authority
TW
Taiwan
Prior art keywords
heat
cooling system
flow path
liquid cooling
pump
Prior art date
Application number
TW97113814A
Other languages
English (en)
Chinese (zh)
Inventor
Hitoshi Onishi
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of TW200850137A publication Critical patent/TW200850137A/zh

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/0246Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid heat-exchange elements having several adjacent conduits forming a whole, e.g. blocks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
TW97113814A 2007-04-20 2008-04-16 Cooling system TW200850137A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007112196A JP2010156467A (ja) 2007-04-20 2007-04-20 液冷システム

Publications (1)

Publication Number Publication Date
TW200850137A true TW200850137A (en) 2008-12-16

Family

ID=39925559

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97113814A TW200850137A (en) 2007-04-20 2008-04-16 Cooling system

Country Status (3)

Country Link
JP (1) JP2010156467A (fr)
TW (1) TW200850137A (fr)
WO (1) WO2008133101A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113741126A (zh) * 2020-05-29 2021-12-03 中强光电股份有限公司 散热系统与投影装置

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5531400B2 (ja) * 2008-12-04 2014-06-25 富士通株式会社 冷却ユニット、冷却システム及び電子機器
EP2633378A1 (fr) * 2010-10-28 2013-09-04 Asetek A/S Système de refroidissement liquide pour un système électronique
US8432691B2 (en) 2010-10-28 2013-04-30 Asetek A/S Liquid cooling system for an electronic system
US8358505B2 (en) 2010-10-28 2013-01-22 Asetek A/S Integrated liquid cooling system
CN102063166A (zh) 2010-11-17 2011-05-18 华为技术有限公司 集装箱式数据中心
JP5819981B2 (ja) 2011-11-14 2015-11-24 亀田製菓株式会社 米タンパク質組成物とその製造方法
KR101282780B1 (ko) 2012-01-05 2013-07-05 국방과학연구소 독립 다상 인버터의 냉각장치
JP6331771B2 (ja) 2014-06-28 2018-05-30 日本電産株式会社 ヒートモジュール
CN105611790B (zh) * 2015-11-02 2017-10-13 上海理工大学 封闭式喷雾冷却装置
JP7131312B2 (ja) 2018-11-07 2022-09-06 日本電産株式会社 冷却装置
JP6641050B1 (ja) * 2019-04-03 2020-02-05 株式会社日立パワーソリューションズ 冷却システム
JP7591733B2 (ja) * 2020-07-30 2024-11-29 パナソニックIpマネジメント株式会社 冷却装置およびそれを備えるプロジェクタ
CN111863748B (zh) * 2020-08-17 2022-02-15 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) 一体化微型冷却器及冷却系统
CN114087592B (zh) * 2021-11-18 2022-09-16 九江畔月照明电器有限责任公司 一种室内广角出光的照明灯具
CN119933223A (zh) * 2025-03-10 2025-05-06 徐州徐工挖掘机械有限公司 一种混动挖掘机热管理系统、控制方法及装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3773797B2 (ja) * 2001-03-02 2006-05-10 三洋電機株式会社 コールドプレートの連結構造及び連結方法
JP4123017B2 (ja) * 2002-04-02 2008-07-23 三菱電機株式会社 熱輸送素子および熱輸送素子を用いた半導体装置および熱輸送素子を用いた大気圏外移動体
JP2004266247A (ja) * 2003-02-12 2004-09-24 Denso Corp 発熱性部品の冷却構造
JP4201762B2 (ja) * 2004-12-17 2008-12-24 富士通株式会社 電子機器
JP4517962B2 (ja) * 2005-07-15 2010-08-04 株式会社日立製作所 電子機器用冷却装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113741126A (zh) * 2020-05-29 2021-12-03 中强光电股份有限公司 散热系统与投影装置
US12197113B2 (en) 2020-05-29 2025-01-14 Coretronic Corporation Heat dissipation system comprising a plurality of liquid cold plates and projection device
CN119828404A (zh) * 2020-05-29 2025-04-15 中强光电股份有限公司 散热系统与投影装置

Also Published As

Publication number Publication date
WO2008133101A1 (fr) 2008-11-06
JP2010156467A (ja) 2010-07-15

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