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WO2008126804A1 - レジスト下層膜形成組成物 - Google Patents

レジスト下層膜形成組成物 Download PDF

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Publication number
WO2008126804A1
WO2008126804A1 PCT/JP2008/056807 JP2008056807W WO2008126804A1 WO 2008126804 A1 WO2008126804 A1 WO 2008126804A1 JP 2008056807 W JP2008056807 W JP 2008056807W WO 2008126804 A1 WO2008126804 A1 WO 2008126804A1
Authority
WO
WIPO (PCT)
Prior art keywords
resist film
composition
optionally substituted
under
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/056807
Other languages
English (en)
French (fr)
Inventor
Takahiro Sakaguchi
Tetsuya Shinjo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Priority to KR1020097016316A priority Critical patent/KR101423059B1/ko
Priority to CN2008800098712A priority patent/CN101641644B/zh
Priority to JP2009509330A priority patent/JP5083573B2/ja
Priority to US12/450,599 priority patent/US8361694B2/en
Publication of WO2008126804A1 publication Critical patent/WO2008126804A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/092—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0276—Photolithographic processes using an anti-reflective coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Indole Compounds (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

【課題】基板上への塗布が容易であり、得られるレジスト下層膜がドライエッチング特性に優れた、フラーレン誘導体を含むレジスト下層膜形成組成物を提供することを課題とする。 【解決手段】　例えば、下記式（３）で表わされるフラーレン誘導体と有機溶媒を含むレジスト下層膜形成組成物を用いることによって、上記課題は解決される。 （式中、Ｒ4は、水素原子、置換基を有してもよいアルキル基、置換基を有してもよいアリール基及び置換基を有してもよい複素環基からなる群から選択される１種の基を表わし、Ｒ5は、置換基を有してもよいアルキル基又は置換基を有してもよいアリール基を表わす。）
PCT/JP2008/056807 2007-04-06 2008-04-04 レジスト下層膜形成組成物 Ceased WO2008126804A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020097016316A KR101423059B1 (ko) 2007-04-06 2008-04-04 레지스트 하층막 형성 조성물
CN2008800098712A CN101641644B (zh) 2007-04-06 2008-04-04 形成抗蚀剂下层膜的组合物
JP2009509330A JP5083573B2 (ja) 2007-04-06 2008-04-04 レジスト下層膜形成組成物
US12/450,599 US8361694B2 (en) 2007-04-06 2008-04-04 Resist underlayer film forming composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-100959 2007-04-06
JP2007100959 2007-04-06

Publications (1)

Publication Number Publication Date
WO2008126804A1 true WO2008126804A1 (ja) 2008-10-23

Family

ID=39863902

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056807 Ceased WO2008126804A1 (ja) 2007-04-06 2008-04-04 レジスト下層膜形成組成物

Country Status (6)

Country Link
US (1) US8361694B2 (ja)
JP (1) JP5083573B2 (ja)
KR (1) KR101423059B1 (ja)
CN (1) CN101641644B (ja)
TW (1) TW200905401A (ja)
WO (1) WO2008126804A1 (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110091479A (ko) * 2010-02-05 2011-08-11 신에쓰 가가꾸 고교 가부시끼가이샤 레지스트 하층막 재료, 레지스트 하층막 형성 방법, 패턴 형성 방법, 풀러렌 유도체
WO2011108365A1 (ja) * 2010-03-01 2011-09-09 日産化学工業株式会社 フラーレン誘導体を含むレジスト下層膜形成組成物
JP2011210952A (ja) * 2010-03-30 2011-10-20 Konica Minolta Holdings Inc 有機光電変換素子、太陽電池及び光センサアレイ
JP2015513786A (ja) * 2012-02-10 2015-05-14 ザ ユニバーシティ オブ バーミンガム スピンオンハードマスク材料
JP2015113301A (ja) * 2013-12-11 2015-06-22 株式会社リコー フラーレン誘導体およびその製造方法
WO2017094780A1 (ja) * 2015-12-01 2017-06-08 日産化学工業株式会社 インドロカルバゾールノボラック樹脂を含むレジスト下層膜形成組成物
JP2017186344A (ja) * 2013-05-16 2017-10-12 ダイキン工業株式会社 フラーレン誘導体、及びｎ型半導体材料
JP2017533464A (ja) * 2014-10-08 2017-11-09 アレックス フィリップ グラハム ロビンソンＡｌｅｘ Ｐｈｉｌｉｐ Ｇｒａｈａｍ ＲＯＢＩＮＳＯＮ スピンオンハードマスク材料
KR20170126967A (ko) 2015-03-11 2017-11-20 닛산 가가쿠 고교 가부시키 가이샤 레지스트 하층막의 형성방법
JP2019523985A (ja) * 2016-05-25 2019-08-29 アレックス フィリップ グラハム ロビンソンAlex Philip Graham ROBINSON ハードマスク組成物
JP2021515068A (ja) * 2018-02-25 2021-06-17 ロビンソン, アレックス, ピー.ジー.ROBINSON, Alex, P.G. ハードマスク組成物
EP4239408A1 (en) 2022-03-03 2023-09-06 Shin-Etsu Chemical Co., Ltd. Composition for forming organic film, patterning process, and compound

Families Citing this family (5)

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JP5395012B2 (ja) * 2010-08-23 2014-01-22 信越化学工業株式会社 レジスト下層膜材料、レジスト下層膜形成方法、パターン形成方法、フラーレン誘導体
JP5663440B2 (ja) * 2010-09-16 2015-02-04 富士フイルム株式会社 パターン形成方法、化学増幅型レジスト組成物、及び、レジスト膜
KR20160040466A (ko) * 2013-05-22 2016-04-14 알렉스 필립 그레이엄 로빈손 풀러렌
JP6165690B2 (ja) * 2014-08-22 2017-07-19 信越化学工業株式会社 有機膜形成用組成物の製造方法
KR102368068B1 (ko) 2015-08-24 2022-02-25 삼성전자주식회사 반도체 소자 제조용 조성물 및 이를 이용하는 반도체 소자의 제조 방법

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US20110195362A1 (en) * 2010-02-05 2011-08-11 Shin-Etsu Chemical Co., Ltd. Resist underlayer film composition, process for forming resist underlayer film, patterning process and fullerene derivative
JP2011164201A (ja) * 2010-02-05 2011-08-25 Shin-Etsu Chemical Co Ltd レジスト下層膜材料、レジスト下層膜形成方法、パターン形成方法、フラーレン誘導体
US8835092B2 (en) 2010-02-05 2014-09-16 Shin-Etsu Chemical Co., Ltd. Resist underlayer film composition, process for forming resist underlayer film, patterning process and fullerene derivative
KR101687838B1 (ko) * 2010-02-05 2016-12-19 신에쓰 가가꾸 고교 가부시끼가이샤 레지스트 하층막 재료, 레지스트 하층막 형성 방법, 패턴 형성 방법, 풀러렌 유도체
KR20110091479A (ko) * 2010-02-05 2011-08-11 신에쓰 가가꾸 고교 가부시끼가이샤 레지스트 하층막 재료, 레지스트 하층막 형성 방법, 패턴 형성 방법, 풀러렌 유도체
WO2011108365A1 (ja) * 2010-03-01 2011-09-09 日産化学工業株式会社 フラーレン誘導体を含むレジスト下層膜形成組成物
JP5757286B2 (ja) * 2010-03-01 2015-07-29 日産化学工業株式会社 フラーレン誘導体を含むレジスト下層膜形成組成物
JP2011210952A (ja) * 2010-03-30 2011-10-20 Konica Minolta Holdings Inc 有機光電変換素子、太陽電池及び光センサアレイ
JP2015513786A (ja) * 2012-02-10 2015-05-14 ザ ユニバーシティ オブ バーミンガム スピンオンハードマスク材料
JP2017186344A (ja) * 2013-05-16 2017-10-12 ダイキン工業株式会社 フラーレン誘導体、及びｎ型半導体材料
JP2015113301A (ja) * 2013-12-11 2015-06-22 株式会社リコー フラーレン誘導体およびその製造方法
JP2017533464A (ja) * 2014-10-08 2017-11-09 アレックス フィリップ グラハム ロビンソンＡｌｅｘ Ｐｈｉｌｉｐ Ｇｒａｈａｍ ＲＯＢＩＮＳＯＮ スピンオンハードマスク材料
US10551737B2 (en) 2015-03-11 2020-02-04 Nissan Chemical Industries, Ltd. Method for forming resist underlayer film
KR20170126967A (ko) 2015-03-11 2017-11-20 닛산 가가쿠 고교 가부시키 가이샤 레지스트 하층막의 형성방법
US11720024B2 (en) 2015-12-01 2023-08-08 Nissan Chemical Industries, Ltd. Resist underlayer film-forming composition containing indolocarbazole novolak resin
JPWO2017094780A1 (ja) * 2015-12-01 2018-10-18 日産化学株式会社 インドロカルバゾールノボラック樹脂を含むレジスト下層膜形成組成物
KR20180087331A (ko) * 2015-12-01 2018-08-01 닛산 가가쿠 고교 가부시키 가이샤 인돌로카바졸노볼락 수지를 포함하는 레지스트 하층막 형성 조성물
WO2017094780A1 (ja) * 2015-12-01 2017-06-08 日産化学工業株式会社 インドロカルバゾールノボラック樹脂を含むレジスト下層膜形成組成物
KR102634064B1 (ko) 2015-12-01 2024-02-07 닛산 가가쿠 가부시키가이샤 인돌로카바졸노볼락 수지를 포함하는 레지스트 하층막 형성 조성물
KR20240024284A (ko) * 2015-12-01 2024-02-23 닛산 가가쿠 가부시키가이샤 인돌로카바졸노볼락 수지를 포함하는 레지스트 하층막 형성 조성물
US12242196B2 (en) 2015-12-01 2025-03-04 Nissan Chemical Industries, Ltd. Resist underlayer film-forming composition containing indolocarbazole novolak resin
KR102820755B1 (ko) 2015-12-01 2025-06-12 닛산 가가쿠 가부시키가이샤 인돌로카바졸노볼락 수지를 포함하는 레지스트 하층막 형성 조성물
JP2019523985A (ja) * 2016-05-25 2019-08-29 アレックス フィリップ グラハム ロビンソンAlex Philip Graham ROBINSON ハードマスク組成物
JP7055106B2 (ja) 2016-05-25 2022-04-15 アレックス フィリップ グラハム ロビンソン ハードマスク組成物
JP2021515068A (ja) * 2018-02-25 2021-06-17 ロビンソン, アレックス, ピー.ジー.ROBINSON, Alex, P.G. ハードマスク組成物
JP7252244B2 (ja) 2018-02-25 2023-04-04 ロビンソン，アレックス，ピー．ジー． ハードマスク組成物
EP4239408A1 (en) 2022-03-03 2023-09-06 Shin-Etsu Chemical Co., Ltd. Composition for forming organic film, patterning process, and compound

Also Published As

Publication number Publication date
KR20100014377A (ko) 2010-02-10
US20100035181A1 (en) 2010-02-11
JP5083573B2 (ja) 2012-11-28
US8361694B2 (en) 2013-01-29
TW200905401A (en) 2009-02-01
CN101641644B (zh) 2012-07-04
JPWO2008126804A1 (ja) 2010-07-22
CN101641644A (zh) 2010-02-03
KR101423059B1 (ko) 2014-07-25

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