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WO2009005135A1 - エポキシ樹脂用硬化剤及びエポキシ樹脂用硬化剤組成物 - Google Patents

エポキシ樹脂用硬化剤及びエポキシ樹脂用硬化剤組成物 Download PDF

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Publication number
WO2009005135A1
WO2009005135A1 PCT/JP2008/062113 JP2008062113W WO2009005135A1 WO 2009005135 A1 WO2009005135 A1 WO 2009005135A1 JP 2008062113 W JP2008062113 W JP 2008062113W WO 2009005135 A1 WO2009005135 A1 WO 2009005135A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
curing agent
carbon atoms
optionally substituted
general formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/062113
Other languages
English (en)
French (fr)
Inventor
Yoshihiko Takada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Kasei Chemicals Corp
Original Assignee
Asahi Kasei Chemicals Corp
Asahi Kasei E Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corp, Asahi Kasei E Materials Corp filed Critical Asahi Kasei Chemicals Corp
Priority to JP2009521673A priority Critical patent/JP5138685B2/ja
Publication of WO2009005135A1 publication Critical patent/WO2009005135A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
    • C07D233/60—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms with hydrocarbon radicals, substituted by oxygen or sulfur atoms, attached to ring nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/64—Amino alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

　本発明においては、下記一般式（１）又は（２）で表されるエポキシ樹脂用硬化剤； 【化１】 　 【化２】 　 （式中、Ｒ１、Ｒ５は、水素原子、置換されていてもよい炭素数１～６のアルキル基又は置換されていてもよい炭素数１～１２のアリール基を示す。Ｒ２は、水素原子又は置換されていてもよい炭素数１～６のアルキル基を示す。Ｒ３及びＲ４は、それぞれ独立して、水素原子、下記一般式（３） 【化３】 　 （式中、Ｒ１及びＲ２は前記と同義を示す。） 又は、下記一般式（４） 【化４】 　 で表される基を示し、ｎは１～３の整数を示す。） を提供する。
PCT/JP2008/062113 2007-07-05 2008-07-03 エポキシ樹脂用硬化剤及びエポキシ樹脂用硬化剤組成物 Ceased WO2009005135A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009521673A JP5138685B2 (ja) 2007-07-05 2008-07-03 エポキシ樹脂用硬化剤及びエポキシ樹脂用硬化剤組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-177261 2007-07-05
JP2007177261 2007-07-05

Publications (1)

Publication Number Publication Date
WO2009005135A1 true WO2009005135A1 (ja) 2009-01-08

Family

ID=40226176

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062113 Ceased WO2009005135A1 (ja) 2007-07-05 2008-07-03 エポキシ樹脂用硬化剤及びエポキシ樹脂用硬化剤組成物

Country Status (3)

Country Link
JP (1) JP5138685B2 (ja)
TW (1) TW200916496A (ja)
WO (1) WO2009005135A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010122995A1 (ja) * 2009-04-24 2010-10-28 旭化成イーマテリアルズ株式会社 イミダゾール化合物含有マイクロカプセル化組成物、それを用いた硬化性組成物及びマスターバッチ型硬化剤
JP2013095876A (ja) * 2011-11-02 2013-05-20 Asahi Kasei E-Materials Corp 硬化剤、マイクロカプセル型硬化剤、マスターバッチ型硬化剤組成物、一液性エポキシ樹脂組成物および加工品
KR20140065420A (ko) * 2011-09-20 2014-05-29 헨켈 아게 운트 코. 카게아아 은-코팅된 입자를 포함하는 전기 전도성 접착제
KR20190016303A (ko) * 2017-08-08 2019-02-18 주식회사 케이씨씨 양이온성 우레탄 경화제 및 이를 포함하는 전착 도료 조성물
CN112500821A (zh) * 2020-12-29 2021-03-16 烟台信友新材料有限公司 一种紫外光固化可变操作时间单组份环氧胶及其制备方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406925B (zh) * 2010-09-14 2013-09-01 Zhen Ding Technology Co Ltd 電路板基板及其製作方法
TWI582370B (zh) * 2015-03-17 2017-05-11 Method for Making High Thermal Conductivity Elements

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06207152A (ja) * 1992-10-02 1994-07-26 W R Grace & Co 低粘度無溶媒の一液型エポキシ樹脂接着性組成物
JPH09175848A (ja) * 1995-10-24 1997-07-08 Asahi Chem Ind Co Ltd セメント成形体用組成物
JP2000080146A (ja) * 1998-09-03 2000-03-21 Asahi Chem Ind Co Ltd エポキシ系樹脂組成物
JP2002088137A (ja) * 2000-09-14 2002-03-27 Sanwa Chemical Industry Co Ltd エポキシ樹脂用低温硬化型潜在性硬化剤
JP2004292737A (ja) * 2003-03-28 2004-10-21 Asahi Denka Kogyo Kk エポキシ樹脂用硬化剤組成物
WO2007037378A1 (ja) * 2005-09-29 2007-04-05 Asahi Kasei Chemicals Corporation 高安定性マイクロカプセル型エポキシ樹脂用硬化剤及びエポキシ樹脂組成物
WO2007088889A1 (ja) * 2006-02-03 2007-08-09 Asahi Kasei Chemicals Corporation マイクロカプセル型エポキシ樹脂用硬化剤、マスタ－バッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH041219A (ja) * 1990-04-19 1992-01-06 Toyama Pref Gov 一液型熱硬化性組成物
JP3270775B2 (ja) * 1992-01-24 2002-04-02 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション 改良されたエポキシ樹脂用潜在性硬化剤及びその製造方法
JPH06184274A (ja) * 1992-12-16 1994-07-05 Fuji Kasei Kogyo Kk 一成分系加熱硬化性エポキシド組成物
JP3562323B2 (ja) * 1998-07-09 2004-09-08 株式会社スリーボンド 熱硬化型導電性接着剤

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06207152A (ja) * 1992-10-02 1994-07-26 W R Grace & Co 低粘度無溶媒の一液型エポキシ樹脂接着性組成物
JPH09175848A (ja) * 1995-10-24 1997-07-08 Asahi Chem Ind Co Ltd セメント成形体用組成物
JP2000080146A (ja) * 1998-09-03 2000-03-21 Asahi Chem Ind Co Ltd エポキシ系樹脂組成物
JP2002088137A (ja) * 2000-09-14 2002-03-27 Sanwa Chemical Industry Co Ltd エポキシ樹脂用低温硬化型潜在性硬化剤
JP2004292737A (ja) * 2003-03-28 2004-10-21 Asahi Denka Kogyo Kk エポキシ樹脂用硬化剤組成物
WO2007037378A1 (ja) * 2005-09-29 2007-04-05 Asahi Kasei Chemicals Corporation 高安定性マイクロカプセル型エポキシ樹脂用硬化剤及びエポキシ樹脂組成物
WO2007088889A1 (ja) * 2006-02-03 2007-08-09 Asahi Kasei Chemicals Corporation マイクロカプセル型エポキシ樹脂用硬化剤、マスタ－バッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010122995A1 (ja) * 2009-04-24 2010-10-28 旭化成イーマテリアルズ株式会社 イミダゾール化合物含有マイクロカプセル化組成物、それを用いた硬化性組成物及びマスターバッチ型硬化剤
JP5763527B2 (ja) * 2009-04-24 2015-08-12 旭化成イーマテリアルズ株式会社 イミダゾール化合物含有マイクロカプセル化組成物、それを用いた硬化性組成物及びマスターバッチ型硬化剤
KR20140065420A (ko) * 2011-09-20 2014-05-29 헨켈 아게 운트 코. 카게아아 은-코팅된 입자를 포함하는 전기 전도성 접착제
JP2014531495A (ja) * 2011-09-20 2014-11-27 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ．ＫＧａＡ 銀被覆粒子含有導電性接着剤
US9770886B2 (en) 2011-09-20 2017-09-26 Henkel Ag & Co. Kgaa Electrically conductive adhesives comprising silver-coated particles
KR102009534B1 (ko) * 2011-09-20 2019-08-09 헨켈 아게 운트 코. 카게아아 은-코팅된 입자를 포함하는 전기 전도성 접착제
JP2013095876A (ja) * 2011-11-02 2013-05-20 Asahi Kasei E-Materials Corp 硬化剤、マイクロカプセル型硬化剤、マスターバッチ型硬化剤組成物、一液性エポキシ樹脂組成物および加工品
KR20190016303A (ko) * 2017-08-08 2019-02-18 주식회사 케이씨씨 양이온성 우레탄 경화제 및 이를 포함하는 전착 도료 조성물
KR102042239B1 (ko) 2017-08-08 2019-11-08 주식회사 케이씨씨 양이온성 우레탄 경화제 및 이를 포함하는 전착 도료 조성물
CN112500821A (zh) * 2020-12-29 2021-03-16 烟台信友新材料有限公司 一种紫外光固化可变操作时间单组份环氧胶及其制备方法

Also Published As

Publication number Publication date
TWI370823B (ja) 2012-08-21
TW200916496A (en) 2009-04-16
JP5138685B2 (ja) 2013-02-06
JPWO2009005135A1 (ja) 2010-08-26

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