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WO2008126411A1 - エポキシ樹脂組成物、プリプレグ、積層板、多層プリント配線板、半導体装置、絶縁樹脂シート、多層プリント配線板の製造方法 - Google Patents

エポキシ樹脂組成物、プリプレグ、積層板、多層プリント配線板、半導体装置、絶縁樹脂シート、多層プリント配線板の製造方法 Download PDF

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Publication number
WO2008126411A1
WO2008126411A1 PCT/JP2008/000914 JP2008000914W WO2008126411A1 WO 2008126411 A1 WO2008126411 A1 WO 2008126411A1 JP 2008000914 W JP2008000914 W JP 2008000914W WO 2008126411 A1 WO2008126411 A1 WO 2008126411A1
Authority
WO
WIPO (PCT)
Prior art keywords
group
wiring board
printed wiring
multilayer printed
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/000914
Other languages
English (en)
French (fr)
Inventor
Tadasuke Endo
Akihito Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to KR1020097023101A priority Critical patent/KR101141902B1/ko
Priority to JP2009508917A priority patent/JP5493853B2/ja
Priority to CN2008800116053A priority patent/CN101652401B/zh
Priority to US12/531,308 priority patent/US8465837B2/en
Publication of WO2008126411A1 publication Critical patent/WO2008126411A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/32—Modified amine-aldehyde condensates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)

Abstract

下記一般式（１）で表される構造を有する（Ａ）エポキシ樹脂、（Ｂ）硬化剤、及び（Ｃ）無機充填材、（Ｄ）シアネート樹脂および／またはそのプレポリマーを必須成分とするエポキシ樹脂組成物。 [式中　Ａｒは縮合環芳香族炭化水素基を示し、ｒは１以上の整数である。Ｘは水素、またはエポキシ基（グリシジルエーテル基）を、Ｒ１は、水素、メチル基、エチル基、プロピル基、ブチル基、フェニル基、およびベンジル基の中から選択される１種を表す。ｎは１以上の整数であり、ｐ、ｑは１以上の整数であり、またｐ、ｑの値は、繰り返し単位毎に同一でも、異なっていてもよい。] 【化１】
PCT/JP2008/000914 2007-04-10 2008-04-09 エポキシ樹脂組成物、プリプレグ、積層板、多層プリント配線板、半導体装置、絶縁樹脂シート、多層プリント配線板の製造方法 Ceased WO2008126411A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020097023101A KR101141902B1 (ko) 2007-04-10 2008-04-09 에폭시 수지 조성물, 프리프레그, 적층판, 다층 프린트 배선판, 반도체 장치, 절연 수지 시트, 다층 프린트 배선판의 제조 방법
JP2009508917A JP5493853B2 (ja) 2007-04-10 2008-04-09 エポキシ樹脂組成物、プリプレグ、積層板、多層プリント配線板、半導体装置、絶縁樹脂シート、多層プリント配線板の製造方法
CN2008800116053A CN101652401B (zh) 2007-04-10 2008-04-09 环氧树脂组合物、预浸料坯、层叠板、多层印刷线路板、半导体器件、绝缘树脂片、和制造多层印刷线路板的方法
US12/531,308 US8465837B2 (en) 2007-04-10 2008-04-09 Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-103104 2007-04-10
JP2007103104 2007-04-10
JP2007-279234 2007-10-26
JP2007279234 2007-10-26

Publications (1)

Publication Number Publication Date
WO2008126411A1 true WO2008126411A1 (ja) 2008-10-23

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PCT/JP2008/000914 Ceased WO2008126411A1 (ja) 2007-04-10 2008-04-09 エポキシ樹脂組成物、プリプレグ、積層板、多層プリント配線板、半導体装置、絶縁樹脂シート、多層プリント配線板の製造方法

Country Status (7)

Country Link
US (1) US8465837B2 (ja)
JP (1) JP5493853B2 (ja)
KR (1) KR101141902B1 (ja)
CN (1) CN101652401B (ja)
MY (1) MY150705A (ja)
TW (1) TWI453228B (ja)
WO (1) WO2008126411A1 (ja)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010050472A1 (ja) * 2008-10-29 2010-05-06 住友ベークライト株式会社 樹脂組成物、樹脂シート、プリプレグ、積層板、多層プリント配線板、及び半導体装置
WO2010074085A1 (ja) * 2008-12-25 2010-07-01 住友ベークライト株式会社 樹脂組成物、プリプレグ、樹脂シート、金属張積層板、プリント配線板、多層プリント配線板、及び半導体装置
JP2010221706A (ja) * 2009-02-27 2010-10-07 Hitachi Chem Co Ltd 絶縁性樹脂フィルム及びそれを用いた積層板、配線板
JP2010278414A (ja) * 2009-04-27 2010-12-09 Shin-Etsu Chemical Co Ltd 配線板用材料、積層板、多層板及び配線基板
WO2011010672A1 (ja) * 2009-07-24 2011-01-27 住友ベークライト株式会社 樹脂組成物、樹脂シート、プリプレグ、金属張積層板、プリント配線板及び半導体装置
JP2011026419A (ja) * 2009-07-24 2011-02-10 Sumitomo Bakelite Co Ltd 樹脂組成物、プリプレグ、積層板、多層プリント配線および半導体装置
WO2011033739A1 (ja) * 2009-09-15 2011-03-24 太陽ホールディングス株式会社 熱硬化性樹脂組成物
JP2011105898A (ja) * 2009-11-20 2011-06-02 Sumitomo Bakelite Co Ltd シリコーンゴム微粒子含有エポキシ樹脂組成物、プリプレグ、金属張積層板、プリント配線板及び半導体装置
JP2011105911A (ja) * 2009-11-20 2011-06-02 Sumitomo Bakelite Co Ltd シリコーンゴム微粒子含有エポキシ樹脂組成物、プリプレグ、金属張積層板、プリント配線板及び半導体装置
JP2012012555A (ja) * 2010-07-05 2012-01-19 Sumitomo Bakelite Co Ltd 樹脂組成物、プリプレグ、樹脂層、回路基板および半導体装置
JP2012041386A (ja) * 2010-08-12 2012-03-01 Sumitomo Bakelite Co Ltd 回路基板用熱硬化性樹脂組成物
CN102421834A (zh) * 2009-05-15 2012-04-18 罗伯特·博世有限公司 塑料模塑料及其制备方法
JP2012116941A (ja) * 2010-11-30 2012-06-21 Sumitomo Bakelite Co Ltd 樹脂ワニス、プリプレグ、金属張積層板、プリント配線板及び半導体装置
WO2013008684A1 (ja) * 2011-07-14 2013-01-17 三菱瓦斯化学株式会社 プリント配線板用樹脂組成物
US20130105200A1 (en) * 2010-07-01 2013-05-02 Sumitomo Bakelite Co., Ltd. Prepreg, wiring board, and semiconductor device
WO2013115069A1 (ja) * 2012-01-31 2013-08-08 三菱瓦斯化学株式会社 プリント配線板材料用樹脂組成物、並びにそれを用いたプリプレグ、樹脂シート、金属箔張積層板及びプリント配線板
WO2015182581A1 (ja) * 2014-05-29 2015-12-03 アーゼット・エレクトロニック・マテリアルズ（ルクセンブルグ） ソシエテ・ア・レスポンサビリテ・リミテ 空隙形成用組成物、その組成物を用いて形成された空隙を具備した半導体装置、およびその組成物を用いた半導体装置の製造方法
JP2015232066A (ja) * 2014-06-09 2015-12-24 日立化成株式会社 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及びプリント配線板
US9775238B2 (en) 2011-11-07 2017-09-26 Mitsubishi Gas Chemical Company, Inc. Resin composition, and prepreg and laminate using the same
JP2018070687A (ja) * 2016-10-25 2018-05-10 日東シンコー株式会社 エポキシ樹脂組成物、絶縁シート、及び、半導体モジュール
JP7442255B2 (ja) 2016-12-06 2024-03-04 三菱瓦斯化学株式会社 電子材料用樹脂組成物

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JP5533657B2 (ja) * 2008-09-26 2014-06-25 住友ベークライト株式会社 積層板、回路板および半導体装置
JP5136573B2 (ja) 2009-02-24 2013-02-06 日立化成工業株式会社 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板
EP2578631B1 (en) * 2010-06-02 2017-09-20 Mitsubishi Gas Chemical Company, Inc. Resin composition, and prepreg and laminated sheet using same
CN102321447B (zh) * 2011-07-26 2013-03-20 广东生益科技股份有限公司 高耐热增韧环氧树脂组合物及其在粘结片和覆铜板中的应用
US8440503B1 (en) * 2011-11-16 2013-05-14 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for performing reflow in bonding processes
TWI526493B (zh) * 2012-09-10 2016-03-21 台燿科技股份有限公司 樹脂組合物及其應用
US8853002B2 (en) 2013-01-04 2014-10-07 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for metal bump die assembly
JP6209843B2 (ja) * 2013-03-29 2017-10-11 住友電気工業株式会社 半導体変調器を作製する方法、半導体変調器
KR102157499B1 (ko) * 2013-06-18 2020-09-18 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 수지 시트 및 금속박 피복 적층판
JP6236947B2 (ja) * 2013-07-16 2017-11-29 住友電気工業株式会社 半導体光素子を製造する方法、および半導体光素子
US9209149B2 (en) 2013-11-14 2015-12-08 Taiwan Semiconductor Manufacturing Company, Ltd. Bump-on-trace structures with high assembly yield
KR102231098B1 (ko) * 2014-02-24 2021-03-23 삼성전기주식회사 동박적층판의 제조방법
US9526185B2 (en) * 2014-04-08 2016-12-20 Finisar Corporation Hybrid PCB with multi-unreinforced laminate
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CN101652401B (zh) 2012-09-05
JPWO2008126411A1 (ja) 2010-07-22
US8465837B2 (en) 2013-06-18
US20100227170A1 (en) 2010-09-09
TW200906887A (en) 2009-02-16

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