WO2017038603A1 - 繊維強化プラスチック用樹脂組成物、その硬化物、該硬化物を含有する繊維強化プラスチック、及び該繊維強化プラスチックの製造方法 - Google Patents
繊維強化プラスチック用樹脂組成物、その硬化物、該硬化物を含有する繊維強化プラスチック、及び該繊維強化プラスチックの製造方法 Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/046—Reinforcing macromolecular compounds with loose or coherent fibrous material with synthetic macromolecular fibrous material
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4028—Isocyanates; Thioisocyanates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/28—Treatment by wave energy or particle radiation
Definitions
- the present invention relates to a resin composition for fiber-reinforced plastic, a cured product thereof, and a fiber-reinforced plastic using the composition, and in particular, an epoxy resin excellent in flexibility, a cyanate resin, and an aromatic amine as a curing agent.
- Used resin composition having good impregnation into reinforced fiber and excellent in quick curing property and high strength property, fiber reinforced plastic containing cured product of the composition, and production of fiber reinforced plastic Regarding the method.
- a method of making a molded product using a thermosetting epoxy resin, an unsaturated polyester, a polyamide resin, or a phenol resin as a reinforcing material for a fiber material such as carbon fiber or glass fiber is well known.
- Fiber reinforced plastics using this method are widely used in structural materials such as aircraft and ships, and sporting goods such as tennis rackets and golf clubs.
- Epoxy resins used as reinforcing materials are often used as well-balanced materials because they are not only excellent in adhesion, heat resistance, and chemical resistance, but are inexpensive.
- the epoxy resin composition has excellent electrical performance and adhesive strength, but if sufficient heat resistance cannot be obtained even if an existing epoxy resin is used, the epoxy resin is further mixed with a cyanate resin.
- High heat-resistant cyanate-epoxy composite resin compositions are widely used for molding applications such as semiconductor sealing materials or electronic circuit boards.
- Cyanate-epoxy is excellent in storage stability and curability by curing with a latent curing agent obtained by reacting an epoxy compound with a polyamine compound, and is suitable for semiconductor sealants and adhesives.
- a method for producing a composite resin composition is also known (for example, Patent Document 2).
- Patent Document 2 A method for producing a composite resin composition.
- a powdery latent curing agent is used, when applied to a fiber material, the curing agent cannot penetrate into the inside of the fiber, and there is a drawback that poor curing occurs.
- a composition obtained by adding a light-absorbing component together with a latent curing agent obtained by reacting a polyamine and an epoxy resin is irradiated with a laser beam.
- An adhesive that can join resin materials in time is known (for example, Patent Document 3).
- This method is a method in which a laser beam is transmitted to the inside of the adhesive by using a resin material having optical transparency, so that bonding can be performed in a short time compared to conventional thermosetting.
- the latent curing agent used as a curing agent and the light-absorbing component are in the form of a solid powder, so that the latent curing agent and the light-absorbing component penetrate into the fiber. There was a defect that the resin remained on the surface and the resin inside the fiber was insufficiently cured.
- a first object of the present invention is to provide a resin composition having a high elongation displacement and excellent heat resistance and flexibility, which is suitable for improving the strength of a fiber material.
- the second object of the present invention is to provide a fiber reinforced plastic excellent in heat resistance and strength.
- a third object of the present invention is to provide a method for producing a fiber reinforced plastic by curing the resin composition in a short time.
- the inventors of the present invention diligently studied to achieve the above-mentioned objects, and by combining a specific epoxy resin having a polyalkylene ether structure, a cyanate resin, and a liquid aromatic amine-based curing agent, it can be easily performed between fibers.
- a fiber reinforced resin composition excellent in heat resistance and flexibility can be impregnated with the active energy ray-absorbing component excellent in compatibility with the epoxy resin.
- the inventors have found that a fiber-reinforced plastic can be produced in a short time by irradiating with active energy rays, and have reached the present invention.
- this invention is a resin composition containing an epoxy resin (A), a cyanate resin (B), and an aromatic amine-based curing agent (C) that is liquid at 25 ° C.
- ⁇ 100 mass% is an epoxy compound represented by the following general formula (1), a resin composition for fiber-reinforced plastic, and a cured product obtained by curing the composition containing the resin composition
- a high-strength fiber reinforced plastic containing the cured product and reinforcing fibers uniformly, and a method for producing the high-strength fiber reinforced plastic.
- a and b in the above formula (1) are each independently an integer of 2 to 10
- c is an integer of 0 to 3
- R 1 and R 2 are each independently an integer of 2 to 5 represents a divalent hydrocarbon group
- R 3 represents a single bond, a methylene group, or —C (CH 3 ) 2 —.
- the composition of this invention contains an active energy ray absorptive component further as (D) component from a viewpoint of manufacturing a fiber reinforced plastic in a short time.
- the epoxy resin (A) is preferably a dicyclopentadiene type epoxy resin from the viewpoint of improving the adhesion of the cured product to the fiber.
- the cyanate resin (B) comprises at least one selected from the group consisting of compounds represented by the following general formulas (2-1) to (2-3) and prepolymers thereof, The amount of the cyanate resin (B) used is preferably 50 to 120 parts by mass with respect to 100 parts by mass of the total amount of epoxy compounds having an epoxy group in the resin composition.
- the aromatic amine curing agent (C) which is liquid at 25 ° C. is preferably at least one compound selected from diaminodiphenylmethane, diaminodiethyldiphenylmethane, and diaminodiethyltoluene, and the amount used is a resin composition.
- the amount is preferably 40 to 90 parts by mass relative to 100 parts by mass of the total amount of epoxy compounds having epoxy groups therein.
- a silane coupling agent is further included from the viewpoint of improving the adhesion of the cured product to the fiber, and the amount used is an epoxy compound having an epoxy group in the resin composition.
- the total amount is preferably 7 to 20 parts by mass.
- the component is preferably a nigrosine compound, and the amount used is 0.001 to 1 mass relative to the total amount of the resin composition. % Is preferred.
- the active energy ray used in this case is preferably laser light and / or infrared light.
- the resin composition of the present invention is not only excellent in heat resistance, but also has a good adhesion to fibers when applied to a fiber material because the cured product has high elongation displacement and good flexibility. Therefore, by applying the resin composition of the present invention to fibers, the fiber reinforced plastic of the present invention having excellent heat resistance and strength can be easily obtained.
- the composition of the present invention that can be cured by irradiation with active energy rays can provide a fiber-reinforced plastic having the above-mentioned performance in a very short time compared to a conventional method by thermal curing.
- the epoxy resin (A) used in the present invention needs to contain at least 20% by mass of an epoxy compound represented by the following general formula (1).
- a and b in the above formula (1) are each independently an integer of 2 to 10
- c is an integer of 0 to 3
- R 1 and R 2 are each independently an integer of 2 to 5 represents a divalent hydrocarbon group
- R 3 represents a single bond, a methylene group, or —C (CH 3 ) 2 —.
- the amount of the compound represented by the above formula (1) is 20 to 100% by mass of the epoxy resin (A), but in order to further improve the tensile stress of the cured product, it should be 30 to 80% by mass. It is preferably 40 to 60% by mass. When the amount is less than 20% by mass, the strength of the cured product is not adversely affected, but the elongation displacement is not increased, so that the toughness of the cured product is significantly reduced.
- the cured product obtained by reacting the compound represented by the formula (1) or the epoxy resin containing the compound represented by the formula (1) with a curing agent or the like cures only a bisphenol type epoxy resin. Compared with the cured product obtained, it has physical properties that are large in displacement and rich in flexibility. Therefore, even when used in combination with a fiber material, it can follow the elongation of the fiber, thereby increasing the strength. A fiber reinforced plastic can be obtained.
- the compounding amount of the compound represented by the above formula (1) is particularly selected from the epoxy resin (A). It is preferably 40 to 95% by mass, and more preferably 60 to 90% by mass. When the amount is less than 20% by mass, the cured product cannot follow the elongation of the fiber material and peels off from the fiber material, so that the tensile strength of the resulting fiber reinforced plastic is significantly reduced.
- a and b in the formula (1) each independently represents an integer of 2 to 10.
- the average value of a and the average value of b are each independently preferably a number of 3 to 7, and more preferably a number of 4 to 6, from the viewpoint of the crosslinking density of the cured product.
- the average values of a and b are each independently smaller than 2, the crosslink density of the cured product is excessively increased, and the flexibility is significantly lowered.
- the average values of a and b are both greater than 10, the crosslink density of the cured product is lowered, so that the strength of the cured product is significantly reduced.
- C in the formula (1) represents an integer of 0 to 3.
- the average value of c is preferably a number from 0 to 2, more preferably a number from 0 to 1, from the viewpoint of workability during use. When the average value of c is larger than 3, the viscosity of the resin increases, so that workability is lowered.
- R 1 and R 2 in the formula (1) are each independently preferably a divalent hydrocarbon group having 2 to 4 carbon atoms from the viewpoint of easy availability of raw materials, A propylene group is particularly preferred.
- the method for producing the compound represented by the formula (1) used in the present invention is not particularly limited.
- a compound having two phenolic hydroxyl groups such as bisphenol A, bisphenol F, or biphenol
- at least 2 equivalents relative to 1 equivalent of the phenolic hydroxyl group of the compound Of the alkylene oxide is added using a catalyst if necessary.
- the resulting alkylene oxide adduct can be reacted with epichlorohydrin using a catalyst and / or a solvent, if necessary, to obtain the compound represented by the formula (1).
- alkylene oxide examples include ethylene oxide, 1,2-propylene oxide, 1,2-butylene oxide, 1,2-pentylene oxide and the like.
- R 1 and R 2 in the formula (1) are propylene groups.
- the amount of alkylene oxide used is, for example, 2 equivalents of alkylene oxide to 1 equivalent of phenolic hydroxyl group, the average values of a and b represented by the formula (1) are theoretical values, respectively. It becomes 2.
- the catalyst used for adding the above-described alkylene oxide includes an acid catalyst or an alkali catalyst.
- the acid catalyst include Bronsted acids such as sulfuric acid and phosphoric acid, and Lewis acids such as varnished chloride and boron trifluoride.
- Alkali catalysts include tertiary amines, alkali metals such as sodium hydroxide, potassium hydroxide, ammonium hydroxide, calcium hydroxide, and barium hydroxide, alkaline earth metals, or quaternary ammonium hydroxides, potassium carbonate. And alkali metal carbonates such as sodium carbonate.
- an alkali catalyst more preferably an alkali metal or alkaline earth metal hydroxide, and alkali metal water. Most preferably, an oxide is used. These catalysts may be used alone or in combination of two or more.
- Examples of the catalyst used for reacting the epichlorohydrin include phase transfer catalysts such as tetrabutylammonium salt, trioctylmethylammonium salt, and benzyldimethyloctadecylammonium salt in addition to those used when adding the alkylene oxide. Can be mentioned. Among these, from the viewpoint that the purification step after completion of the reaction is simple, it is preferable to use an alkali catalyst in the present invention, more preferably an alkali metal or alkaline earth metal hydroxide, Most preferably, a metal hydroxide is used. These catalysts may be used alone or in combination of two or more.
- Examples of the solvent used for reacting the epichlorohydrin include ketone solvents such as acetone and methyl ethyl ketone, alcohol solvents such as methanol, ethanol, 1-propyl alcohol, isopropyl alcohol, 1-butanol, secondary butanol, and tertiary butanol.
- Cellosolve solvents such as methyl cellosolve and ethyl cellosolve
- ether solvents such as tetrahydrofuran, 1,4-dioxane, 1,3-dioxane and diethoxyethane
- aprotic polar solvents such as acetonitrile, dimethylsulfoxide and dimethylformamide It is done.
- These organic solvents may be used alone or in combination of two or more.
- the amount of epichlorohydrin used in the reaction of the above-mentioned alkylene oxide adduct with epichlorohydrin is 1 to 10 equivalents per 1 equivalent of the hydroxyl group of the alkylene oxide adduct, and after the reaction is completed, excess epichlorohydrin is distilled off.
- the epoxy compound represented by the said Formula (1) can be obtained.
- the closer to 10 equivalents of epichlorohydrin used the closer the average value of c represented by the formula (1) tends to 0, and the closer to 1 equivalent of epichlorohydrin to be used, the average value of c becomes 3. Tend to rise.
- epoxy resin (A) other epoxy compounds other than the epoxy compound represented by the formula (1) can be used in combination as appropriate.
- the molecular structure, molecular weight, and the like of the other epoxy compound used in this case are not particularly limited, and can be appropriately selected from known epoxy resins having at least two epoxy groups in the molecule.
- Examples of the other epoxy compounds include bisphenol type epoxy resins such as bisphenol A type epoxy resin and bisphenol F type epoxy resin; biphenyl type epoxy resins such as biphenyl type epoxy resin and tetramethylbiphenyl type epoxy resin; dicyclopentadiene type.
- Epoxy resin Naphthalene type epoxy resin; Cycloaliphatic epoxy resin obtained from cyclohexanedimethanol, hydrogenated bisphenol A, etc .; N, N-diglycidylaniline, bis (4- (N-methyl-N-glycidylamino) phenyl) Epoxy compounds having a glycidylamino group such as methane and diglycidyl orthotoluidine; vinylcyclohexene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3, Epoxy products of cyclic olefin compounds such as epoxy-6-methylcyclohexylmethyl-6-methylcyclohexanecarboxylate and bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate; both epoxidized polybutadiene and epoxidized styrene-butadiene Examples thereof include epoxidized conjugated
- the present invention it is preferable to use a bisphenol A type epoxy resin and / or a bisphenol F type epoxy resin because they can be obtained at low cost.
- a dicyclopentadiene type epoxy resin when using the resin composition of this invention combining with a fiber material, since the adhesiveness of the hardened
- the amount of the dicyclopentadiene type epoxy resin used is preferably 0.1 to 30% by mass, more preferably 3 to 15% by mass in the epoxy resin of the component (A).
- the epoxy equivalent of the epoxy resin (A) used in the present invention is preferably 70 to 3000, and more preferably 100 to 2000. Those having an epoxy equivalent of less than 70 are difficult to obtain and difficult to use. When the epoxy equivalent is larger than 3000, the crosslinking density of the resin composition is lowered, and thus the tendency of the physical properties to decrease is remarkable.
- a reactive diluent may be used in combination to adjust the viscosity to a desired value.
- a reactive diluent the reactivity which has at least one epoxy group from a viewpoint of suppressing the fall of the heat resistance of a hardened
- Examples of the reactive diluent having one epoxy group include n-butyl glycidyl ether, C 12 to C 14 alkyl glycidyl ether, allyl glycidyl ether, 2-ethylhexyl glycidyl ether, styrene oxide, phenyl glycidyl ether, Examples include cresyl glycidyl ether, p-sec-butylphenyl glycidyl ether, t-butylphenyl glycidyl ether, glycidyl methacrylate, and tertiary carboxylic acid glycidyl ester.
- Examples of the reactive diluent having two epoxy groups include ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, and neopentyl glycol diester. A glycidyl ether etc. are mentioned. Examples of the reactive diluent having 3 epoxy groups include trimethylolpropane triglycidyl ether and glycerin triglycidyl ether.
- the molecular structure and molecular weight of the cyanate resin (B) used in the present invention are not particularly limited, and can be appropriately selected from known cyanate resins. In the present invention, those having at least two cyanate groups (OCN) in the molecule are particularly preferred.
- compounds represented by the following general formulas (2-1) to (2-2), Polymers In the above formula (2-1), R a represents a divalent hydrocarbon group, and R b and R c each independently represents a phenylene group which is unsubstituted or substituted with 1 to 4 alkyl groups.
- n represents an integer of 1 to 10
- R d is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
- R e is a single bond, a methylene group, —CH (CH 3 ) —, —C (CH 3 ) 2 —, or any one of the following general formulas (3-1) to (3-8) Wherein R f , R g , R h and R i each independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
- n in the above formula (3-3) represents an integer of 4 to 12.
- the amount of the cyanate resin (B) used in the present invention is preferably 10 to 200 parts by mass, and preferably 30 to 150 parts by mass with respect to 100 parts by mass of the total amount of epoxy compounds containing epoxy groups used in the present invention. More preferably, it is most preferably 50 to 120 parts by mass. When the amount is less than 10 parts by mass, the strength of the resin composition is not improved. When the amount is more than 200 parts by mass, the tendency of the adhesiveness of the resin composition to the base material to decrease is significant.
- the liquid aromatic amine-based curing agent (C) used in the present invention needs to be liquid at 25 ° C. so that it can easily penetrate into the fiber material.
- the aromatic ring has an amino group directly. It is a compound.
- examples of such compounds include metaphenylenediamine, diaminodiphenylmethane, diaminodimethyldiphenylmethane, diaminodiethyldiphenylmethane, diaminodiethyltoluene, 1-methyl-3,5-bis (methylthio) -2,4-benzenediamine, 1- And methyl-3,5-bis (methylthio) -2,6-benzenediamine.
- diaminodiphenylmethane, diaminodiethyldiphenylmethane, or diaminodiethyltoluene is preferable, and diaminodiethyldiphenylmethane is more preferable.
- the blending amount of the aromatic amine curing agent (C) in the present invention is preferably 20 to 100 parts by mass, and preferably 40 to 90 parts by mass with respect to 100 parts by mass of the total amount of compounds having an epoxy group. More preferred. When the amount is less than 20 parts by mass or more than 90 parts by mass, the epoxy resin composition is hardly completely cured.
- the resin composition of the present invention can be cured by heating.
- the curing time can be shortened by irradiating the active energy rays. .
- the working time is shortened, and it is not only economical because it cures with less energy than in the case of heat curing, but it is also advantageous in terms of the environment.
- the active energy ray includes electron beam, ultraviolet ray, infrared ray, laser beam, visible ray, ionizing radiation (X ray, ⁇ ray, ⁇ ray, ⁇ ray, etc.), microwave, high frequency and the like.
- the active energy ray it is preferable to use a laser beam and / or an infrared ray, and more preferable to use an infrared ray, from the viewpoint that the curing rate can be further improved.
- a solid laser using ruby, glass, YAG crystal obtained by adding a trace amount of rare earth to yttrium, aluminum, garnet
- a medium in which a dye is dissolved in a solvent such as water or alcohol Liquid laser
- gas laser using CO 2 , argon or He—Ne mixed gas as a medium semiconductor laser using semiconductor recombination emission.
- the wavelength of the laser beam used in the present invention is not particularly limited.
- the resin composition can be cured in the near infrared region (wavelength is about 0.7 to 2.5 ⁇ m).
- the output of the laser beam is not particularly limited, and for example, the resin composition can be cured in the range of 1 W to 4 kW.
- the time for laser irradiation is not particularly limited, but varies depending on the irradiation area and output.
- the resin composition can be cured in the range of 0.2 W / mm 2 to 10 W / mm 2. .
- the wavelength of infrared rays for curing the resin composition of the present invention is not particularly limited.
- the wavelength of any region such as the near infrared region (wavelength is approximately 0.7 to 2.5 ⁇ m), the mid infrared region (wavelength is approximately 2.5 to 4 ⁇ m), and the far infrared region (wavelength is approximately 4 to 1000 ⁇ m).
- the resin composition can be cured.
- Examples of the method of irradiating infrared rays for curing the resin composition of the present invention include a method of irradiating with an infrared heater.
- Examples of the infrared heater include a halogen heater, a quartz heater, a sheathed heater, and a ceramic heater.
- Halogen heaters can irradiate infrared rays having wavelengths from the near infrared region to the mid infrared region, and quartz heaters, seed heaters, and ceramic heaters emit infrared rays having wavelengths from the mid infrared region to the far infrared region. Irradiation is also possible.
- it is preferable to use a halogen heater because the time from when the power is turned on until the heat source is heated is short and can be heated quickly.
- the wavelength of infrared rays for curing the resin composition of the present invention is not particularly limited, but various wavelength regions can be used depending on the absorption region of the active energy ray-absorbing component to be used.
- the cured resin of the present invention can be cured in a short time in the near infrared region (wavelength is approximately 0.7 to 2.5 ⁇ m).
- the active energy ray-absorbing component (D) contained in the resin composition of the present invention is a component that can absorb the active energy ray and release thermal energy, and the resin composition is absorbed by the released thermal energy. It can be cured.
- an active energy ray-absorbing component from the viewpoint of infiltrating the resin composition between the fibers, it is liquid at 25 ° C., or is mixed and liquid when mixed with other materials. Is preferred.
- examples of such compounds include aniline black, metal complexes, squaric acid derivatives, immonium dyes, polymethine, phthalocyanine compounds, naphthalocyanine compounds, perylene compounds, quaterylene compounds, and nigrosine compounds. In the present invention, among these compounds, it is more preferable to use a nigrosine compound from the viewpoint that it can be easily obtained.
- nigrosine compounds examples include BONASORB series, eBIND ACW series, eBIND LTW series, eBIND LAW series, ORIENT NIGROSINE series, and NUBIAN BLACK series manufactured by Orient Chemical Industry Co., Ltd.
- the NUBIAN BLACK series is preferably used because it is inexpensive and easily available.
- These nigrosine compounds may be used alone or in combination of two or more.
- the blending amount of the active energy ray-absorbing component (D) contained in the resin composition of the present invention may be in the range of 0.001 to 1% by mass with respect to the total amount of the composition. Taking into consideration the balance between the curing rate of the resin composition and the heat generation (burning of the composition), it is preferably 0.01 to 0.5% by mass, and preferably 0.05 to 0.2% by mass. Further preferred.
- the amount is less than 0.001% by mass, heat generation is insufficient only by irradiation with active energy rays, and it becomes difficult to completely cure the resin composition.
- the amount is more than 1% by mass, the active energy rays are almost absorbed on the surface of the resin composition, and only the surface of the resin composition is carbonized and the active energy does not pass to the inside. Until it is completely cured.
- an additive may be further used as necessary.
- the additive include non-reactive diluents (plasticizers) such as dioctyl phthalate, dibutyl phthalate, benzyl alcohol, and coal tar; pigments; ⁇ -aminopropyltriethoxysilane, N- ⁇ - (aminoethyl) - ⁇ -aminopropyltriethoxysilane, N- ⁇ - (aminoethyl) -N'- ⁇ - (aminoethyl) - ⁇ -aminopropyltriethoxysilane, ⁇ -anilinopropyltriethoxysilane, ⁇ -glycidoxy Propyltriethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltriethoxysilane, vinyltriethoxysilane, N- ⁇ - (N-vinylbenzyla
- Zirconium tributoxy systemate tetra (2,2-diallyloxymethyl) butyldi (ditridecyl) phosphitozirconate, neopentyl (diallyl) oxytrineodecanoyl zirconate, neopentyl (diallyl) oxytri (dodecyl) benzene-sulfonylzirconate , Neopentyl (diallyl) oxytri (dioctyl) phosphatozirconate, neopentyl (diallyl) oxytri (dioctyl) pyro-phosphato zirconate, neopentyl (diallyl) oxytri (N-ethylenediamino) ethyl zirconate, neopentyl (diallyl) oxytri ( m-amino) phenyl zirconate, neopentyl (
- Lubricants such as candelilla wax, carnauba wax, wax wax, ibota wax, beeswax, lanolin, whale wax, montan wax, petroleum wax, fatty acid wax, fatty acid ester, fatty acid ether, aromatic ester, aromatic ether; thickener Normal additives such as a thixotropic agent, an antioxidant, a light stabilizer, an ultraviolet absorber, a flame retardant, an antifoaming agent, and a rust inhibitor.
- Lubricants such as candelilla wax, carnauba wax, wax wax, ibota wax, beeswax, lanolin, whale wax, montan wax, petroleum wax, fatty acid wax, fatty acid ester, fatty acid ether, aromatic ester, aromatic ether; thickener Normal additives such as a thixotropic agent, an antioxidant, a light stabilizer, an ultraviolet absorber, a flame retardant, an antifoaming agent, and a rust inhibitor.
- a silane coupling agent in the present invention in terms of improving adhesion to fibers, and in terms of easy availability and low cost, ⁇ -aminopropyl is added. It is more preferable to add triethoxysilane and / or ⁇ -glycidoxypropyltriethoxysilane, and it is most preferable to add ⁇ -glycidoxypropyltriethoxysilane.
- the amount of the silane coupling agent described above is preferably 0.1 to 50 parts by mass with respect to 100 parts by mass of the total amount of the compound having an epoxy group. From the viewpoint of good miscibility with the resin and improved adhesion to the fibers, it is particularly preferable to add 7 to 20 parts by mass.
- the resin composition of the present invention is suitable as a matrix resin for fiber-reinforced plastics using carbon fibers, glass fibers, or the like as reinforcing fibers.
- the type of the reinforcing fiber is not particularly limited, and for example, carbon fiber, glass fiber, aramid fiber, boron fiber, alumina fiber, silicone carbide fiber, or the like may be used alone, or may be used as two or more types of hybrid fibers. Good.
- a so-called tow sheet in which high-strength and high-modulus fibers are arranged in one direction, a unidirectional fabric or a bidirectional fabric in which the fiber yarns are arranged in one direction or two directions, Examples thereof include triaxial fabrics arranged in three directions and multiaxial fabrics arranged in multiple directions.
- the fibers in order to improve the resin impregnation property to the base material, it is preferable to arrange the fibers so as to ensure an appropriate gap between the strands.
- the method for molding the fiber reinforced plastic using the resin composition of the present invention is not particularly limited.
- extrusion molding method, blow molding method, compression molding method, vacuum molding method, injection molding method, RTM (Resin Transfer ⁇ Molding) molding, VaRTM (Vaccum Assist Resin Transfer Molding) molding, laminate molding, hand layup molding, filament winding Examples include molding methods.
- the fiber reinforced plastic obtained using the resin composition of the present invention can be used for various applications.
- general industrial applications such as structural materials for moving bodies such as automobiles, ships and railway vehicles, drive shafts, leaf springs, windmill blades, pressure vessels, flywheels, paper rollers, roofing materials, cables, and repair and reinforcement materials; Aerospace applications such as fuselage, main wing, tail wing, moving wing, fairing, cowl, door, seat, interior material, motor case, antenna, etc .; golf shaft, fishing rod, tennis or badminton racket application, hockey stick application, etc. Examples include sports applications such as ski pole applications.
- Adeka Resin EP-4901E bisphenol F type epoxy resin, manufactured by ADEKA, epoxy equivalent: 170 g / eq.
- Adeka Resin EP-4005 propylene oxide on bisphenol A Is an epoxidized product of an adduct having an average of 5 equivalents added (a compound in which the average values of a and b in the structural formula of the general formula (1) correspond to 5 each), manufactured by ADEKA Corporation, epoxy equivalent: 510 g / eq.) 60 g, LECy (1,1-bis (4-cyanatophenyl) ethane; made by Lonza) as cyanate resin (B), Kayahard as aromatic amine-based cured product (C) liquid at 25 ° C.
- ⁇ Bending test method> Using the cured product, a test piece was prepared according to a method according to JIS K 7171, and the maximum point stress, the maximum strain at stress, the stress at break, the strain at break, and the elastic modulus were measured. Further, the ratio of the breaking point stress to the maximum point stress ((breaking point stress / maximum point stress) ⁇ 100 (%)) was calculated.
- ⁇ Tensile test method> Using the cured product, a test piece was prepared according to a method according to JIS K 7161-1, and the maximum point stress, maximum point elongation, stress at break, elongation at break, and elastic modulus were measured.
- ⁇ Compression test method> Using the cured product, a test piece was prepared according to a method according to JIS K 7181, and the maximum point stress, the maximum point strain, and the elastic modulus were measured.
- Examples 2 to 7, Comparative Examples 1 to 4 Except having been blended as shown in Table 1, the same operations as in Example 1 were carried out to obtain respective blends. Table 1 shows the results of evaluating each of the obtained blends.
- the resin composition of the present invention has a good pot life, and the cured product of the resin composition is good in all items of bending test, tensile test and compression test. It was done. Although the cured products obtained by curing the resin compositions of Comparative Examples 1 to 3 are good in the items of the bending test and the compression test, in the items of the tensile test, the maximum point stress and the elongation at the maximum stress are the present invention. As a result, the satisfactory result was not obtained. In Comparative Example 4, the pot life was short and the workability was remarkably poor, so the subsequent test was not performed.
- Example 8 In a 500 mL disposable cup, 25 g of Adeka Resin EP-4901E and 75 g of Adeka Resin EP-4005 as epoxy resin (A), 100 g of LECy as cyanate resin (B), liquid aromatic amine-based cured product (C) at 25 ° C. ) 70 g of Kayahard AA was added and stirred with a spatula at 25 ° C. for 5 minutes. Thereafter, the mixture was further stirred using a planetary stirrer to obtain a blend.
- Example 9 to 16, Comparative Examples 5 to 8 Except for using the compounding amounts as shown in Table 2 or Table 3, the same operation as in Example 8 was performed, and the curability of the glass fiber impregnated with the resin and the state of the fiber surface were measured. The evaluation results are shown in Table 2 and Table 3, respectively.
- EP-4088S Dicyclopentadiene type epoxy resin, manufactured by ADEKA Corporation * 5 KBM-403: ⁇ -glycidoxypropyltriethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd.
- the fiber reinforced plastics using the resin composition of the present invention are all cured at 150 ° C. for 3 hours, and the fiber surface state after the bending test is confirmed to be resin. It was confirmed that the cured product was in close contact with the fiber. This proves that when the fiber is stretched by a bending test, the cured resin follows the stretching of the fiber. Further, in Examples 11 to 13 in which a dicyclopentadiene type epoxy resin was added as an additive to the resin composition and Examples 14 to 16 in which a silane coupling agent was added, the amount of the additive was increased. It was confirmed that the adhesion was further improved.
- Example 17 In a 500 mL disposable cup, 25 g of Adeka Resin EP-4901E and 75 g of Adeka Resin EP-4005 as epoxy resin (A), 100 g of LECy as cyanate resin (B), liquid aromatic amine curing agent (C) at 25 ° C. 70 g of Kayahard AA and 0.27 g of NUBIAN BLACK TN-870 (Nigrosine-based black dye, manufactured by Orient Chemical Co., Ltd.) as the active energy ray absorbing component (D), and at 25 ° C. for 5 minutes And stirred with a spatula. Thereafter, the mixture was further stirred using a planetary stirrer to obtain a blend.
- Example 18 Except for irradiating infrared rays using a halogen heater (QIR200V2000W / 444, manufactured by Iwasaki Electric Co., Ltd.) instead of laser light, the infrared irradiation time was measured and cured by the same operation as in Example 17. About the obtained fiber reinforced plastic, the fiber surface state of glass fiber was confirmed.
- a halogen heater QIR200V2000W / 444, manufactured by Iwasaki Electric Co., Ltd.
- Example 19 Except for irradiating infrared rays using a ceramic heater (FFE-1000, manufactured by Nippon Heater Co., Ltd.) instead of laser light, the infrared irradiation time was measured and cured in the same manner as in Example 17. About the obtained fiber reinforced plastic, the fiber surface state of glass fiber was confirmed.
- a ceramic heater FFE-1000, manufactured by Nippon Heater Co., Ltd.
- Example 20 Except for irradiating infrared rays using a quartz heater (FQE-650, manufactured by Nippon Heater Co., Ltd.) instead of laser light, the infrared irradiation time was measured and cured in the same manner as in Example 17. About the obtained fiber reinforced plastic, the fiber surface state of glass fiber was confirmed.
- a quartz heater FQE-650, manufactured by Nippon Heater Co., Ltd.
- Example 21 and 22 Except for the formulation shown in Table 4, the same operation as in Example 17 was performed, the laser light irradiation time was measured, and the fiber surface state of the glass fiber was confirmed for the fiber reinforced plastic obtained by curing. .
- Example 23 Except for the blending shown in Table 4, the same operation as in Example 18 was performed, the infrared irradiation time was measured, and the fiber surface state of the glass fiber was confirmed for the fiber reinforced plastic obtained by curing. .
- Example 25 Except for curing in a thermostatic bath set at 150 ° C. instead of laser light, the same operation as in Example 17 was performed, and the curing time taken until tack-free by touch was measured and cured. About the obtained fiber reinforced plastic, the fiber surface state of glass fiber was confirmed. [Examples 26 to 28] Except what was carried out with the formulation shown in Table 4, the operation was carried out in the same manner as in Example 17, the irradiation time of the laser beam was measured, and the fiber surface state of the cured glass fiber was confirmed.
- Example 9 Except that NUBIAN BLACK TN-870 was not added, the same operation as in Example 17 was performed, but the resin was not cured even after irradiation with laser light for 3 hours, so the subsequent evaluation was not performed. It was.
- EP-4088S Dicyclopentadiene type epoxy resin, manufactured by ADEKA Corporation * 2 KBM-403: ⁇ -glycidoxypropyltriethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd.
- the resin composition of the present invention not only has a long pot life, but also provides all the components of the composition to the inside of the fiber material. Therefore, the fiber reinforced plastic of the present invention having excellent heat resistance and strength is provided. Can do. Since the fiber-reinforced plastic of the present invention can be applied to various uses such as automobiles, ships, windmill blades, roofing materials, and sports equipment, the present invention is extremely useful in industry.
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Abstract
Description
本発明の第二の目的は、耐熱性及び強度に優れた、繊維強化プラスチックを提供することにある。
更に本発明の第三の目的は、上記樹脂組成物を短時間で硬化させて繊維強化プラスチックを製造する方法を提供することにある。
即ち、本発明は、エポキシ樹脂(A)、シアネート樹脂(B)及び25℃で液状の芳香族アミン系硬化剤(C)を含有する樹脂組成物であって、前記エポキシ樹脂(A)の20~100質量%が、下記一般式(1)で表されるエポキシ化合物であることを特徴とする、繊維強化プラスチック用樹脂組成物、該樹脂組成物を含有する組成物を硬化させてなる硬化物、該硬化物と強化繊維を均一に含有する高強度繊維強化プラスチック、及び、該高強度繊維強化プラスチックの製造方法である。
但し、上記式(1)におけるa及びbは、それぞれ独立して2~10の整数を、cは0~3の整数を表し、R1、R2はそれぞれ独立して、炭素数が2~5の2価の炭化水素基を表し、R3は単結合、メチレン基、又は-C(CH3)2-を表す。
本発明の樹脂組成物においては、前記エポキシ樹脂(A)の3~15質量%が、ジシクロペンタジエン型エポキシ樹脂であることが、繊維に対する硬化物の密着性を良好にする観点から好ましい。
また、シアネート樹脂(B)が、後記する一般式(2-1)~(2-3)で表される化合物、及びこれらのプレポリマーからなる群より選ばれる少なくとも1種からなることが好ましく、シアネート樹脂(B)の使用量が、樹脂組成物中におけるエポキシ基を有するエポキシ化合物の総量100質量部に対して、50~120質量部であることが好ましい。
本発明の樹脂組成物においては、更にシランカップリング剤を含むことが、繊維に対する硬化物の密着性を良好にする観点から好ましく、その使用量が、樹脂組成物中におけるエポキシ基を有するエポキシ化合物の総量100質量部に対して、7~20質量部であることが好ましい。
但し、上記式(1)におけるa及びbは、それぞれ独立して2~10の整数を、cは0~3の整数を表し、R1、R2はそれぞれ独立して、炭素数が2~5の2価の炭化水素基を表し、R3は単結合、メチレン基、又は-C(CH3)2-を表す。
また、式(1)中のR1及びR2は、原料の入手が容易であるという観点から、それぞれ独立して、炭素数が2~4の2価の炭化水素基であることが好ましく、プロピレン基であることが特に好ましい。
アルキレンオキシドの使用量を、例えば、フェノール性水酸基1当量に対して、アルキレンオキシドが2当量となるようにした場合、前記式(1)で表されるa及びbの平均値は、それぞれ理論値で2となる。
また、本発明の樹脂組成物を繊維材料と組み合わせて使用する場合には、ジシクロペンタジエン型エポキシ樹脂を使用することが、繊維に対する硬化物の密着性が向上するので好ましい。その場合のジシクロペンタジエン型エポキシ樹脂の使用量は、(A)成分のエポキシ樹脂中、0.1~30質量%であることが好ましく、3~15質量%であることがより好ましい。
また、エポキシ基の数が3個の反応性希釈剤としては、トリメチロールプロパントリグリシジルエーテル、及びグリセリントリグリシジルエーテル等が挙げられる。
但し、上記式(2-1)におけるRaは2価の炭化水素基を表し、Rb及びRcはそれぞれ独立に、非置換、又は1~4個のアルキル基で置換されたフェニレン基を表す。
但し、上記式(2-2)におけるnは1~10の整数を表し、Rdは水素原子、又は炭素数が1~4のアルキル基である。
但し、Reは、単結合、メチレン基、-CH(CH3)-、-C(CH3)2-、又は下記一般式(3-1)~(3-8)で表される何れかの官能基を表し、Rf、Rg、Rh、Riは、それぞれ独立に、水素原子、又は炭素数が1~4のアルキル基を表す。
本発明における芳香族アミン系硬化剤(C)の配合量は、エポキシ基を持つ化合物の総量100質量部に対して20~100質量部であることが好ましく、40~90質量部であることがより好ましい。20質量部より少ない場合、又は90質量部よりも多い場合には、エポキシ樹脂組成物が完全には硬化し難くなる。
本発明では、これらの活性エネルギー線の中でも、より硬化速度を向上させられるという観点から、レーザー光線及び/又は赤外線を使用することが好ましく、赤外線を使用することがより好ましい。
レーザー光線の出力も特に制限されず、例えば、1W~4kWの範囲で、樹脂組成物を硬化させることができる。
本発明の樹脂組成物を硬化させる赤外線の波長も、特に制限されることはない。例えば、近赤外線領域(波長がおよそ0.7~2.5μm)、中赤外線領域(波長がおよそ2.5~4μm)、及び遠赤外線領域(波長がおよそ4~1000μm)など、どの領域の波長でも、樹脂組成物を硬化させることができる。
上記したシランカップリング剤の配合量は、エポキシ基を持つ化合物の総量100質量部に対し、0.1~50質量部であることが好ましい。樹脂との混和性が良好であり、繊維との密着性が向上するという観点から、7~20質量部配合させることが特に好ましい。
500mLディスポカップに、エポキシ樹脂(A)として、アデカレジンEP-4901E(ビスフェノールF型エポキシ樹脂、(株)ADEKA製、エポキシ当量:170g/eq.)を80g、アデカレジンEP-4005(ビスフェノールAにプロピレンオキシドが平均5当量付加した付加物のエポキシ化物(一般式(1)の構造式におけるa及びbの平均値がそれぞれ5に相当する化合物)、(株)ADEKA製、エポキシ当量:510g/eq.)を60g、シアネート樹脂(B)として、LECy(1,1-ビス(4-シアナトフェニル)エタン;ロンザ社製)を60g、25℃で液状の芳香族アミン系硬化物(C)として、カヤハードAA(ジアミノジエチルジフェニルメタン、日本化薬(株)製)を70g加え、25℃にて5分間スパチュラで撹拌した。その後、遊星式攪拌機を使用して更に撹拌し、配合物を得た。
上記配合物100gを500mLのガラス瓶に保存し、23℃で55時間静置した後、前記ガラス瓶を横転させて配合物の流動性の有無を確認し、「良」、又は「不良」の評価を行った。
良:流動性があり、使用可能
不良:横転させてから10秒後も、初期の位置から動かず、流動性がないため使用不可能
上記配合物を80℃で5時間加熱し、その後更に150℃で2時間加熱して硬化させ、硬化物の、曲げ試験、引張試験及び圧縮試験を行って硬化物を評価した。それぞれの試験方法を以下に示す。
硬化物を用いて、JIS K 7171に準拠した方法に従って試験片を作製し、最大点応力、最大応力時ひずみ、破断時応力、破断時ひずみ及び弾性率を測定した。また、最大点応力に対する破断点応力の割合((破断点応力/最大点応力)×100(%))を計算した。
硬化物を用いて、JIS K 7161-1に準拠した方法に従って試験片を作製し、最大点応力、最大点伸び、破断時応力、破断時伸び及び弾性率を測定した。
硬化物を用いて、JIS K 7181に準拠した方法に従って試験片を作製し、最大点応力、最大点ひずみ及び弾性率を測定した。
表1に示す通りに配合したこと以外は、実施例1と同様の操作を行い、それぞれの配合物を得た。得られた各配合物を評価した結果を表1に示す。
500mLのディスポカップに、エポキシ樹脂(A)として、アデカレジンEP-4901Eを25g及びアデカレジンEP-4005を75g、シアネート樹脂(B)としてLECyを100g、25℃で液状の芳香族アミン系硬化物(C)としてカヤハードAAを70g加え、25℃にて5分間スパチュラで撹拌した。その後、遊星式攪拌機を使用して更に撹拌し、配合物を得た。
樹脂を含浸させたガラス繊維を150℃の恒温槽に入れ、触感により、タックフリーになるまでにかかる硬化時間を測定した。
上記の硬化性を確認する際に得られた、樹脂硬化後の樹脂繊維複合物(繊維強化プラスチック)について、JIS K 7017準拠の方法に従い、曲げ試験を行った。曲げ試験によって破断した繊維強化プラスチックの断面を、走査型電子顕微鏡(DSC6220、SII社製)により、以下のように確認した。
A:繊維表面の全体に樹脂が付着している
B:繊維表面の一部に樹脂が付着している
C:繊維表面には樹脂がほとんど付着していない
A又はBの状態の場合、曲げ試験による破断時に、樹脂硬化物が凝集破壊しており、硬化物と繊維が密着していることが確認できる。Cの状態の場合、曲げ試験による破断時に、樹脂硬化物が繊維と界面剥離をしており、硬化物と繊維が密着していないことが確認できる。A又はBの評価状態を合格と判断した。A~Cの状態を、それぞれ図1~図3に示す。
表2又は表3に示すような配合量にしたこと以外は、実施例8の場合と同様の操作を行い、樹脂を含浸させたガラス繊維の硬化性及び繊維表面の状態を測定した。評価結果をそれぞれ表2及び表3に示す。
更に、樹脂組成物中に、添加剤として、ジシクロペンタジエン型エポキシ樹脂を添加した実施例11~13、及びシランカップリング剤を添加した実施例14~16では、添加剤の量を増やすことにより、密着性がより向上することが確認された。
500mLのディスポカップに、エポキシ樹脂(A)として、アデカレジンEP-4901Eを25g及びアデカレジンEP-4005を75g、シアネート樹脂(B)としてLECyを100g、25℃で液状の芳香族アミン系硬化剤(C)としてカヤハードAAを70g、並びに、活性エネルギー線吸収性成分(D)として、NUBIAN BLACK TN-870(ニグロシン系黒色染料、オリエント化学工業(株)製)0.27gを加え、25℃で5分間、スパチュラで撹拌した。その後、遊星式攪拌機を使用して更に撹拌し、配合物を得た。
樹脂組成物を硬化させた後のガラス繊維(繊維強化プラスチック)の繊維表面状態を、実施例8~16の場合と同様にして評価した。
レーザー光の代わりに、ハロゲンヒーター(QIR200V2000W/444、岩崎電気(株)製)を用いて赤外線を照射すること以外は、実施例17と同じ操作により、赤外線の照射時間を測定し、硬化させて得られた繊維強化プラスチックについて、ガラス繊維の繊維表面状態を確認した。
レーザー光の代わりに、セラミックヒーター(FFE-1000、日本ヒーター(株)製)を用いて赤外線を照射すること以外は、実施例17と同じ操作により、赤外線の照射時間を測定し、硬化させて得られた繊維強化プラスチックについて、ガラス繊維の繊維表面状態を確認した。
レーザー光の代わりに、石英ヒーター(FQE-650、日本ヒーター(株)製)を用いて赤外線を照射すること以外は、実施例17と同じ操作により、赤外線の照射時間を測定し、硬化させて得られた繊維強化プラスチックについて、ガラス繊維の繊維表面状態を確認した。
表4に示す配合としたこと以外は、実施例17と同様の操作を行い、レーザー光の照射時間を測定し、硬化させて得られた繊維強化プラスチックについて、ガラス繊維の繊維表面状態を確認した。
表4に示す配合で行ったこと以外は、実施例18と同様の操作を行い、赤外線の照射時間を測定し、硬化させて得られた繊維強化プラスチックについて、ガラス繊維の繊維表面状態を確認した。
レーザー光の代わりに、150℃に設定した恒温槽内で硬化させたこと以外は、実施例17と同じ操作を行い、触感によりタックフリーになるまでにかかる硬化時間を測定し、硬化させて得られた繊維強化プラスチックについて、ガラス繊維の繊維表面状態を確認した。
[実施例26~28]
表4に示す配合で行ったこと以外は、実施例17と同様に操作を行い、レーザー光の照射時間を測定し、硬化させたガラス繊維の繊維表面状態を確認した。
NUBIAN BLACK TN-870を入れないで配合したこと以外は、実施例17と同様の操作を行ったが、レーザー光を3時間照射しても樹脂が硬化しなかったため、その後の評価は実施しなかった。
Claims (16)
- 更に、活性エネルギー線吸収性成分(D)を含有する、請求項1に記載された繊維強化プラスチック用樹脂組成物。
- 前記エポキシ樹脂(A)中に、ジシクロペンタジエン型エポキシ樹脂が3~15質量%含有されている、請求項1又は2に記載された繊維強化プラスチック用樹脂組成物。
- シアネート樹脂(B)の使用量が、組成物中におけるエポキシ基を有するエポキシ化合物の総量100質量部に対して、50~120質量部である、請求項1~5の何れかに記載された繊維強化プラスチック用樹脂組成物。
- 25℃で液状の芳香族アミン系硬化剤(C)が、ジアミノジフェニルメタン、ジアミノジエチルジフェニルメタン、及びジアミノジエチルトルエンから選ばれる少なくとも1つの化合物である、請求項1~6の何れかに記載された繊維強化プラスチック用樹脂組成物。
- 25℃で液状の芳香族アミン(C)の使用量が、組成物中におけるエポキシ基を有するエポキシ化合物の総量100質量部に対して、40~90質量部である、請求項1~7の何れかに記載された繊維強化プラスチック用樹脂組成物。
- 前記活性エネルギー線吸収性成分(D)がニグロシン系化合物である請求項2~8の何れかに記載された繊維強化プラスチック用樹脂組成物。
- 前記活性エネルギー線吸収性成分(D)の使用量が、樹脂組成物の総量に対して、0.001~1質量%である請求項2~9の何れかに記載された繊維強化プラスチック用樹脂組成物。
- 更にシランカップリング剤を含む、請求項1~10の何れかに記載された繊維強化プラスチック用樹脂組成物。
- 前記シランカップリング剤の使用量が、組成物中のエポキシ基を持つエポキシ化合物の総量100質量部に対して、7~20質量部である、請求項11に記載された繊維強化プラスチック用樹脂組成物。
- 請求項1~12の何れかに記載された繊維強化プラスチック用樹脂組成物を含有する組成物を硬化させてなる硬化物。
- 請求項1~12の何れかに記載された繊維強化プラスチック用樹脂組成物及び強化繊維を均一に含有する組成物を硬化させてなることを特徴とする、高強度繊維強化プラスチック。
- 請求項2~12の何れかに記載された繊維強化プラスチック用樹脂組成物及び強化繊維を均一に含有する組成物を活性エネルギー線により硬化させることを特徴とする、高強度繊維強化プラスチックの製造方法。
- 前記活性エネルギー線が、レーザー光及び/又は赤外線である、請求項15に記載された高強度繊維強化プラスチックの製造方法。
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| CN201680050914.6A CN108026249B (zh) | 2015-09-04 | 2016-08-25 | 纤维强化塑胶用树脂组成物、其硬化物、含有该硬化物的纤维强化塑胶、及该纤维强化塑胶的制造方法 |
| US15/757,086 US10557002B2 (en) | 2015-09-04 | 2016-08-25 | Resin composition for fiber-reinforced plastic, cured product thereof, fiber-reinforced plastic containing said cured product, and method for producing fiber-reinforced plastic |
| ES16841635T ES2881753T3 (es) | 2015-09-04 | 2016-08-25 | Composición de resina para plástico reforzado con fibra, un producto curado del mismo, plástico reforzado con fibra que contiene dicho producto curado y método para la producción de plástico reforzado con fibra |
| DK16841635.2T DK3345950T3 (da) | 2015-09-04 | 2016-08-25 | Harpikssammensætning til fiberforstærket plast, hærdet produkt deraf, fiberforstærket plast indeholdende det hærdede produkt og fremgangsmåde til fremstilling af den fiberforstærkede plast |
| KR1020187006141A KR102564741B1 (ko) | 2015-09-04 | 2016-08-25 | 섬유강화 플라스틱용 수지 조성물, 그 경화물, 그 경화물을 함유하는 섬유강화 플라스틱, 및 그 섬유강화 플라스틱의 제조 방법 |
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| CA2997390A CA2997390C (en) | 2015-09-04 | 2016-08-25 | Resin composition for fiber-reinforced plastic, cured product thereof, fiber-reinforced plastic containing said cured product, and method for producing fiber-reinforced plastic |
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| JP7463276B2 (ja) | 2018-07-04 | 2024-04-08 | 株式会社Adeka | 樹脂組成物、その硬化物、繊維強化プラスチック及び繊維強化プラスチックの難燃化方法 |
| KR20250059551A (ko) | 2018-07-04 | 2025-05-02 | 가부시키가이샤 아데카 | 수지 조성물, 그 경화물, 섬유 강화 플라스틱 및 섬유 강화 플라스틱의 난연화 방법 |
| WO2020184324A1 (ja) * | 2019-03-08 | 2020-09-17 | 株式会社Adeka | 繊維強化プラスチック用樹脂組成物、及び該組成物を含有する繊維強化プラスチック |
| JPWO2020184324A1 (ja) * | 2019-03-08 | 2020-09-17 | ||
| JP7527270B2 (ja) | 2019-03-08 | 2024-08-02 | 株式会社Adeka | 繊維強化プラスチック用樹脂組成物、及び該組成物を含有する繊維強化プラスチック |
| US12435178B2 (en) | 2019-03-08 | 2025-10-07 | Adeka Corporation | Resin composition for fiber-reinforced plastic, and fiberreinforced plastic containing said composition |
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| Publication number | Publication date |
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| CA2997390A1 (en) | 2017-03-09 |
| US10557002B2 (en) | 2020-02-11 |
| TW201714955A (zh) | 2017-05-01 |
| US20180251612A1 (en) | 2018-09-06 |
| KR102564741B1 (ko) | 2023-08-08 |
| DK3345950T3 (da) | 2021-09-06 |
| JPWO2017038603A1 (ja) | 2018-07-26 |
| TWI709606B (zh) | 2020-11-11 |
| ES2881753T3 (es) | 2021-11-30 |
| CN108026249A (zh) | 2018-05-11 |
| CN108026249B (zh) | 2020-12-11 |
| EP3345950A1 (en) | 2018-07-11 |
| EP3345950B1 (en) | 2021-07-21 |
| KR20180050307A (ko) | 2018-05-14 |
| CA2997390C (en) | 2022-09-27 |
| JP6800857B2 (ja) | 2020-12-16 |
| EP3345950A4 (en) | 2019-05-08 |
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