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WO2008123583A1 - 感光性ポリアミド酸エステル組成物 - Google Patents

感光性ポリアミド酸エステル組成物 Download PDF

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Publication number
WO2008123583A1
WO2008123583A1 PCT/JP2008/056686 JP2008056686W WO2008123583A1 WO 2008123583 A1 WO2008123583 A1 WO 2008123583A1 JP 2008056686 W JP2008056686 W JP 2008056686W WO 2008123583 A1 WO2008123583 A1 WO 2008123583A1
Authority
WO
WIPO (PCT)
Prior art keywords
acid ester
polyamic acid
ester composition
mass
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/056686
Other languages
English (en)
French (fr)
Inventor
Nobuchika Tamura
Motohiro Niwa
Kimiyuki Maruyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Microdevices Corp
Original Assignee
Asahi Kasei EMD Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei EMD Corp filed Critical Asahi Kasei EMD Corp
Priority to JP2009509300A priority Critical patent/JP5043932B2/ja
Publication of WO2008123583A1 publication Critical patent/WO2008123583A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)

Abstract

　特定骨格で表される繰り返し単位のみからなるポリアミド酸エステル１００質量部に対し、光開始剤１～４０質量部、溶媒３０～１５００質量部、特定で表される繰り返し単位のみからなるポリアミド酸エステル０～１５０質量部を含むことを特徴とする、感光性ポリアミド酸エステル組成物。
PCT/JP2008/056686 2007-04-04 2008-04-03 感光性ポリアミド酸エステル組成物 Ceased WO2008123583A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009509300A JP5043932B2 (ja) 2007-04-04 2008-04-03 感光性ポリアミド酸エステル組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-097930 2007-04-04
JP2007097930 2007-04-04

Publications (1)

Publication Number Publication Date
WO2008123583A1 true WO2008123583A1 (ja) 2008-10-16

Family

ID=39831047

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056686 Ceased WO2008123583A1 (ja) 2007-04-04 2008-04-03 感光性ポリアミド酸エステル組成物

Country Status (3)

Country Link
JP (1) JP5043932B2 (ja)
TW (1) TWI369583B (ja)
WO (1) WO2008123583A1 (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010266843A (ja) * 2009-04-14 2010-11-25 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物及びこれを用いた回路形成用基板
WO2013051213A1 (ja) * 2011-10-05 2013-04-11 日立化成デュポンマイクロシステムズ株式会社 高透明ポリイミド
JP2013114008A (ja) * 2011-11-28 2013-06-10 Nichigo Morton Co Ltd 感光性樹脂組成物、及びこれを用いたフォトレジストフィルム
JP2015127817A (ja) * 2009-04-14 2015-07-09 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物及びこれを用いた回路形成用基板
WO2015125469A1 (ja) * 2014-02-19 2015-08-27 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物、それによって形成される硬化膜及びパターン硬化膜、及びそれらの製造方法
WO2016194769A1 (ja) * 2015-05-29 2016-12-08 富士フイルム株式会社 ポリイミド前駆体組成物、感光性樹脂組成物、硬化膜、硬化膜の製造方法、半導体デバイスおよびポリイミド前駆体組成物の製造方法
JP2018169627A (ja) * 2016-08-22 2018-11-01 旭化成株式会社 感光性樹脂組成物及び硬化レリーフパターンの製造方法
CN110431483A (zh) * 2019-01-23 2019-11-08 律胜科技股份有限公司 感光性树脂组合物及其应用
CN114316263A (zh) * 2022-01-17 2022-04-12 深圳职业技术学院 交联型聚酰胺酸酯、其制备方法、包含其的聚酰亚胺组合物及聚酰亚胺树脂膜的制备方法
CN114685792A (zh) * 2020-12-31 2022-07-01 财团法人工业技术研究院 聚合物及包含其的树脂组合物
JP2023023187A (ja) * 2021-08-04 2023-02-16 旭化成株式会社 感光性樹脂組成物および半導体装置
JP2023155261A (ja) * 2020-06-08 2023-10-20 住友ベークライト株式会社 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413860B (zh) * 2010-02-16 2013-11-01 Asahi Kasei E Materials Corp A negative photosensitive resin composition, a method for manufacturing a hardened embossed pattern, and a semiconductor device
KR102276251B1 (ko) * 2013-10-09 2021-07-12 에이치디 마이크로시스템즈 가부시키가이샤 폴리이미드 전구체를 포함하는 수지 조성물, 및 그것을 사용한 경화막의 제조 방법
TWI767436B (zh) * 2016-02-26 2022-06-11 日商富士軟片股份有限公司 積層體的製造方法、半導體元件的製造方法及再配線層的製造方法
TWI723166B (zh) * 2016-05-23 2021-04-01 日商日產化學工業股份有限公司 剝離層形成用組成物及剝離層
CN109814336B (zh) * 2019-01-21 2022-05-17 深圳市道尔顿电子材料有限公司 可碱溶负性光敏聚酰亚胺树脂组合物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000043439A1 (fr) * 1999-01-21 2000-07-27 Asahi Kasei Kabushiki Kaisha Ester d'acide polyamique
JP2003316002A (ja) * 2002-04-22 2003-11-06 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、これを用いたパターン製造方法及び電子部品
JP2004085637A (ja) * 2002-08-23 2004-03-18 Kyocera Chemical Corp 感光性樹脂組成物およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000043439A1 (fr) * 1999-01-21 2000-07-27 Asahi Kasei Kabushiki Kaisha Ester d'acide polyamique
JP2003316002A (ja) * 2002-04-22 2003-11-06 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、これを用いたパターン製造方法及び電子部品
JP2004085637A (ja) * 2002-08-23 2004-03-18 Kyocera Chemical Corp 感光性樹脂組成物およびその製造方法

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015127817A (ja) * 2009-04-14 2015-07-09 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物及びこれを用いた回路形成用基板
JP2010266843A (ja) * 2009-04-14 2010-11-25 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物及びこれを用いた回路形成用基板
WO2013051213A1 (ja) * 2011-10-05 2013-04-11 日立化成デュポンマイクロシステムズ株式会社 高透明ポリイミド
JP2013114008A (ja) * 2011-11-28 2013-06-10 Nichigo Morton Co Ltd 感光性樹脂組成物、及びこれを用いたフォトレジストフィルム
WO2015125469A1 (ja) * 2014-02-19 2015-08-27 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物、それによって形成される硬化膜及びパターン硬化膜、及びそれらの製造方法
CN106462057A (zh) * 2014-02-19 2017-02-22 日立化成杜邦微系统股份有限公司 树脂组合物、由其形成的固化膜和图案固化膜、以及它们的制造方法
JPWO2015125469A1 (ja) * 2014-02-19 2017-03-30 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物、それによって形成される硬化膜及びパターン硬化膜、及びそれらの製造方法
US10538627B2 (en) 2015-05-29 2020-01-21 Fujifilm Corporation Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, a semiconductor device, and method for producing polyimide precursor composition
WO2016194769A1 (ja) * 2015-05-29 2016-12-08 富士フイルム株式会社 ポリイミド前駆体組成物、感光性樹脂組成物、硬化膜、硬化膜の製造方法、半導体デバイスおよびポリイミド前駆体組成物の製造方法
CN107709407A (zh) * 2015-05-29 2018-02-16 富士胶片株式会社 聚酰亚胺前体组合物、感光性树脂组合物、固化膜、固化膜的制造方法、半导体器件及聚酰亚胺前体组合物的制造方法
JPWO2016194769A1 (ja) * 2015-05-29 2018-03-15 富士フイルム株式会社 ポリイミド前駆体組成物、感光性樹脂組成物、硬化膜、硬化膜の製造方法、半導体デバイスおよびポリイミド前駆体組成物の製造方法
CN107709407B (zh) * 2015-05-29 2020-11-17 富士胶片株式会社 聚酰亚胺前体组合物、感光性树脂组合物、固化膜、固化膜的制造方法、半导体器件及聚酰亚胺前体组合物的制造方法
JP2018169627A (ja) * 2016-08-22 2018-11-01 旭化成株式会社 感光性樹脂組成物及び硬化レリーフパターンの製造方法
WO2020150918A1 (zh) * 2019-01-23 2020-07-30 律胜科技股份有限公司 感光性树脂组合物及其应用
CN110431483A (zh) * 2019-01-23 2019-11-08 律胜科技股份有限公司 感光性树脂组合物及其应用
CN110431483B (zh) * 2019-01-23 2022-02-11 律胜科技股份有限公司 感光性树脂组合物及其应用
JP2023155261A (ja) * 2020-06-08 2023-10-20 住友ベークライト株式会社 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス
JP7647809B2 (ja) 2020-06-08 2025-03-18 住友ベークライト株式会社 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス
CN114685792A (zh) * 2020-12-31 2022-07-01 财团法人工业技术研究院 聚合物及包含其的树脂组合物
JP2023023187A (ja) * 2021-08-04 2023-02-16 旭化成株式会社 感光性樹脂組成物および半導体装置
CN114316263A (zh) * 2022-01-17 2022-04-12 深圳职业技术学院 交联型聚酰胺酸酯、其制备方法、包含其的聚酰亚胺组合物及聚酰亚胺树脂膜的制备方法
CN114316263B (zh) * 2022-01-17 2023-02-03 深圳职业技术学院 交联型聚酰胺酸酯、其制备方法、包含其的聚酰亚胺组合物及聚酰亚胺树脂膜的制备方法

Also Published As

Publication number Publication date
TWI369583B (en) 2012-08-01
TW200907567A (en) 2009-02-16
JPWO2008123583A1 (ja) 2010-07-15
JP5043932B2 (ja) 2012-10-10

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