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WO2008123583A1 - Photosensitive polyamic acid ester composition - Google Patents

Photosensitive polyamic acid ester composition Download PDF

Info

Publication number
WO2008123583A1
WO2008123583A1 PCT/JP2008/056686 JP2008056686W WO2008123583A1 WO 2008123583 A1 WO2008123583 A1 WO 2008123583A1 JP 2008056686 W JP2008056686 W JP 2008056686W WO 2008123583 A1 WO2008123583 A1 WO 2008123583A1
Authority
WO
WIPO (PCT)
Prior art keywords
acid ester
polyamic acid
ester composition
mass
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/056686
Other languages
French (fr)
Japanese (ja)
Inventor
Nobuchika Tamura
Motohiro Niwa
Kimiyuki Maruyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Microdevices Corp
Original Assignee
Asahi Kasei EMD Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei EMD Corp filed Critical Asahi Kasei EMD Corp
Priority to JP2009509300A priority Critical patent/JP5043932B2/en
Publication of WO2008123583A1 publication Critical patent/WO2008123583A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)

Abstract

A photosensitive polyamic acid ester composition characterized by comprising 100 parts by mass of a polyamic acid ester consisting only of repeating units represented by a specific skeleton, 1-40 parts by mass of a photoinitiator, 30-1,500 parts by mass of a solvent, and 0-150 parts by mass of a polyamic acid ester consisting only of specific repeating units.
PCT/JP2008/056686 2007-04-04 2008-04-03 Photosensitive polyamic acid ester composition Ceased WO2008123583A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009509300A JP5043932B2 (en) 2007-04-04 2008-04-03 Photosensitive polyamic acid ester composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-097930 2007-04-04
JP2007097930 2007-04-04

Publications (1)

Publication Number Publication Date
WO2008123583A1 true WO2008123583A1 (en) 2008-10-16

Family

ID=39831047

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056686 Ceased WO2008123583A1 (en) 2007-04-04 2008-04-03 Photosensitive polyamic acid ester composition

Country Status (3)

Country Link
JP (1) JP5043932B2 (en)
TW (1) TWI369583B (en)
WO (1) WO2008123583A1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010266843A (en) * 2009-04-14 2010-11-25 Hitachi Chemical Dupont Microsystems Ltd Photosensitive resin composition and circuit formation substrate using the same
WO2013051213A1 (en) * 2011-10-05 2013-04-11 日立化成デュポンマイクロシステムズ株式会社 Highly transparent polyimide
JP2013114008A (en) * 2011-11-28 2013-06-10 Nichigo Morton Co Ltd Photosensitive resin composition, and photoresist film using the same
JP2015127817A (en) * 2009-04-14 2015-07-09 日立化成デュポンマイクロシステムズ株式会社 Photosensitive resin composition and circuit formation substrate using the same
WO2015125469A1 (en) * 2014-02-19 2015-08-27 日立化成デュポンマイクロシステムズ株式会社 Resin composition, cured film and patterned cured film formed from same, method for producing cured film, and method for producing patterned cured film
WO2016194769A1 (en) * 2015-05-29 2016-12-08 富士フイルム株式会社 Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, semiconductor device, and method for producing polyimide precursor composition
JP2018169627A (en) * 2016-08-22 2018-11-01 旭化成株式会社 Photosensitive resin composition and method for producing cured relief pattern
CN110431483A (en) * 2019-01-23 2019-11-08 律胜科技股份有限公司 Photosensitive polymer combination and its application
CN114316263A (en) * 2022-01-17 2022-04-12 深圳职业技术学院 Cross-linked polyamic acid ester, method for producing same, polyimide composition containing same, and method for producing polyimide resin film
CN114685792A (en) * 2020-12-31 2022-07-01 财团法人工业技术研究院 Polymer and resin composition comprising same
JP2023023187A (en) * 2021-08-04 2023-02-16 旭化成株式会社 Photosensitive resin composition and semiconductor device
JP2023155261A (en) * 2020-06-08 2023-10-20 住友ベークライト株式会社 Photosensitive resin composition, method for manufacturing electronic device and electronic device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413860B (en) * 2010-02-16 2013-11-01 Asahi Kasei E Materials Corp A negative photosensitive resin composition, a method for manufacturing a hardened embossed pattern, and a semiconductor device
KR102276251B1 (en) * 2013-10-09 2021-07-12 에이치디 마이크로시스템즈 가부시키가이샤 Resin composition containing polyimide precursor and method for manufacturing cured film using said resin composition
TWI767436B (en) * 2016-02-26 2022-06-11 日商富士軟片股份有限公司 Manufacturing method of laminated body, manufacturing method of semiconductor element, and manufacturing method of rewiring layer
TWI723166B (en) * 2016-05-23 2021-04-01 日商日產化學工業股份有限公司 Composition for forming peeling layer and peeling layer
CN109814336B (en) * 2019-01-21 2022-05-17 深圳市道尔顿电子材料有限公司 Alkali-soluble negative photosensitive polyimide resin composition

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000043439A1 (en) * 1999-01-21 2000-07-27 Asahi Kasei Kabushiki Kaisha Polyamic acid ester
JP2003316002A (en) * 2002-04-22 2003-11-06 Hitachi Chemical Dupont Microsystems Ltd Photosensitive resin composition, method for producing pattern using the same and electronic parts
JP2004085637A (en) * 2002-08-23 2004-03-18 Kyocera Chemical Corp Photosensitive resin composition and its manufacturing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000043439A1 (en) * 1999-01-21 2000-07-27 Asahi Kasei Kabushiki Kaisha Polyamic acid ester
JP2003316002A (en) * 2002-04-22 2003-11-06 Hitachi Chemical Dupont Microsystems Ltd Photosensitive resin composition, method for producing pattern using the same and electronic parts
JP2004085637A (en) * 2002-08-23 2004-03-18 Kyocera Chemical Corp Photosensitive resin composition and its manufacturing method

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015127817A (en) * 2009-04-14 2015-07-09 日立化成デュポンマイクロシステムズ株式会社 Photosensitive resin composition and circuit formation substrate using the same
JP2010266843A (en) * 2009-04-14 2010-11-25 Hitachi Chemical Dupont Microsystems Ltd Photosensitive resin composition and circuit formation substrate using the same
WO2013051213A1 (en) * 2011-10-05 2013-04-11 日立化成デュポンマイクロシステムズ株式会社 Highly transparent polyimide
JP2013114008A (en) * 2011-11-28 2013-06-10 Nichigo Morton Co Ltd Photosensitive resin composition, and photoresist film using the same
WO2015125469A1 (en) * 2014-02-19 2015-08-27 日立化成デュポンマイクロシステムズ株式会社 Resin composition, cured film and patterned cured film formed from same, method for producing cured film, and method for producing patterned cured film
CN106462057A (en) * 2014-02-19 2017-02-22 日立化成杜邦微系统股份有限公司 Resin composition, cured film and patterned cured film formed from same, method for producing cured film, and method for producing patterned cured film
JPWO2015125469A1 (en) * 2014-02-19 2017-03-30 日立化成デュポンマイクロシステムズ株式会社 Resin composition, cured film and pattern cured film formed thereby, and method for producing the same
US10538627B2 (en) 2015-05-29 2020-01-21 Fujifilm Corporation Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, a semiconductor device, and method for producing polyimide precursor composition
WO2016194769A1 (en) * 2015-05-29 2016-12-08 富士フイルム株式会社 Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, semiconductor device, and method for producing polyimide precursor composition
CN107709407A (en) * 2015-05-29 2018-02-16 富士胶片株式会社 Polyimide precursor composition, photosensitive polymer combination, cured film, the manufacture method of cured film, the manufacture method of semiconductor devices and polyimide precursor composition
JPWO2016194769A1 (en) * 2015-05-29 2018-03-15 富士フイルム株式会社 Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, semiconductor device and method for producing polyimide precursor composition
CN107709407B (en) * 2015-05-29 2020-11-17 富士胶片株式会社 Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, semiconductor device, and method for producing polyimide precursor composition
JP2018169627A (en) * 2016-08-22 2018-11-01 旭化成株式会社 Photosensitive resin composition and method for producing cured relief pattern
WO2020150918A1 (en) * 2019-01-23 2020-07-30 律胜科技股份有限公司 Photosensitive resin composition and use thereof
CN110431483A (en) * 2019-01-23 2019-11-08 律胜科技股份有限公司 Photosensitive polymer combination and its application
CN110431483B (en) * 2019-01-23 2022-02-11 律胜科技股份有限公司 Photosensitive resin composition and its application
JP2023155261A (en) * 2020-06-08 2023-10-20 住友ベークライト株式会社 Photosensitive resin composition, method for manufacturing electronic device and electronic device
JP7647809B2 (en) 2020-06-08 2025-03-18 住友ベークライト株式会社 Photosensitive resin composition, method for producing electronic device, and electronic device
CN114685792A (en) * 2020-12-31 2022-07-01 财团法人工业技术研究院 Polymer and resin composition comprising same
JP2023023187A (en) * 2021-08-04 2023-02-16 旭化成株式会社 Photosensitive resin composition and semiconductor device
CN114316263A (en) * 2022-01-17 2022-04-12 深圳职业技术学院 Cross-linked polyamic acid ester, method for producing same, polyimide composition containing same, and method for producing polyimide resin film
CN114316263B (en) * 2022-01-17 2023-02-03 深圳职业技术学院 Cross-linked polyamic acid ester, method for producing same, polyimide composition containing same, and method for producing polyimide resin film

Also Published As

Publication number Publication date
TWI369583B (en) 2012-08-01
TW200907567A (en) 2009-02-16
JPWO2008123583A1 (en) 2010-07-15
JP5043932B2 (en) 2012-10-10

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