WO2009044666A1 - 感放射線性組成物 - Google Patents
感放射線性組成物 Download PDFInfo
- Publication number
- WO2009044666A1 WO2009044666A1 PCT/JP2008/067389 JP2008067389W WO2009044666A1 WO 2009044666 A1 WO2009044666 A1 WO 2009044666A1 JP 2008067389 W JP2008067389 W JP 2008067389W WO 2009044666 A1 WO2009044666 A1 WO 2009044666A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- radiation
- sensitive composition
- repeating unit
- represented
- general formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
Abstract
下記一般式(1-1)で表される繰り返し単位(1)、下記一般式(1-2)で表される繰り返し単位(2)、及び酸解離性基を有する繰り返し単位(3)を含む重合体(A)と、感放射線性酸発生剤(B)と、を含有する感放射線性組成物である。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009536024A JP5077353B2 (ja) | 2007-10-01 | 2008-09-26 | 感放射線性組成物 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-257633 | 2007-10-01 | ||
| JP2007257633 | 2007-10-01 | ||
| JP2007-334726 | 2007-12-26 | ||
| JP2007334726 | 2007-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009044666A1 true WO2009044666A1 (ja) | 2009-04-09 |
Family
ID=40526095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/067389 Ceased WO2009044666A1 (ja) | 2007-10-01 | 2008-09-26 | 感放射線性組成物 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5077353B2 (ja) |
| TW (1) | TW200923579A (ja) |
| WO (1) | WO2009044666A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011108665A1 (ja) * | 2010-03-04 | 2011-09-09 | Jsr株式会社 | 感放射線性樹脂組成物及びレジストパターン形成方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111747966A (zh) * | 2020-06-16 | 2020-10-09 | 徐州博康信息化学品有限公司 | 一种三氟磺酰胺2-氧杂二环[2.2.1]庚烷类光刻胶树脂单体及其制备方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003270787A (ja) * | 2002-03-15 | 2003-09-25 | Jsr Corp | 感放射線性樹脂組成物 |
| JP2003342323A (ja) * | 2002-05-28 | 2003-12-03 | Everlight Usa Inc | 化学増幅型ホトレジスト組成物の樹脂 |
| JP2003345025A (ja) * | 2002-05-28 | 2003-12-03 | Everlight Usa Inc | 化学増幅型ホトレジスト組成物 |
| JP2005060638A (ja) * | 2003-08-20 | 2005-03-10 | Mitsubishi Rayon Co Ltd | 重合体、製造方法、レジスト組成物およびパターン形成法 |
| JP2006349940A (ja) * | 2005-06-15 | 2006-12-28 | Tokyo Ohka Kogyo Co Ltd | ポジ型レジスト組成物およびレジストパターン形成方法 |
-
2008
- 2008-09-26 JP JP2009536024A patent/JP5077353B2/ja not_active Expired - Fee Related
- 2008-09-26 TW TW97137305A patent/TW200923579A/zh unknown
- 2008-09-26 WO PCT/JP2008/067389 patent/WO2009044666A1/ja not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003270787A (ja) * | 2002-03-15 | 2003-09-25 | Jsr Corp | 感放射線性樹脂組成物 |
| JP2003342323A (ja) * | 2002-05-28 | 2003-12-03 | Everlight Usa Inc | 化学増幅型ホトレジスト組成物の樹脂 |
| JP2003345025A (ja) * | 2002-05-28 | 2003-12-03 | Everlight Usa Inc | 化学増幅型ホトレジスト組成物 |
| JP2005060638A (ja) * | 2003-08-20 | 2005-03-10 | Mitsubishi Rayon Co Ltd | 重合体、製造方法、レジスト組成物およびパターン形成法 |
| JP2006349940A (ja) * | 2005-06-15 | 2006-12-28 | Tokyo Ohka Kogyo Co Ltd | ポジ型レジスト組成物およびレジストパターン形成方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011108665A1 (ja) * | 2010-03-04 | 2011-09-09 | Jsr株式会社 | 感放射線性樹脂組成物及びレジストパターン形成方法 |
| JPWO2011108665A1 (ja) * | 2010-03-04 | 2013-06-27 | Jsr株式会社 | 感放射線性樹脂組成物及びレジストパターン形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200923579A (en) | 2009-06-01 |
| JPWO2009044666A1 (ja) | 2011-02-03 |
| JP5077353B2 (ja) | 2012-11-21 |
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