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WO2008123036A1 - 金属張積層体及び金属張積層体の製造方法 - Google Patents

金属張積層体及び金属張積層体の製造方法 Download PDF

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Publication number
WO2008123036A1
WO2008123036A1 PCT/JP2008/054859 JP2008054859W WO2008123036A1 WO 2008123036 A1 WO2008123036 A1 WO 2008123036A1 JP 2008054859 W JP2008054859 W JP 2008054859W WO 2008123036 A1 WO2008123036 A1 WO 2008123036A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
clad laminate
film
layer
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/054859
Other languages
English (en)
French (fr)
Inventor
Satoru Zama
Kenichi Ohga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008066175A external-priority patent/JP4383487B2/ja
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to CN2008800080314A priority Critical patent/CN101631670B/zh
Publication of WO2008123036A1 publication Critical patent/WO2008123036A1/ja
Priority to US12/556,143 priority patent/US8147904B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

　フィルムと下地層と上部層からなる金属層とを有した金属張積層体の製造方法であって、（ａ）前記フィルムの表面の少なくとも一部に、めっきにより前記下地層を形成する工程と、（ｂ）前記工程（ａ）により形成された第１積層体に、めっきにより前記上部層を形成する工程と、（ｃ）前記工程（ｂ）により形成された第２積層体に、熱処理を行う工程とを備え、前記フィルムは可とう性を有する熱可塑性の高分子フィルムであり、前記下地層はニッケル合金であり、前記上部層は銅であり、前記工程（ａ）と前記工程（ｂ）により形成されるめっき皮膜は、前記（ｃ）工程前に圧縮応力を有し、前記工程（ｃ）により金属張積層体がフィルム平面方向に収縮する金属張積層体の製造方法。
PCT/JP2008/054859 2007-03-19 2008-03-17 金属張積層体及び金属張積層体の製造方法 Ceased WO2008123036A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800080314A CN101631670B (zh) 2007-03-19 2008-03-17 贴金属箔层叠体及贴金属箔层叠体的制造方法
US12/556,143 US8147904B2 (en) 2007-03-19 2009-09-09 Metal clad laminate and method for manufacturing metal clad laminate

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007071143 2007-03-19
JP2007-071143 2007-03-19
JP2008066175A JP4383487B2 (ja) 2007-03-19 2008-03-14 金属張積層体及び金属張積層体の製造方法
JP2008-066175 2008-03-14

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/556,143 Continuation US8147904B2 (en) 2007-03-19 2009-09-09 Metal clad laminate and method for manufacturing metal clad laminate

Publications (1)

Publication Number Publication Date
WO2008123036A1 true WO2008123036A1 (ja) 2008-10-16

Family

ID=39830538

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054859 Ceased WO2008123036A1 (ja) 2007-03-19 2008-03-17 金属張積層体及び金属張積層体の製造方法

Country Status (1)

Country Link
WO (1) WO2008123036A1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05129377A (ja) * 1991-10-31 1993-05-25 Sumitomo Metal Mining Co Ltd 銅ポリイミド基板の製造方法
JPH07243085A (ja) * 1994-03-03 1995-09-19 Sumitomo Metal Mining Co Ltd 金属被覆ポリイミド基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05129377A (ja) * 1991-10-31 1993-05-25 Sumitomo Metal Mining Co Ltd 銅ポリイミド基板の製造方法
JPH07243085A (ja) * 1994-03-03 1995-09-19 Sumitomo Metal Mining Co Ltd 金属被覆ポリイミド基板の製造方法

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