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WO2006112474A3 - 繊維－樹脂複合体、積層体、およびプリント配線板、並びにプリント配線板の製造方法 - Google Patents

繊維－樹脂複合体、積層体、およびプリント配線板、並びにプリント配線板の製造方法 Download PDF

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Publication number
WO2006112474A3
WO2006112474A3 PCT/JP2006/308210 JP2006308210W WO2006112474A3 WO 2006112474 A3 WO2006112474 A3 WO 2006112474A3 JP 2006308210 W JP2006308210 W JP 2006308210W WO 2006112474 A3 WO2006112474 A3 WO 2006112474A3
Authority
WO
WIPO (PCT)
Prior art keywords
copper
wiring board
printed wiring
layer
fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2006/308210
Other languages
English (en)
French (fr)
Other versions
WO2006112474A2 (ja
Inventor
Kanji Shimoosako
Takashi Ito
Shigeru Tanaka
Masaru Nishinaka
Mutsuaki Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaneka Corp
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005142422A external-priority patent/JP2006319239A/ja
Priority claimed from JP2005350031A external-priority patent/JP2007157950A/ja
Application filed by Kaneka Corp filed Critical Kaneka Corp
Priority to US11/918,722 priority Critical patent/US20090025966A1/en
Publication of WO2006112474A2 publication Critical patent/WO2006112474A2/ja
Anticipated expiration legal-status Critical
Publication of WO2006112474A3 publication Critical patent/WO2006112474A3/ja
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/02—Coating on the layer surface on fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31507—Of polycarbonate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)

Abstract

　本発明は、信頼性の高い微細配線形成に資する、平滑な表面に強固に銅箔が形成された銅張積層板、積層体、無電解めっき用材料、および繊維－樹脂複合体、並びにこれらを用いてなるプリント配線板を提供する。また本発明は、微細配線を精度よく形成できる多層プリント配線板の製造方法、および当該製造方法によって得られる多層プリント配線板を提供する。本発明の銅張積層板は、めっき銅層（１）と、樹脂層（２）と、繊維と樹脂との複合体層（３）と、を備え、少なくとも、めっき銅層（１）と樹脂層（２）とは接して積層されている。上記銅張積層板（１０）は、銅箔と良好な接着性を有する樹脂層上にめっき銅層が形成された構成である。このため、平滑な表面であっても樹脂層と銅箔とを強固に密着させることができる。それゆえ、従来の銅張積層板と比べて、信頼性の高い微細配線形成を行うことができる。
PCT/JP2006/308210 2005-04-19 2006-04-19 繊維－樹脂複合体、積層体、およびプリント配線板、並びにプリント配線板の製造方法 Ceased WO2006112474A2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/918,722 US20090025966A1 (en) 2005-04-19 2006-04-19 Fiber-resin composite, laminate, printed wiring board, and method for manufacturing printed wiring board

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2005-121610 2005-04-19
JP2005121610 2005-04-19
JP2005-142422 2005-05-16
JP2005142422A JP2006319239A (ja) 2005-05-16 2005-05-16 積層体及びプリント配線板
JP2005-206949 2005-07-15
JP2005207762 2005-07-15
JP2005-207762 2005-07-15
JP2005206949 2005-07-15
JP2005350031A JP2007157950A (ja) 2005-12-02 2005-12-02 多層プリント配線板の製造方法及び多層プリント配線板
JP2005-350031 2005-12-02

Publications (2)

Publication Number Publication Date
WO2006112474A2 WO2006112474A2 (ja) 2006-10-26
WO2006112474A3 true WO2006112474A3 (ja) 2007-11-15

Family

ID=37115578

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/308210 Ceased WO2006112474A2 (ja) 2005-04-19 2006-04-19 繊維－樹脂複合体、積層体、およびプリント配線板、並びにプリント配線板の製造方法

Country Status (4)

Country Link
US (1) US20090025966A1 (ja)
KR (1) KR101210800B1 (ja)
TW (1) TWI409167B (ja)
WO (1) WO2006112474A2 (ja)

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ES2405979T3 (es) * 2007-04-06 2013-06-04 Taisei Plas Co., Ltd. Material compuesto de aleación de cobre y procedimiento para fabricarlo
US7969005B2 (en) * 2007-04-27 2011-06-28 Sanyo Electric Co., Ltd. Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor
KR100882261B1 (ko) 2007-07-25 2009-02-06 삼성전기주식회사 인쇄회로기판의 제조 방법 및 장치
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TWI398355B (zh) * 2010-10-21 2013-06-11 Advanced Int Multitech Co Ltd Manufacturing method of composite workpiece for embedded metal parts
KR101936449B1 (ko) * 2011-03-28 2019-01-08 히타치가세이가부시끼가이샤 다층 수지 시트, 수지 시트 적층체, 다층 수지 시트 경화물 및 그 제조 방법, 금속박이 형성된 다층 수지 시트, 그리고 반도체 장치
JP6144003B2 (ja) * 2011-08-29 2017-06-07 富士通株式会社 配線構造及びその製造方法並びに電子装置及びその製造方法
US20140004352A1 (en) * 2012-06-29 2014-01-02 Integran Technologies Inc. Metal-clad hybrid article having synergistic mechanical properties
KR101782347B1 (ko) * 2014-12-22 2017-09-27 인텔 코포레이션 반도체 패키징을 위한 다층 기판
KR20170025510A (ko) 2015-08-28 2017-03-08 김명준 다층 구조를 갖는 크랙 방지형 인쇄회로기판
TWI580563B (zh) * 2016-09-09 2017-05-01 敬鵬工業股份有限公司 銅箔基板疊成結構
CN112239554A (zh) * 2019-07-19 2021-01-19 北京化工大学 聚酰亚胺预浸料以及制备方法和复合材料
JP7031955B2 (ja) * 2019-09-10 2022-03-08 Ｆｉｃｔ株式会社 回路基板の製造方法
KR102610863B1 (ko) * 2022-03-07 2023-12-05 한국섬유개발연구원 방열기능이 향상된 고주파 전자부품용 연성 하이브리드 박막 시트
TWI896923B (zh) * 2023-01-04 2025-09-11 亞洲電材股份有限公司 複合膜及其製造方法

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Also Published As

Publication number Publication date
KR101210800B1 (ko) 2012-12-10
TW200702162A (en) 2007-01-16
WO2006112474A2 (ja) 2006-10-26
TWI409167B (zh) 2013-09-21
US20090025966A1 (en) 2009-01-29
KR20080003833A (ko) 2008-01-08

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