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TW200634182A - Copper foil for polyimide copper layer-built panel, polyimide copper layer-built panel and polyimide flexible printed circuit board - Google Patents

Copper foil for polyimide copper layer-built panel, polyimide copper layer-built panel and polyimide flexible printed circuit board

Info

Publication number
TW200634182A
TW200634182A TW095104047A TW95104047A TW200634182A TW 200634182 A TW200634182 A TW 200634182A TW 095104047 A TW095104047 A TW 095104047A TW 95104047 A TW95104047 A TW 95104047A TW 200634182 A TW200634182 A TW 200634182A
Authority
TW
Taiwan
Prior art keywords
layer
polyimide
clad laminate
copper foil
copper clad
Prior art date
Application number
TW095104047A
Other languages
Chinese (zh)
Other versions
TWI394870B (en
Inventor
Takami Moteki
Akitoshi Suzuki
Yuuji Suzuki
Sadao Matsumoto
Original Assignee
Furukawa Circuit Foil
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Circuit Foil filed Critical Furukawa Circuit Foil
Publication of TW200634182A publication Critical patent/TW200634182A/en
Application granted granted Critical
Publication of TWI394870B publication Critical patent/TWI394870B/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
    • H04W88/02—Terminal devices
    • H04W88/04—Terminal devices adapted for relaying to or from another terminal or user
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W8/00—Network data management
    • H04W8/26—Network addressing or numbering for mobility support
    • H04W8/28—Number portability ; Network address portability
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W84/00—Network topologies
    • H04W84/18—Self-organising networks, e.g. ad-hoc networks or sensor networks
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W92/00—Interfaces specially adapted for wireless communication networks
    • H04W92/16—Interfaces between hierarchically similar devices
    • H04W92/18—Interfaces between hierarchically similar devices between terminal devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Databases & Information Systems (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

To provide a polyimide flexible copper clad laminate which has a high adhesive strength between a copper foil and a polyimide resin layer and has a superior insulation reliability, etching characteristics at the time of forming a wiring pattern, and bending property; and also to provide the copper foil for the polyimide flexible copper clad laminate and a polyimide flexible printed wiring board made by processing the copper clad laminate. At least the surface of the copper foil consisting of a granular crystalline structure which is in contact with the polyimide resin layer is formed with a surface treatment layer. The surface treatment layer is a Ni layer and/or a Ni alloy layer which has the Ni content of 0.03 to 3.0 mg/dm<SP>2</SP>; or a chromate layer, a Cr layer and/or a Cr alloy layer which has the Cr content of 0.03 to 1.0mg/dm<SP>2</SP>, or formed onto the above-mentioned Ni layer and/or Ni alloy layer, and formed onto the above-mentioned chromate layer, Cr layer or Cr alloy layer whose lower layer is Ni layer and/or Ni alloy layer. The copper clad laminate is provided with the surface-treated copper foil which is bonded to the polyimide resin layer to constitute the flexible copper clad laminate, the flexible copper clad laminate using the copper foil, and the polyimide flexible printed wiring board made by processing the copper clad laminate.
TW095104047A 2005-02-09 2006-02-07 A polyimide-based flexible copper foil laminated sheet copper foil, a polyimide-based flexible copper foil laminated sheet, and a polyimide-based flexible printed wiring board TWI394870B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005032631A JP2006222185A (en) 2005-02-09 2005-02-09 Polyimide flexible copper clad laminate, copper foil therefor, and polyimide flexible printed wiring board

Publications (2)

Publication Number Publication Date
TW200634182A true TW200634182A (en) 2006-10-01
TWI394870B TWI394870B (en) 2013-05-01

Family

ID=36919361

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095104047A TWI394870B (en) 2005-02-09 2006-02-07 A polyimide-based flexible copper foil laminated sheet copper foil, a polyimide-based flexible copper foil laminated sheet, and a polyimide-based flexible printed wiring board

Country Status (4)

Country Link
JP (1) JP2006222185A (en)
KR (1) KR101208310B1 (en)
CN (1) CN1819741A (en)
TW (1) TWI394870B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414215B (en) * 2009-06-30 2013-11-01 Ｊｘ日鑛日石金屬股份有限公司 A copper foil for printed wiring board and a method for manufacturing the same, a copper clad sheet having the copper foil, and a printed wiring board
TWI421026B (en) * 2008-02-14 2013-12-21 Asia Electronic Material Co A mask structure and a flexible printed circuit board having the mask structure
US8808873B2 (en) 2010-10-21 2014-08-19 Industrial Technology Research Institute Carrier-attached copper foil and method for manufacturing the same

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4943450B2 (en) * 2006-11-29 2012-05-30 Ｊｘ日鉱日石金属株式会社 2-layer copper-clad laminate
JP2008248269A (en) * 2007-03-29 2008-10-16 Hitachi Chem Co Ltd Copper surface treatment method, and wiring board using the method
JP5181618B2 (en) * 2007-10-24 2013-04-10 宇部興産株式会社 Metal foil laminated polyimide resin substrate
JP5215631B2 (en) * 2007-10-24 2013-06-19 三井金属鉱業株式会社 Surface treated copper foil
KR100974368B1 (en) * 2008-03-26 2010-08-05 엘에스엠트론 주식회사 Copper foil for printed circuits with improved color difference and peel strength
KR101288641B1 (en) 2008-11-25 2013-07-22 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Copper foil for printed circuit
JP5712349B2 (en) * 2009-04-23 2015-05-07 パナソニックＩｐマネジメント株式会社 Method for producing flexible laminate
JP5723770B2 (en) * 2009-06-05 2015-05-27 Jx日鉱日石金属株式会社 Copper foil for semiconductor package substrate and substrate for semiconductor package
WO2011024286A1 (en) 2009-08-28 2011-03-03 トヨタ自動車株式会社 Battery, vehicle and battery-mounted device
TWI408049B (en) * 2010-11-17 2013-09-11 Jx Nippon Mining & Metals Corp Copper foil for printed wiring board
WO2012066658A1 (en) * 2010-11-17 2012-05-24 Jx日鉱日石金属株式会社 Copper foil for printed wiring board
KR101771662B1 (en) * 2012-12-21 2017-08-25 에스케이이노베이션 주식회사 Flexible metal clad laminate including a fluorinated polyimide resin layer
JP5576514B2 (en) * 2013-01-11 2014-08-20 Ｊｘ日鉱日石金属株式会社 Surface-treated copper foil, laminated board, printed wiring board and printed circuit board
US9673646B1 (en) * 2016-08-19 2017-06-06 Chang Chun Petrochemical Co., Ltd. Surface-treated electrolytic copper foil and method for wireless charging of flexible printed circuit board
CN114401583A (en) * 2022-01-06 2022-04-26 苏州邦皓电子新材料有限公司 Copper foil substrate for flexible circuit board and preparation method thereof

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
JP3292774B2 (en) * 1994-02-15 2002-06-17 三井金属鉱業株式会社 Copper foil for printed wiring board and method for producing the same
JPH08125295A (en) * 1994-10-20 1996-05-17 Mitsui Toatsu Chem Inc Metal base circuit board
JPH08296082A (en) * 1995-04-21 1996-11-12 Nikko Gould Foil Kk Production of copper foil for printed circuit
JP2000340911A (en) * 1999-05-25 2000-12-08 Mitsui Mining & Smelting Co Ltd Copper foil for printed wiring boards
GB2361713B (en) * 2000-04-14 2003-09-24 Fukuda Metal Foil Powder Method for surface treatment of copper foil
JP3342479B2 (en) * 2000-04-14 2002-11-11 福田金属箔粉工業株式会社 Copper foil surface treatment method
JP3374127B2 (en) * 2000-11-27 2003-02-04 古河サーキットフォイル株式会社 Metal foil, laminated board for circuit boards using it
JP2002280684A (en) * 2001-03-16 2002-09-27 Sumitomo Electric Printed Circuit Inc Copper clad flexible circuit board and its manufacturing method
JP2003324258A (en) * 2002-05-01 2003-11-14 Nippon Mektron Ltd Copper-clad board for printed wiring board
JP2004241427A (en) * 2003-02-03 2004-08-26 Kyocera Corp Manufacturing method of wiring board
JP2004263300A (en) * 2003-02-12 2004-09-24 Furukawa Techno Research Kk Copper foil for fine pattern printed wiring and manufacturing method thereof
JP4273309B2 (en) * 2003-05-14 2009-06-03 福田金属箔粉工業株式会社 Low rough surface electrolytic copper foil and method for producing the same
JP4202840B2 (en) * 2003-06-26 2008-12-24 日鉱金属株式会社 Copper foil and method for producing the same
JP2005023340A (en) * 2003-06-30 2005-01-27 Nihon Kagaku Sangyo Co Ltd Etching method for printed circuit board and etching liquid

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI421026B (en) * 2008-02-14 2013-12-21 Asia Electronic Material Co A mask structure and a flexible printed circuit board having the mask structure
TWI414215B (en) * 2009-06-30 2013-11-01 Ｊｘ日鑛日石金屬股份有限公司 A copper foil for printed wiring board and a method for manufacturing the same, a copper clad sheet having the copper foil, and a printed wiring board
US8808873B2 (en) 2010-10-21 2014-08-19 Industrial Technology Research Institute Carrier-attached copper foil and method for manufacturing the same

Also Published As

Publication number Publication date
CN1819741A (en) 2006-08-16
KR101208310B1 (en) 2012-12-05
TWI394870B (en) 2013-05-01
KR20060090619A (en) 2006-08-14
JP2006222185A (en) 2006-08-24

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