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WO2008123036A1 - Metal-clad laminate, and method for production of metal-clad laminate - Google Patents

Metal-clad laminate, and method for production of metal-clad laminate Download PDF

Info

Publication number
WO2008123036A1
WO2008123036A1 PCT/JP2008/054859 JP2008054859W WO2008123036A1 WO 2008123036 A1 WO2008123036 A1 WO 2008123036A1 JP 2008054859 W JP2008054859 W JP 2008054859W WO 2008123036 A1 WO2008123036 A1 WO 2008123036A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
clad laminate
film
layer
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/054859
Other languages
French (fr)
Japanese (ja)
Inventor
Satoru Zama
Kenichi Ohga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008066175A external-priority patent/JP4383487B2/en
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to CN2008800080314A priority Critical patent/CN101631670B/en
Publication of WO2008123036A1 publication Critical patent/WO2008123036A1/en
Priority to US12/556,143 priority patent/US8147904B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

Disclosed is a method for producing a metal-clad laminate comprising a film and a metal layer composed of an under layer and an upper layer. The method comprises the steps of: (a) forming the under layer on at least a part of the surface of the film by plating; (b) forming the upper layer on a first laminate produced in the step (a) by plating; and (c) thermally treating a second laminate formed in the step (b), wherein the film is a thermoplastic polymer film having flexibility, the under layer is composed of a nickel alloy, the upper layer is composed of copper, the plated films formed by the steps (a) and (b) have compressive stress before the step (c) is carried out, and the metal-clad laminate is shrunk in the direction of the film plane in the step (c).
PCT/JP2008/054859 2007-03-19 2008-03-17 Metal-clad laminate, and method for production of metal-clad laminate Ceased WO2008123036A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800080314A CN101631670B (en) 2007-03-19 2008-03-17 Metal-clad laminate, and method for production of metal-clad laminate
US12/556,143 US8147904B2 (en) 2007-03-19 2009-09-09 Metal clad laminate and method for manufacturing metal clad laminate

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-071143 2007-03-19
JP2007071143 2007-03-19
JP2008066175A JP4383487B2 (en) 2007-03-19 2008-03-14 Metal-clad laminate and method for producing metal-clad laminate
JP2008-066175 2008-03-14

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/556,143 Continuation US8147904B2 (en) 2007-03-19 2009-09-09 Metal clad laminate and method for manufacturing metal clad laminate

Publications (1)

Publication Number Publication Date
WO2008123036A1 true WO2008123036A1 (en) 2008-10-16

Family

ID=39830538

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054859 Ceased WO2008123036A1 (en) 2007-03-19 2008-03-17 Metal-clad laminate, and method for production of metal-clad laminate

Country Status (1)

Country Link
WO (1) WO2008123036A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05129377A (en) * 1991-10-31 1993-05-25 Sumitomo Metal Mining Co Ltd Method of manufacturing copper polyimide substrate
JPH07243085A (en) * 1994-03-03 1995-09-19 Sumitomo Metal Mining Co Ltd Method for manufacturing metal-coated polyimide substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05129377A (en) * 1991-10-31 1993-05-25 Sumitomo Metal Mining Co Ltd Method of manufacturing copper polyimide substrate
JPH07243085A (en) * 1994-03-03 1995-09-19 Sumitomo Metal Mining Co Ltd Method for manufacturing metal-coated polyimide substrate

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