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WO2008102853A1 - エポキシ樹脂組成物、プリプレグ、積層板、及びプリント配線板 - Google Patents

エポキシ樹脂組成物、プリプレグ、積層板、及びプリント配線板 Download PDF

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Publication number
WO2008102853A1
WO2008102853A1 PCT/JP2008/052996 JP2008052996W WO2008102853A1 WO 2008102853 A1 WO2008102853 A1 WO 2008102853A1 JP 2008052996 W JP2008052996 W JP 2008052996W WO 2008102853 A1 WO2008102853 A1 WO 2008102853A1
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WO
WIPO (PCT)
Prior art keywords
epoxy resin
resin composition
curing agent
prepreg
laminates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/052996
Other languages
English (en)
French (fr)
Inventor
Kentaro Fujino
Tomoaki Sawada
Mitsuyoshi Nishino
Takashi Shinpo
Yoshihiko Nakamura
Mao Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Panasonic Electric Works Co Ltd
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Electric Works Co Ltd, Matsushita Electric Works Ltd filed Critical Panasonic Electric Works Co Ltd
Priority to EP20080720788 priority Critical patent/EP2113524A4/en
Priority to US12/527,853 priority patent/US20100096173A1/en
Priority to CN200880005829.3A priority patent/CN101616949B/zh
Publication of WO2008102853A1 publication Critical patent/WO2008102853A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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    • B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
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    • B32B29/005—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to another layer of paper or cardboard layer
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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    • C08G59/621—Phenols
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    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • H—ELECTRICITY
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Textile Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

　本発明は、エポキシ樹脂組成物を材料として製造される積層板の厚み方向の熱膨張係数が低減されることでこの積層板の寸法安定性が良好となり、積層板の孔あけ加工性が良好となり、硬化物の接着性が高く維持されることで、積層板の孔あけ加工時のクラックの発生が抑制され、このクラックの発生に伴う積層板へのメッキ液の染み込みが低減することが可能となる、改善されたエポキシ樹脂組成物等を提供する。このエポキシ樹脂組成物は、次の成分；（Ａ）エポキシ樹脂、（Ｂ）フェノール類ノボラック樹脂硬化剤又はアミン系硬化剤からなる硬化剤、（Ｃ）水酸化アルミニウム、又は球状シリカ及び水酸化アルミニウムを含む無機充填材、（Ｄ）コアシェル構造を有しシェル部分が上記エポキシ樹脂（Ａ）と相溶する樹脂で構成されている微粒子からなる可とう成分を含有する。上記エポキシ樹脂組成物の硬化状態での厚み（Ｚ）方向の熱膨張係数αＺが４８以下である。
PCT/JP2008/052996 2007-02-23 2008-02-21 エポキシ樹脂組成物、プリプレグ、積層板、及びプリント配線板 Ceased WO2008102853A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP20080720788 EP2113524A4 (en) 2007-02-23 2008-02-21 EPOXY RESIN COMPOSITION, PREPREG, LAMINATES AND PCB
US12/527,853 US20100096173A1 (en) 2007-02-23 2008-02-21 Epoxy resin composition, prepreg, and laminate and printed wiring board
CN200880005829.3A CN101616949B (zh) 2007-02-23 2008-02-21 环氧树脂组合物、预浸渍体、层合板和印刷配线板

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-044658 2007-02-23
JP2007044658 2007-02-23
JP2007221775 2007-08-28
JP2007-221775 2007-08-28

Publications (1)

Publication Number Publication Date
WO2008102853A1 true WO2008102853A1 (ja) 2008-08-28

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PCT/JP2008/052996 Ceased WO2008102853A1 (ja) 2007-02-23 2008-02-21 エポキシ樹脂組成物、プリプレグ、積層板、及びプリント配線板

Country Status (6)

Country Link
US (1) US20100096173A1 (ja)
EP (1) EP2113524A4 (ja)
JP (1) JP5192259B2 (ja)
CN (1) CN101616949B (ja)
TW (1) TWI365886B (ja)
WO (1) WO2008102853A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
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WO2010048297A3 (en) * 2008-10-24 2010-08-05 3M Innovative Properties Company Passive electrical article
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