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TW200745211A - Resin composition for forming insulating layer - Google Patents

Resin composition for forming insulating layer

Info

Publication number
TW200745211A
TW200745211A TW096107694A TW96107694A TW200745211A TW 200745211 A TW200745211 A TW 200745211A TW 096107694 A TW096107694 A TW 096107694A TW 96107694 A TW96107694 A TW 96107694A TW 200745211 A TW200745211 A TW 200745211A
Authority
TW
Taiwan
Prior art keywords
resin composition
insulating layer
forming insulating
resins
forming
Prior art date
Application number
TW096107694A
Other languages
Chinese (zh)
Inventor
Hirohisa Narahashi
Eiichi Hayashi
Original Assignee
Ajinomoto Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Kk filed Critical Ajinomoto Kk
Publication of TW200745211A publication Critical patent/TW200745211A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L31/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
    • C08L31/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C08L31/04—Homopolymers or copolymers of vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

Disclosed is a resin composition characterized by containing (A) a polymerized product of a bismaleimide compound and a diamine compound, (B) an epoxy resin having 2 or more epoxy groups in a molecule, (C) a curing agent and (D) one or more resins selected from phenoxy resins and polyvinyl acetal resins. This resin composition is suitable for forming an insulating layer of a multilayer printed wiring board or the like. This resin composition is excellent in heat resistance, mechanical strength and laminatability, while having low thermal expansion coefficient.
TW096107694A 2006-03-30 2007-03-06 Resin composition for forming insulating layer TW200745211A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006095579A JP2009155355A (en) 2006-03-30 2006-03-30 Resin composition for insulating layer

Publications (1)

Publication Number Publication Date
TW200745211A true TW200745211A (en) 2007-12-16

Family

ID=38563725

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096107694A TW200745211A (en) 2006-03-30 2007-03-06 Resin composition for forming insulating layer

Country Status (3)

Country Link
JP (1) JP2009155355A (en)
TW (1) TW200745211A (en)
WO (1) WO2007114464A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010100803A (en) * 2008-09-24 2010-05-06 Sekisui Chem Co Ltd Epoxy resin composition, sheet-like form, prepreg, cured product, laminated board, and multilayered laminated board
JP5407679B2 (en) * 2009-09-04 2014-02-05 日立化成株式会社 Thermosetting insulating resin composition, and insulating film with support, prepreg, laminate and multilayer printed wiring board using the same
JP5540611B2 (en) * 2009-09-04 2014-07-02 日立化成株式会社 Thermosetting insulating resin composition, and insulating film with support, prepreg, laminate and printed wiring board using the same
JP5407678B2 (en) * 2009-09-04 2014-02-05 日立化成株式会社 Thermosetting insulating resin composition, and insulating film with support, prepreg, laminate and multilayer printed wiring board using the same
JP5740940B2 (en) * 2010-11-30 2015-07-01 味の素株式会社 Method for producing metal-clad laminate
JP6136330B2 (en) * 2013-02-13 2017-05-31 味の素株式会社 Thin film resin composition, thin film, laminated sheet and multilayer printed wiring board
MY192520A (en) * 2014-07-10 2022-08-25 Isola Usa Corp Thin resin films and their use in layups
JP6191659B2 (en) * 2015-07-09 2017-09-06 味の素株式会社 Resin composition

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002179772A (en) * 2000-12-08 2002-06-26 Mitsui Mining & Smelting Co Ltd Resin compound for forming interlayer insulating layer of printed wiring board, resin sheet for forming insulating layer and copper foil with resin using the resin compound, and copper-clad laminate using the same
JP2003105205A (en) * 2001-09-28 2003-04-09 Toppan Printing Co Ltd High permittivity composite material, high permittivity film, laminated board with metal foil and printed wiring board
JP4725704B2 (en) * 2003-05-27 2011-07-13 味の素株式会社 Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg
JP4400337B2 (en) * 2003-06-27 2010-01-20 味の素株式会社 Resin composition for multilayer printed wiring board and adhesive film

Also Published As

Publication number Publication date
WO2007114464A1 (en) 2007-10-11
JP2009155355A (en) 2009-07-16

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