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WO2008102616A1 - クリーニングシート、クリーニング機能付き搬送部材及び基板処理装置のクリーニング方法 - Google Patents

クリーニングシート、クリーニング機能付き搬送部材及び基板処理装置のクリーニング方法 Download PDF

Info

Publication number
WO2008102616A1
WO2008102616A1 PCT/JP2008/051335 JP2008051335W WO2008102616A1 WO 2008102616 A1 WO2008102616 A1 WO 2008102616A1 JP 2008051335 W JP2008051335 W JP 2008051335W WO 2008102616 A1 WO2008102616 A1 WO 2008102616A1
Authority
WO
WIPO (PCT)
Prior art keywords
cleaning
substrate
processing apparatus
conveying member
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/051335
Other languages
English (en)
French (fr)
Inventor
Akira Shouji
Akihisa Murata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of WO2008102616A1 publication Critical patent/WO2008102616A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B08B1/143—Wipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)

Abstract

　基板処理装置内の搬送性および装置内に付着している異物の除去性の両者に優れているクリーニングシート、さらにはクリーニングシートを用いたクリーニング機能付き搬送部材、及び、これらを用いた基板処理装置のクリーニング方法を提供すること。支持基材の片面にクリーニング層を有し、クリーニング層が設けられていない側の支持基材の片面に粘着剤層を有するクリーニングシートであって、粘着剤層が層状珪酸塩を含有することを特徴とするクリーニングシート。
PCT/JP2008/051335 2007-02-20 2008-01-30 クリーニングシート、クリーニング機能付き搬送部材及び基板処理装置のクリーニング方法 Ceased WO2008102616A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007039631A JP2008201898A (ja) 2007-02-20 2007-02-20 クリーニングシート、クリーニング機能付き搬送部材及び基板処理装置のクリーニング方法
JP2007-039631 2007-02-20

Publications (1)

Publication Number Publication Date
WO2008102616A1 true WO2008102616A1 (ja) 2008-08-28

Family

ID=39709895

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051335 Ceased WO2008102616A1 (ja) 2007-02-20 2008-01-30 クリーニングシート、クリーニング機能付き搬送部材及び基板処理装置のクリーニング方法

Country Status (3)

Country Link
JP (1) JP2008201898A (ja)
TW (1) TW200848487A (ja)
WO (1) WO2008102616A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012136557A (ja) * 2010-12-24 2012-07-19 Dic Corp 紫外線硬化型粘着剤用樹脂組成物、粘着剤及び積層体
CN106381086A (zh) * 2016-11-14 2017-02-08 绍兴市上虞区三口胶粘制品厂 粘尘纸及其生产工艺

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023137406A (ja) * 2022-03-18 2023-09-29 株式会社ディスコ 処理装置の清掃方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001134186A (ja) * 1999-11-09 2001-05-18 Nitto Denko Corp クリーニング用ラベルシ―ト
JP2005189437A (ja) * 2003-12-25 2005-07-14 Nitto Denko Corp 感圧性接着シート付き偏光板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001134186A (ja) * 1999-11-09 2001-05-18 Nitto Denko Corp クリーニング用ラベルシ―ト
JP2005189437A (ja) * 2003-12-25 2005-07-14 Nitto Denko Corp 感圧性接着シート付き偏光板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012136557A (ja) * 2010-12-24 2012-07-19 Dic Corp 紫外線硬化型粘着剤用樹脂組成物、粘着剤及び積層体
CN106381086A (zh) * 2016-11-14 2017-02-08 绍兴市上虞区三口胶粘制品厂 粘尘纸及其生产工艺

Also Published As

Publication number Publication date
JP2008201898A (ja) 2008-09-04
TW200848487A (en) 2008-12-16

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