[go: up one dir, main page]

WO2008149949A1 - レーザー加工方法及びレーザー加工品 - Google Patents

レーザー加工方法及びレーザー加工品 Download PDF

Info

Publication number
WO2008149949A1
WO2008149949A1 PCT/JP2008/060390 JP2008060390W WO2008149949A1 WO 2008149949 A1 WO2008149949 A1 WO 2008149949A1 JP 2008060390 W JP2008060390 W JP 2008060390W WO 2008149949 A1 WO2008149949 A1 WO 2008149949A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
processing method
processed
laser light
laser processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/060390
Other languages
English (en)
French (fr)
Inventor
Kanji Nishida
Naoyuki Matsuo
Atsushi Hino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to KR1020097025177A priority Critical patent/KR101107385B1/ko
Priority to EP08765203.8A priority patent/EP2165795A4/en
Priority to US12/663,185 priority patent/US9566663B2/en
Priority to CN200880017639.3A priority patent/CN101678503B/zh
Publication of WO2008149949A1 publication Critical patent/WO2008149949A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/009—Using laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2793/00—Shaping techniques involving a cutting or machining operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Abstract

　高分子材料からなる被加工物に対してレーザー光を用いた加工を施す際に、切断異物が発生するのを抑制し、かつ被加工物の表面の汚染も低減することが可能なレーザー加工方法、及びレーザー加工品を提供する。本発明のレーザー加工方法は、高分子材料からなる被加工物に対しレーザー光を用いて加工するレーザー加工方法であって、前記レーザー光の光軸を、被加工物の垂直方向に対し所定角度で加工の進行方向に傾斜させた状態で、前記レーザー光を被加工物に照射することを特徴とする。  
PCT/JP2008/060390 2007-06-06 2008-06-05 レーザー加工方法及びレーザー加工品 Ceased WO2008149949A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020097025177A KR101107385B1 (ko) 2007-06-06 2008-06-05 레이저 가공 방법 및 레이저 가공품
EP08765203.8A EP2165795A4 (en) 2007-06-06 2008-06-05 LASER PROCESSING METHOD AND LASER TREATED ARTICLE
US12/663,185 US9566663B2 (en) 2007-06-06 2008-06-05 Laser processing method and land laser processed product
CN200880017639.3A CN101678503B (zh) 2007-06-06 2008-06-05 激光加工方法及激光加工品

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007150558A JP5202876B2 (ja) 2007-06-06 2007-06-06 レーザー加工方法及びレーザー加工品
JP2007-150558 2007-06-06

Publications (1)

Publication Number Publication Date
WO2008149949A1 true WO2008149949A1 (ja) 2008-12-11

Family

ID=40093759

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060390 Ceased WO2008149949A1 (ja) 2007-06-06 2008-06-05 レーザー加工方法及びレーザー加工品

Country Status (7)

Country Link
US (1) US9566663B2 (ja)
EP (1) EP2165795A4 (ja)
JP (1) JP5202876B2 (ja)
KR (1) KR101107385B1 (ja)
CN (1) CN101678503B (ja)
TW (1) TWI477340B (ja)
WO (1) WO2008149949A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013541421A (ja) * 2010-10-19 2013-11-14 フォージェット テクノロジーズ ゲゼルシャフト ミット ベシュレンクテル ハフツング シリンダの縦軸線を中心とする加工ヘッドの旋回によりフレキシブルな帯を彫刻する方法及び装置
WO2021186986A1 (ja) * 2020-03-16 2021-09-23 住友化学株式会社 積層シートおよびその製造方法
JP2021149087A (ja) * 2020-03-16 2021-09-27 住友化学株式会社 積層シートおよびその製造方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011121061A (ja) * 2009-12-08 2011-06-23 Mitsubishi Electric Corp レーザ加工方法および装置
KR101097324B1 (ko) * 2009-12-29 2011-12-23 삼성모바일디스플레이주식회사 레이저 커팅 방법 및 유기 발광 소자의 제조방법
JP5800486B2 (ja) * 2010-10-06 2015-10-28 住友化学株式会社 レーザー切断装置、これを備えるスリッター機、およびレーザー切断方法
JP5389068B2 (ja) * 2011-01-26 2014-01-15 三菱電機株式会社 レーザ加工方法およびレーザ加工装置
JP5737134B2 (ja) * 2011-10-21 2015-06-17 Tdk株式会社 粘着シート、表示器用部品および粘着シート製造方法
JP6029824B2 (ja) * 2011-12-06 2016-11-24 住友化学株式会社 シート材切断方法
WO2014097885A1 (ja) 2012-12-18 2014-06-26 住友化学株式会社 光学表示デバイスの生産方法及び光学表示デバイスの生産システム
JP6070403B2 (ja) 2013-05-13 2017-02-01 トヨタ自動車株式会社 レーザ表面処理方法及びレーザ表面処理装置
ITUB20154195A1 (it) * 2015-10-07 2017-04-07 Campagnolo Srl Componente di ruota di bicicletta con zona di frenatura in materiale composito e relativo procedimento di fabbricazione
KR20170133131A (ko) * 2016-05-25 2017-12-05 디앤에이 주식회사 레이저의 틸팅 조사를 이용한 기판 절단 방법 및 장치
JP6396961B2 (ja) * 2016-08-31 2018-09-26 住友化学株式会社 シート材切断方法
US20200353563A1 (en) * 2017-11-27 2020-11-12 Nitto Denko Corporation Laser processing method for plastic film, and plastic film
SG11202101856SA (en) * 2018-10-16 2021-03-30 Electro Scientific Industries Inc Frame and exterior shrouding for laser processing system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02290685A (ja) 1989-01-09 1990-11-30 Mitsubishi Electric Corp レーザ加工機
JP2001262083A (ja) 2000-03-23 2001-09-26 Nissho Kk モール材用マスキングテープ
JP2002079385A (ja) * 2000-09-05 2002-03-19 Triangle:Kk レーザ裁断方法およびレーザ裁断機

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3965328A (en) * 1974-12-19 1976-06-22 Avco Corporation Laser deep cutting process
US4537809A (en) * 1979-04-09 1985-08-27 Avery International Corporation Van label having non-linear discontinuous score lines in the backing
JPS60210388A (ja) * 1984-04-03 1985-10-22 Mitsubishi Electric Corp 板材の切断装置
US5744776A (en) * 1989-07-14 1998-04-28 Tip Engineering Group, Inc. Apparatus and for laser preweakening an automotive trim cover for an air bag deployment opening
JP3253083B2 (ja) * 1992-08-20 2002-02-04 イー・アイ・デユポン・ドウ・ヌムール・アンド・カンパニー レーザー放射線を使用して配向した重合体基質の微細構造表面を得る方法
US5800625A (en) * 1996-07-26 1998-09-01 Cauldron Limited Partnership Removal of material by radiation applied at an oblique angle
JP3860879B2 (ja) 1997-05-09 2006-12-20 大日本印刷株式会社 レーザ加工状態検出方法及びレーザ加工システム
US6525296B2 (en) * 1998-10-20 2003-02-25 Sharp Kabushiki Kaisha Method of processing and optical components
US6379604B1 (en) * 2000-03-22 2002-04-30 W. Inoac, Inc. Laser ridge skin distortion reduction method
US7016295B2 (en) * 2000-04-26 2006-03-21 Optical Disc Corporation Hybrid discs displaying certain dimensional values
US6676878B2 (en) * 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
US6620333B2 (en) * 2000-10-23 2003-09-16 The Regents Of The University Of California CO2 laser and plasma microjet process for improving laser optics
JP3383832B2 (ja) * 2000-12-25 2003-03-10 川崎重工業株式会社 レーザ照射装置
JP2003043476A (ja) * 2001-07-31 2003-02-13 Toshiba Corp 平面表示素子の製造方法
US6991695B2 (en) * 2002-05-21 2006-01-31 3M Innovative Properties Company Method for subdividing multilayer optical film cleanly and rapidly
AU2002324368A1 (en) * 2002-09-19 2004-04-08 Gert Jan Huizinga Method for laser working a film material and film material to be worked using that method.
JP4890746B2 (ja) * 2004-06-14 2012-03-07 株式会社ディスコ ウエーハの加工方法
JP4332855B2 (ja) * 2005-06-07 2009-09-16 住友電気工業株式会社 ウエッジを用いた回折型ビームホモジナイザ光学系
US7655289B2 (en) * 2005-12-12 2010-02-02 Eastman Kodak Company Optical film composite having spatially controlled adhesive strength
US8020475B2 (en) * 2006-06-02 2011-09-20 Kent Displays Incorporated Method of simultaneous singulation and edge sealing of plastic displays

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02290685A (ja) 1989-01-09 1990-11-30 Mitsubishi Electric Corp レーザ加工機
JP2001262083A (ja) 2000-03-23 2001-09-26 Nissho Kk モール材用マスキングテープ
JP2002079385A (ja) * 2000-09-05 2002-03-19 Triangle:Kk レーザ裁断方法およびレーザ裁断機

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2165795A4

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013541421A (ja) * 2010-10-19 2013-11-14 フォージェット テクノロジーズ ゲゼルシャフト ミット ベシュレンクテル ハフツング シリンダの縦軸線を中心とする加工ヘッドの旋回によりフレキシブルな帯を彫刻する方法及び装置
US9132509B2 (en) 2010-10-19 2015-09-15 4Jet Technologies Gmbh Method and apparatus for engraving a flexible strip with pivoting a processing head about a longitudinal axis of a cylinder
WO2021186986A1 (ja) * 2020-03-16 2021-09-23 住友化学株式会社 積層シートおよびその製造方法
JP2021149087A (ja) * 2020-03-16 2021-09-27 住友化学株式会社 積層シートおよびその製造方法

Also Published As

Publication number Publication date
US9566663B2 (en) 2017-02-14
JP5202876B2 (ja) 2013-06-05
US20100167076A1 (en) 2010-07-01
KR101107385B1 (ko) 2012-01-19
CN101678503A (zh) 2010-03-24
EP2165795A4 (en) 2014-01-22
KR20100007955A (ko) 2010-01-22
TW200916245A (en) 2009-04-16
JP2008302376A (ja) 2008-12-18
TWI477340B (zh) 2015-03-21
CN101678503B (zh) 2015-07-01
EP2165795A1 (en) 2010-03-24

Similar Documents

Publication Publication Date Title
WO2008149949A1 (ja) レーザー加工方法及びレーザー加工品
WO2016010954A3 (en) System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter
WO2009022550A1 (ja) フィルム及びその製造方法
MY146877A (en) Laser processing method and laser processing apparatus
WO2008014332A3 (en) Methods and apparatuses for directing an ion beam source
WO2010006067A3 (en) Method and apparatus for laser machining
SG135043A1 (en) Wafer processing method
WO2010138897A3 (en) Acousto-optic deflector applications in laser processing of dielectric or other materials
EP2353768A3 (en) Laser beam irradiation apparatus for substrate sealing, substrate sealing method, and method of manufacturing organic light emitting display device using the same
WO2008114470A1 (ja) プラスチック基板の切断方法、及びプラスチック基板の切断装置
MY183580A (en) Wafer production method
WO2012156071A8 (en) Laser material processing system with at least one inertial sensor; corresponding laser processing method
WO2009078324A1 (ja) 脆性材料基板の面取り加工方法および面取り加工装置
BR112014007649A8 (pt) Material estruturante, e, método para o tratamento de uma formação subterrânea
EP1721695A4 (en) LASER PROCESSING FACILITY
WO2009100015A3 (en) Engineering flat surfaces on materials doped via pulsed laser irradiation
BR112015009496A2 (pt) processo de observação de espécies biológicas
WO2009141168A3 (de) Vorrichtung zum fügen und tapern von fasern oder von anderen optischen bauelementen
WO2008095738A3 (de) Verfahren und vorrichtung zum laserschweissen
GB201316950D0 (en) Device and method for cutting off an end section of a can blank
WO2014130610A3 (en) Apparatus and method for forming three-dimensional objects using linear solidification
WO2007053318A3 (en) Systems and methods for generating laser light shaped as a line beam
WO2016088721A8 (ja) 基板監視装置、および、基板監視方法
WO2011130097A3 (en) Ion beam sample preparation apparatus and methods
MX2019006085A (es) Dispositivo de debilitamiento y metodo para debilitar materiales de empaque.

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880017639.3

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08765203

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20097025177

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12663185

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

REEP Request for entry into the european phase

Ref document number: 2008765203

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2008765203

Country of ref document: EP