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MX2019006085A - Dispositivo de debilitamiento y metodo para debilitar materiales de empaque. - Google Patents

Dispositivo de debilitamiento y metodo para debilitar materiales de empaque.

Info

Publication number
MX2019006085A
MX2019006085A MX2019006085A MX2019006085A MX2019006085A MX 2019006085 A MX2019006085 A MX 2019006085A MX 2019006085 A MX2019006085 A MX 2019006085A MX 2019006085 A MX2019006085 A MX 2019006085A MX 2019006085 A MX2019006085 A MX 2019006085A
Authority
MX
Mexico
Prior art keywords
laser
weakening
packaging material
unit
laser beam
Prior art date
Application number
MX2019006085A
Other languages
English (en)
Inventor
Cappel Daniel
Rempel Gerhard
Steinfels Jörg
Original Assignee
Sig Technology Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sig Technology Ag filed Critical Sig Technology Ag
Publication of MX2019006085A publication Critical patent/MX2019006085A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B—MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B50/00—Making rigid or semi-rigid containers, e.g. boxes or cartons
    • B31B50/25—Surface scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/16—Bands or sheets of indefinite length
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/40—Paper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Making Paper Articles (AREA)
  • Laser Beam Processing (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)

Abstract

Se describe e ilustra un dispositivo de debilitamiento (14) para debilitar materiales de empaque (4), en particular laminados de empaque, que tiene al menos una unidad láser (17) que comprende un láser (24) para irradiar y retirar parcialmente el material de empaque (4) que tiene un haz láser (8) y que tiene al menos un dispositivo de transporte (39) para, en particular, el transporte continuo del material de empaque (4) con respecto a la unidad láser (17), en donde la al menos una unidad láser (17) tiene al menos una óptica de enfoque (27) para enfocar el haz láser (8) en el material de empaque (4) transportado con relación al láser (24) por los medios de transporte (39). Para poder inscribir tanto líneas rectas de debilidad como formas compuestas de líneas de debilidad de manera más precisa y rápida en los materiales de empaque, se proporciona que la unidad láser (17) tenga al menos un escáner (29) para ajustar el haz láser (8) al menos en una dirección transversal a la dirección de transporte (T) para inscribir formas predeterminadas (9, 10) en el material de empaque (4) transportado más allá del láser (24), y que un interruptor de haz (26) se proporciona en la trayectoria de haz del haz láser (8) en la unidad láser (17) para transmitir el haz láser (8) opcionalmente a la óptica de enfoque (27) en una posición de revestimiento o al escáner (29) en una posición de escáner.
MX2019006085A 2016-11-30 2017-10-19 Dispositivo de debilitamiento y metodo para debilitar materiales de empaque. MX2019006085A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016123077.4A DE102016123077A1 (de) 2016-11-30 2016-11-30 Schwächungsvorrichtung und Verfahren zur Schwächung von Packstoffen
PCT/EP2017/076722 WO2018099649A1 (de) 2016-11-30 2017-10-19 Schwächungsvorrichtung und verfahren zur schwächung von packstoffen

Publications (1)

Publication Number Publication Date
MX2019006085A true MX2019006085A (es) 2019-08-21

Family

ID=60153301

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2019006085A MX2019006085A (es) 2016-11-30 2017-10-19 Dispositivo de debilitamiento y metodo para debilitar materiales de empaque.

Country Status (9)

Country Link
US (1) US20190321919A1 (es)
EP (1) EP3548269A1 (es)
JP (1) JP2020500787A (es)
CN (1) CN110139746A (es)
AU (1) AU2017368096A1 (es)
BR (1) BR112019010757A2 (es)
DE (1) DE102016123077A1 (es)
MX (1) MX2019006085A (es)
WO (1) WO2018099649A1 (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2020013367A (es) 2018-07-06 2021-03-09 Tetra Laval Holdings & Finance Material de empaquetado y metodo para proporcionar un material de empaquetado.
IT202000000787A1 (it) * 2020-01-17 2021-07-17 Sacmi Imola Sc Procedimento per la produzione e il riempimento di contenitori destinati a contenere alimenti.
DE102020131069B4 (de) 2020-11-24 2022-08-25 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Erzeugen einer Schwächungslinie in einer Oberfläche eines Bauteils; Computerprogrammprodukt sowie maschinenlesbares Speichermedium
KR20230158071A (ko) * 2021-03-17 2023-11-17 봅스트 맥스 에스에이 레이저 빔으로 카드보드를 프로세싱하기 위한 방법
KR20250103197A (ko) * 2023-12-28 2025-07-07 한국식품연구원 펨토초 레이저를 이용한 식품 포장재의 표면 개질 방법

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
ES2051829T3 (es) * 1988-09-07 1994-07-01 Leeuwarder Papier Metodo de proporcionar lineas hendidas en materia de envasado.
DE9402681U1 (de) * 1994-02-18 1994-04-21 Aesculap-Meditec GmbH, 07745 Jena Vorrichtung zur Bearbeitung von Glas, Kunststoff, Halbleitern, Holz oder Keramik mittels Laserstrahlung
DE19537467C1 (de) * 1995-10-07 1997-02-27 Pkl Verpackungssysteme Gmbh Verfahren und Vorrichtung zum Erzeugen wiederkehrender Muster in kontinuierlich bewegtem Flachmaterial durch Schneiden, Perforieren oder Beschriften mittels Laserbestrahlung
JPH09141480A (ja) * 1995-11-20 1997-06-03 Sumitomo Heavy Ind Ltd アブレーション加工方法
DE10041020A1 (de) * 2000-08-22 2002-03-07 Topack Verpacktech Gmbh Einrichtung und Verfahren zur Erzeugung wenigstens einer Schwächungslinie an einem flächigen Verpackungsmaterial und Verpackungsmaterial
EP1914168B1 (en) * 2006-10-19 2008-12-31 Tetra Laval Holdings & Finance S.A. Process of manufacturing sealed packages containing a pourable food product and packaging equipment for performing such process
US20110150371A1 (en) * 2008-07-28 2011-06-23 Sonoco Development, Inc. Flexible Pouch With Easy-Opening Features
DE102010001036A1 (de) * 2010-01-20 2011-07-21 Robert Bosch GmbH, 70469 Verfahren und Vorrichtung zur mehrfachen Nutzung von Laserquellen
PL2360099T3 (pl) * 2010-02-23 2016-01-29 Kraft Foods R & D Inc Metoda pakowania oraz opakowanie z elastycznego materiału z liniami przetłoczenia wykonanymi laserowo
CN102189710A (zh) * 2010-04-06 2011-09-21 武汉金运激光股份有限公司 一种激光切割机及包装箱的激光加工方法
DE102011116285A1 (de) * 2011-10-19 2013-04-25 Beucke & Söhne GmbH & Co. KG Packstoffzuschnitt mit Materialschwächungen
CN104646834A (zh) * 2013-11-18 2015-05-27 北京科涵龙顺激光设备有限公司 激光划片的方法及系统
EP3081372A1 (de) * 2015-04-14 2016-10-19 Mayr-Melnhof Karton AG Vorrichtung und verfahren zum herstellen von faltschachteln

Also Published As

Publication number Publication date
EP3548269A1 (de) 2019-10-09
DE102016123077A1 (de) 2018-05-30
JP2020500787A (ja) 2020-01-16
AU2017368096A1 (en) 2019-05-30
BR112019010757A2 (pt) 2019-10-01
CN110139746A (zh) 2019-08-16
US20190321919A1 (en) 2019-10-24
WO2018099649A1 (de) 2018-06-07

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