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WO2016088721A8 - 基板監視装置、および、基板監視方法 - Google Patents

基板監視装置、および、基板監視方法 Download PDF

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Publication number
WO2016088721A8
WO2016088721A8 PCT/JP2015/083630 JP2015083630W WO2016088721A8 WO 2016088721 A8 WO2016088721 A8 WO 2016088721A8 JP 2015083630 W JP2015083630 W JP 2015083630W WO 2016088721 A8 WO2016088721 A8 WO 2016088721A8
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
unit
imaging
substrate monitoring
monitoring device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/083630
Other languages
English (en)
French (fr)
Other versions
WO2016088721A1 (ja
Inventor
弘敏 阪上
哲宏 大野
基従 東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP2016562619A priority Critical patent/JP6483152B2/ja
Priority to CN201580065522.2A priority patent/CN107110793B/zh
Priority to KR1020177017975A priority patent/KR101981182B1/ko
Publication of WO2016088721A1 publication Critical patent/WO2016088721A1/ja
Anticipated expiration legal-status Critical
Publication of WO2016088721A8 publication Critical patent/WO2016088721A8/ja
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058—Kind of property studied
    • G01N2203/006—Crack, flaws, fracture or rupture

Landscapes

  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Physical Vapour Deposition (AREA)
  • Laser Beam Processing (AREA)

Abstract

所定の撮像範囲を有する撮像部（２７）と、撮像範囲内に基板（Ｓ）を配置する配置部（２６ａ）と、撮像範囲内に配置された基板（Ｓｃ（Ｓｅ１））にレーザー光線（Ｌ）を当てることによって、基板の端部（Ｓｏ（Ｓｅ１））でレーザー光線の反射光および散乱光の少なくとも一方を生じさせて、端部（Ｓｅ１）の像を撮像部（２７）の受光面に形成するように構成された照射部（２９）と、撮像部（２７）の撮像結果を監視する監視部とを備える。
PCT/JP2015/083630 2014-12-05 2015-11-30 基板監視装置、および、基板監視方法 Ceased WO2016088721A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016562619A JP6483152B2 (ja) 2014-12-05 2015-11-30 基板監視装置、および、基板監視方法
CN201580065522.2A CN107110793B (zh) 2014-12-05 2015-11-30 基板监视装置及基板监视方法
KR1020177017975A KR101981182B1 (ko) 2014-12-05 2015-11-30 기판 감시장치 및 기판 감시방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014246984 2014-12-05
JP2014-246984 2014-12-05

Publications (2)

Publication Number Publication Date
WO2016088721A1 WO2016088721A1 (ja) 2016-06-09
WO2016088721A8 true WO2016088721A8 (ja) 2017-06-22

Family

ID=56091663

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/083630 Ceased WO2016088721A1 (ja) 2014-12-05 2015-11-30 基板監視装置、および、基板監視方法

Country Status (5)

Country Link
JP (1) JP6483152B2 (ja)
KR (1) KR101981182B1 (ja)
CN (1) CN107110793B (ja)
TW (1) TWI682164B (ja)
WO (1) WO2016088721A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7010633B2 (ja) * 2017-09-19 2022-01-26 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP6963725B2 (ja) * 2017-10-13 2021-11-10 日本電気硝子株式会社 ガラス板の検査方法及び検査装置並びにガラス板の製造方法
CN108414518A (zh) * 2018-01-30 2018-08-17 珠海格力智能装备有限公司 覆膜机构及工业视觉检测装置
JP6808839B2 (ja) * 2018-04-11 2021-01-06 株式会社アルバック 基板保持装置、基板保持方法及び成膜装置
WO2020174990A1 (ja) * 2019-02-28 2020-09-03 吉野石膏株式会社 板状体の検査装置
CN111316090A (zh) * 2019-04-04 2020-06-19 合刃科技（深圳）有限公司 透明或半透明材料微观缺陷检测系统及方法
JP2025103454A (ja) 2023-12-27 2025-07-09 株式会社アルバック 異常検出装置、処理システム、および、異常検出方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07119781B2 (ja) * 1987-01-19 1995-12-20 名古屋電機工業株式会社 実装済プリント基板自動検査装置におけるフラットパッケージのブリッジ検査方法
JP3013903B2 (ja) * 1991-01-31 2000-02-28 セントラル硝子株式会社 板ガラスの欠点検出装置
JPH1030988A (ja) * 1996-07-15 1998-02-03 Hitachi Ltd 自動焦点補正方法及びその装置
JP3422935B2 (ja) * 1997-07-17 2003-07-07 Ｈｏｙａ株式会社 透光性物質の不均一性検査方法及びその装置並びに透明基板の選別方法
JPH11339042A (ja) * 1998-05-26 1999-12-10 Sanko:Kk 基板ウェハー判定装置及び判定方法
US20040196454A1 (en) * 2003-04-03 2004-10-07 Takayuki Ishiguro Optical system, detector and method for detecting peripheral surface defect of translucent disk
JP4312638B2 (ja) * 2003-04-03 2009-08-12 株式会社日立ハイテクノロジーズ 透光性ディスクの周面欠陥検出光学系、周面欠陥検出装置および周面欠陥検出方法
DE102009050711A1 (de) * 2009-10-26 2011-05-05 Schott Ag Verfahren und Vorrichtung zur Detektion von Rissen in Halbleitersubstraten
JP4884540B2 (ja) 2010-01-21 2012-02-29 東京エレクトロン株式会社 基板検査装置及び基板検査方法
JP6196078B2 (ja) * 2012-10-18 2017-09-13 株式会社アルバック 成膜装置

Also Published As

Publication number Publication date
JP6483152B2 (ja) 2019-03-13
TW201632876A (zh) 2016-09-16
KR101981182B1 (ko) 2019-05-22
CN107110793B (zh) 2021-12-10
CN107110793A (zh) 2017-08-29
KR20170093174A (ko) 2017-08-14
TWI682164B (zh) 2020-01-11
WO2016088721A1 (ja) 2016-06-09
JPWO2016088721A1 (ja) 2017-09-14

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