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WO2008143029A1 - 研磨パッドの製造方法 - Google Patents

研磨パッドの製造方法 Download PDF

Info

Publication number
WO2008143029A1
WO2008143029A1 PCT/JP2008/058619 JP2008058619W WO2008143029A1 WO 2008143029 A1 WO2008143029 A1 WO 2008143029A1 JP 2008058619 W JP2008058619 W JP 2008058619W WO 2008143029 A1 WO2008143029 A1 WO 2008143029A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
light transmissive
transmissive region
pad manufacturing
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/058619
Other languages
English (en)
French (fr)
Inventor
Masato Doura
Junji Hirose
Kenji Nakamura
Takeshi Fukuda
Akinori Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Tire Corp
Original Assignee
Toyo Tire and Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tire and Rubber Co Ltd filed Critical Toyo Tire and Rubber Co Ltd
Priority to CN2008800122548A priority Critical patent/CN101669195B/zh
Priority to US12/600,201 priority patent/US8348724B2/en
Publication of WO2008143029A1 publication Critical patent/WO2008143029A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

　スラリー漏れを防止することができ、かつ光学的検知精度に優れる研磨パッドを製造する方法を提供することを目的とする。本発明の研磨パッドの製造方法は、研磨層の研磨裏面側に光透過領域形成材料を注入するための溝を形成する工程、前記溝内に光透過領域形成材料を注入して硬化させることにより光透過領域を形成する工程、及び研磨層の研磨表面側をバフ掛けすることにより前記光透過領域を研磨表面に露出させる工程を含む。
PCT/JP2008/058619 2007-05-16 2008-05-09 研磨パッドの製造方法 Ceased WO2008143029A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800122548A CN101669195B (zh) 2007-05-16 2008-05-09 研磨垫的制造方法
US12/600,201 US8348724B2 (en) 2007-05-16 2008-05-09 Polishing pad manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-130535 2007-05-16
JP2007130535A JP4971028B2 (ja) 2007-05-16 2007-05-16 研磨パッドの製造方法

Publications (1)

Publication Number Publication Date
WO2008143029A1 true WO2008143029A1 (ja) 2008-11-27

Family

ID=40031739

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058619 Ceased WO2008143029A1 (ja) 2007-05-16 2008-05-09 研磨パッドの製造方法

Country Status (6)

Country Link
US (1) US8348724B2 (ja)
JP (1) JP4971028B2 (ja)
KR (1) KR101475767B1 (ja)
CN (1) CN101669195B (ja)
TW (1) TWI475056B (ja)
WO (1) WO2008143029A1 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
KR100960585B1 (ko) * 2005-07-15 2010-06-03 도요 고무 고교 가부시키가이샤 적층 시트 및 그 제조 방법
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
US20100009611A1 (en) * 2006-09-08 2010-01-14 Toyo Tire & Rubber Co., Ltd. Method for manufacturing a polishing pad
MY157714A (en) 2007-01-15 2016-07-15 Rohm & Haas Elect Mat Polishing pad and a method for manufacturing the same
JP5165923B2 (ja) * 2007-05-16 2013-03-21 東洋ゴム工業株式会社 研磨パッドの製造方法
JP4593643B2 (ja) * 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
KR101184705B1 (ko) * 2009-08-11 2012-09-20 엠.씨.케이 (주) Ｌｃｄ 패널 세정용 연마롤러 및 그 제조방법
KR20120112476A (ko) * 2009-12-22 2012-10-11 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 이를 이용한 화학 기계 연마 방법
KR101356402B1 (ko) * 2010-11-30 2014-01-28 한국타이어 주식회사 폴리우레탄 폼 및 이를 포함하는 공기입 타이어
US9156125B2 (en) 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
KR101971202B1 (ko) * 2012-11-22 2019-04-23 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조방법
JP2016117106A (ja) * 2014-12-18 2016-06-30 東洋ゴム工業株式会社 研磨パッド用光透過領域及びその製造方法
JP7315332B2 (ja) * 2019-01-31 2023-07-26 株式会社荏原製作所 ダミーディスクおよびダミーディスクを用いた表面高さ測定方法
US20220347815A1 (en) * 2019-09-30 2022-11-03 Fujibo Holdingus, Inc. Polishing pad and method for manufacturing same
US12138738B2 (en) * 2020-06-19 2024-11-12 Sk Enpulse Co., Ltd. Polishing pad, preparation method thereof and method for preparing semiconductor device using same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02145326A (ja) * 1988-11-28 1990-06-04 Yamau:Kk 象嵌模様入り製品の製造方法
JPH06134946A (ja) * 1992-06-24 1994-05-17 Misawa Homes Co Ltd 車輌用内装材
JP2003133270A (ja) * 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
JP2005340795A (ja) * 2004-04-28 2005-12-08 Jsr Corp 化学機械研磨パッド、その製造方法及び半導体ウエハの化学機械研磨方法
JP2006159386A (ja) * 2004-12-10 2006-06-22 Toyo Tire & Rubber Co Ltd 研磨パッド

Family Cites Families (28)

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Publication number Priority date Publication date Assignee Title
US6876454B1 (en) 1995-03-28 2005-04-05 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6719818B1 (en) 1995-03-28 2004-04-13 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US5964643A (en) 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
US6676717B1 (en) 1995-03-28 2004-01-13 Applied Materials Inc Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6537133B1 (en) 1995-03-28 2003-03-25 Applied Materials, Inc. Method for in-situ endpoint detection for chemical mechanical polishing operations
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
JP3431115B2 (ja) 1995-03-28 2003-07-28 アプライド マテリアルズ インコーポレイテッド ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法
US5605760A (en) 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6171181B1 (en) 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
US6524164B1 (en) 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
US6454630B1 (en) 1999-09-14 2002-09-24 Applied Materials, Inc. Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
US6358130B1 (en) 1999-09-29 2002-03-19 Rodel Holdings, Inc. Polishing pad
US6599765B1 (en) * 2001-12-12 2003-07-29 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
WO2004049417A1 (ja) 2002-11-27 2004-06-10 Toyo Tire & Rubber Co., Ltd. 研磨パッド及び半導体デバイスの製造方法
CN1285457C (zh) * 2002-12-06 2006-11-22 智胜科技股份有限公司 具有侦测窗口的研磨垫的制造方法
US20060189269A1 (en) 2005-02-18 2006-08-24 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US7377840B2 (en) 2004-07-21 2008-05-27 Neopad Technologies Corporation Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
TWI286964B (en) 2003-03-25 2007-09-21 Neopad Technologies Corp Customized polish pads for chemical mechanical planarization
US7238097B2 (en) * 2003-04-11 2007-07-03 Nihon Microcoating Co., Ltd. Polishing pad and method of producing same
US6984163B2 (en) 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
KR100817233B1 (ko) 2004-03-11 2008-03-27 도요 고무 고교 가부시키가이샤 연마 패드 및 반도체 디바이스의 제조 방법
DE602005000252T2 (de) 2004-04-28 2007-06-06 Jsr Corp. Kissen zum chemisch-mechanischen Polieren, Herstellungsverfahren dafür und chemisch-mechanisches Polierverfahren für Halbleiterwafer
KR101107044B1 (ko) 2004-12-10 2012-01-25 도요 고무 고교 가부시키가이샤 연마 패드 및 연마 패드의 제조 방법
WO2006089293A1 (en) 2005-02-18 2006-08-24 Neopad Technologies Corporation Customized polishing pads for cmp and methods of fabrication and use thereof
TWI385050B (zh) 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
US7210980B2 (en) 2005-08-26 2007-05-01 Applied Materials, Inc. Sealed polishing pad, system and methods

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02145326A (ja) * 1988-11-28 1990-06-04 Yamau:Kk 象嵌模様入り製品の製造方法
JPH06134946A (ja) * 1992-06-24 1994-05-17 Misawa Homes Co Ltd 車輌用内装材
JP2003133270A (ja) * 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
JP2005340795A (ja) * 2004-04-28 2005-12-08 Jsr Corp 化学機械研磨パッド、その製造方法及び半導体ウエハの化学機械研磨方法
JP2006159386A (ja) * 2004-12-10 2006-06-22 Toyo Tire & Rubber Co Ltd 研磨パッド

Also Published As

Publication number Publication date
KR101475767B1 (ko) 2014-12-23
JP4971028B2 (ja) 2012-07-11
US20100221984A1 (en) 2010-09-02
US8348724B2 (en) 2013-01-08
TWI475056B (zh) 2015-03-01
KR20100014817A (ko) 2010-02-11
JP2008288316A (ja) 2008-11-27
CN101669195A (zh) 2010-03-10
TW200906926A (en) 2009-02-16
CN101669195B (zh) 2012-05-23

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