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WO2008096574A1 - 電磁結合モジュール付き包装材 - Google Patents

電磁結合モジュール付き包装材 Download PDF

Info

Publication number
WO2008096574A1
WO2008096574A1 PCT/JP2008/050356 JP2008050356W WO2008096574A1 WO 2008096574 A1 WO2008096574 A1 WO 2008096574A1 JP 2008050356 W JP2008050356 W JP 2008050356W WO 2008096574 A1 WO2008096574 A1 WO 2008096574A1
Authority
WO
WIPO (PCT)
Prior art keywords
electromagnetically coupled
packing material
coupled module
chip
radiating body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/050356
Other languages
English (en)
French (fr)
Inventor
Makoto Osamura
Norio Sakai
Noboru Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2008557043A priority Critical patent/JPWO2008096574A1/ja
Publication of WO2008096574A1 publication Critical patent/WO2008096574A1/ja
Priority to US12/536,669 priority patent/US20090305635A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2216—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in interrogator/reader equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2203/00—Decoration means, markings, information elements, contents indicators
    • B65D2203/10—Transponders

Landscapes

  • Wrappers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Details Of Aerials (AREA)

Abstract

　包装材の平坦性を損なうことなく、無線ＩＣチップが外部からの衝撃や環境の変化から保護され、放射体と電磁結合モジュールとの組立てが容易で、放射特性が良好である、ＲＦＩＤシステムに好適な電磁結合モジュール付き包装材を得る。 　ライナー（２１），（２２）と波形の芯材（２３）からなる包装材（２０）であって、互いに電磁界結合する電磁結合モジュール（１）と放射体（２５）とが包装材（２０）の内側に配置されている。電磁結合モジュール（１）は、無線ＩＣチップ（５）と、該チップ（５）が搭載されており、インダクタンス素子を含む共振回路を有する給電回路基板（１０）とで構成されている。放射体（２５）は電磁結合モジュール（１）と電磁界結合して高周波信号を送受信する。
PCT/JP2008/050356 2007-02-06 2008-01-15 電磁結合モジュール付き包装材 Ceased WO2008096574A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008557043A JPWO2008096574A1 (ja) 2007-02-06 2008-01-15 電磁結合モジュール付き包装材
US12/536,669 US20090305635A1 (en) 2007-02-06 2009-08-06 Packaging material with electromagnetic coupling module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-026460 2007-02-06
JP2007026460 2007-02-06

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/536,669 Continuation US20090305635A1 (en) 2007-02-06 2009-08-06 Packaging material with electromagnetic coupling module

Publications (1)

Publication Number Publication Date
WO2008096574A1 true WO2008096574A1 (ja) 2008-08-14

Family

ID=39681485

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050356 Ceased WO2008096574A1 (ja) 2007-02-06 2008-01-15 電磁結合モジュール付き包装材

Country Status (3)

Country Link
US (1) US20090305635A1 (ja)
JP (1) JPWO2008096574A1 (ja)
WO (1) WO2008096574A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2017014151A1 (ja) * 2015-07-21 2017-07-20 株式会社村田製作所 無線通信デバイスおよびそれを備えた物品
US10262252B2 (en) 2015-07-21 2019-04-16 Murata Manufacturing Co., Ltd. Wireless communication device and article equipped with the same
JP2021138038A (ja) * 2020-03-04 2021-09-16 大日本印刷株式会社 Ｒｆタグ付き段ボールおよびｒｆタグ付き段ボールの製造方法

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DE202013102668U1 (de) * 2013-06-20 2013-07-29 Halco Gmbh Möbelplatte mit Kennzeichnung
DE102017122052A1 (de) * 2017-09-22 2019-03-28 Schreiner Group Gmbh & Co. Kg RFID-Etikett mit Schutz der RFID-Funktion
KR101977046B1 (ko) * 2017-11-03 2019-05-10 주식회사 아모텍 안테나 모듈

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2017014151A1 (ja) * 2015-07-21 2017-07-20 株式会社村田製作所 無線通信デバイスおよびそれを備えた物品
US10262252B2 (en) 2015-07-21 2019-04-16 Murata Manufacturing Co., Ltd. Wireless communication device and article equipped with the same
US10726322B2 (en) 2015-07-21 2020-07-28 Murata Manufacturing Co., Ltd. Wireless communication device and article equipped with the same
JP2021138038A (ja) * 2020-03-04 2021-09-16 大日本印刷株式会社 Ｒｆタグ付き段ボールおよびｒｆタグ付き段ボールの製造方法
JP7467990B2 (ja) 2020-03-04 2024-04-16 大日本印刷株式会社 Ｒｆタグ付き段ボールおよびｒｆタグ付き段ボールの製造方法

Also Published As

Publication number Publication date
JPWO2008096574A1 (ja) 2010-05-20
US20090305635A1 (en) 2009-12-10

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